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Author:
Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
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Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author:
Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
Get Book Here
Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author: Safa Kasap
Publisher: Springer
ISBN: 331948933X
Category : Technology & Engineering
Languages : en
Pages : 1537
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Book Description
The second, updated edition of this essential reference book provides a wealth of detail on a wide range of electronic and photonic materials, starting from fundamentals and building up to advanced topics and applications. Its extensive coverage, with clear illustrations and applications, carefully selected chapter sequencing and logical flow, makes it very different from other electronic materials handbooks. It has been written by professionals in the field and instructors who teach the subject at a university or in corporate laboratories. The Springer Handbook of Electronic and Photonic Materials, second edition, includes practical applications used as examples, details of experimental techniques, useful tables that summarize equations, and, most importantly, properties of various materials, as well as an extensive glossary. Along with significant updates to the content and the references, the second edition includes a number of new chapters such as those covering novel materials and selected applications. This handbook is a valuable resource for graduate students, researchers and practicing professionals working in the area of electronic, optoelectronic and photonic materials.
Author: Stergios Logothetidis
Publisher: Elsevier
ISBN: 1782420436
Category : Technology & Engineering
Languages : en
Pages : 483
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Book Description
Organic flexible electronics represent a highly promising technology that will provide increased functionality and the potential to meet future challenges of scalability, flexibility, low power consumption, light weight, and reduced cost. They will find new applications because they can be used with curved surfaces and incorporated in to a number of products that could not support traditional electronics. The book covers device physics, processing and manufacturing technologies, circuits and packaging, metrology and diagnostic tools, architectures, and systems engineering. Part one covers the production, properties and characterisation of flexible organic materials and part two looks at applications for flexible organic devices. - Reviews the properties and production of various flexible organic materials. - Describes the integration technologies of flexible organic electronics and their manufacturing methods. - Looks at the application of flexible organic materials in smart integrated systems and circuits, chemical sensors, microfluidic devices, organic non-volatile memory devices, and printed batteries and other power storage devices.
Author: ASM International. Handbook Committee
Publisher: ASM International
ISBN: 0871702835
Category : Technology & Engineering
Languages : en
Pages : 1313
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Book Description
A comprehensive reference on the properties, selection, processing, and applications of the most widely used nonmetallic engineering materials. Section 1, General Information and Data, contains information applicable both to polymers and to ceramics and glasses. It includes an illustrated glossary, a collection of engineering tables and data, and a guide to materials selection. Sections 2 through 7 focus on polymeric materials--plastics, elastomers, polymer-matrix composites, adhesives, and sealants--with the information largely updated and expanded from the first three volumes of the Engineered Materials Handbook. Ceramics and glasses are covered in Sections 8 through 12, also with updated and expanded information. Annotation copyright by Book News, Inc., Portland, OR
Author: Oksana Ostroverkhova
Publisher: Elsevier
ISBN: 0857098764
Category : Technology & Engineering
Languages : en
Pages : 832
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Book Description
Small molecules and conjugated polymers, the two main types of organic materials used for optoelectronic and photonic devices, can be used in a number of applications including organic light-emitting diodes, photovoltaic devices, photorefractive devices and waveguides. Organic materials are attractive due to their low cost, the possibility of their deposition from solution onto large-area substrates, and the ability to tailor their properties. The Handbook of organic materials for optical and (opto)electronic devices provides an overview of the properties of organic optoelectronic and nonlinear optical materials, and explains how these materials can be used across a range of applications.Parts one and two explore the materials used for organic optoelectronics and nonlinear optics, their properties, and methods of their characterization illustrated by physical studies. Part three moves on to discuss the applications of optoelectronic and nonlinear optical organic materials in devices and includes chapters on organic solar cells, electronic memory devices, and electronic chemical sensors, electro-optic devices.The Handbook of organic materials for optical and (opto)electronic devices is a technical resource for physicists, chemists, electrical engineers and materials scientists involved in research and development of organic semiconductor and nonlinear optical materials and devices. - Comprehensively examines the properties of organic optoelectronic and nonlinear optical materials - Discusses their applications in different devices including solar cells, LEDs and electronic memory devices - An essential technical resource for physicists, chemists, electrical engineers and materials scientists
Author: W. Tillar Shugg
Publisher:
ISBN: 9788172249823
Category :
Languages : en
Pages : 616
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Book Description
Handbook of Electrical and Electronic Insulating Materials provides comprehensive coverage of all commonly used insulating materials. Some of the invaluable features of this book are the hard-to-access chemistry and technology for each material presented; comparative properties and rankings of materials within a product group. This book is designed to save you hours of library research and reading time. Technology, methods of manufacture testing methods, developing programs, and market trends are the aspects covered in the classes of materials.
Author: Glenn R. Blackwell
Publisher: CRC Press
ISBN: 1351835548
Category : Technology & Engineering
Languages : en
Pages : 937
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Book Description
The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
Author: Martin W. Jawitz
Publisher: McGraw Hill Professional
ISBN: 9780070324886
Category : Technology & Engineering
Languages : en
Pages : 792
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Book Description
Select PCB materials for top performing boards. From weaving glass fiber mats to testing finished boards, this materials database offers close-up look at how to process and fabricate PCBs. It gives you hands-on working knowledge of the electrical, mechanical and physical properties of PCB raw materials.
Author: Vannessa Goodship
Publisher: Woodhead Publishing
ISBN: 0081021593
Category : Technology & Engineering
Languages : en
Pages : 740
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Book Description
Waste Electrical and Electronic Equipment (WEEE) Handbook, Second Edition, is a one-stop reference on current electronic waste legislation initiatives, their impact, and the latest technological considerations for reducing electronic waste (e-waste) and increasing the efficiency of materials recovery. It also provides a wide-range of global and corporate examples and perspectives on the challenges that face specific regions and companies, along with the solutions they are implementing in managing e-waste, offering further insights on how discarded products can be treated. Sections introduce the reader to legislation and initiatives to manage WEEE and discuss technologies for the refurbishment, treatment and recycling of waste electronics. Further sections focus on electronic products that present particular challenges for recyclers, explore sustainable design of electronics and supply chains, discuss national and regional WEEE management schemes, and more. - Addresses the latest challenges and opportunities for electronic waste (e-waste) management, including e-waste collection models, circular economy implications, rare earth metal recovery, and much more - Draws lessons for waste electrical and electronic equipment (WEEE) policy and practice from around the world - Discusses legislation and initiatives to manage WEEE, including global e-waste initiatives, EU legislation relating to electronic waste, and eco-efficiency evaluation of WEEE take-back systems
Author: Milton Ohring
Publisher: Academic Press
ISBN: 0080575528
Category : Technology & Engineering
Languages : en
Pages : 759
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Book Description
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
