Author: John T.L. Thong
Publisher: Springer Science & Business Media
ISBN: 1489915222
Category : Science
Languages : en
Pages : 467
Book Description
Although exploratory and developmental activity in electron beam testing (EBT) 25 years, it was not had already been in existence in research laboratories for over until the beginning of the 1980s that it was taken up seriously as a technique for integrated circuit (IC) testing. While ICs were being fabricated on design rules of several microns, the mechanical ne edle probe served quite adequately for internal chip probing. This scenario changed with growing device complexity and shrinking geometries, prompting IC manufacturers to take note ofthis new testing technology. It required several more years and considerable investment by electron beam tester manufacturers, however, to co me up with user-friendly automated systems that were acceptable to IC test engineers. These intervening years witnessed intense activity in the development of instrumentation, testing techniques, and system automation, as evidenced by the proliferation of technical papers presented at conferences. With the shift of interest toward applications, the technology may now be considered as having come of age.
Electron Beam Testing Technology
Author: John T.L. Thong
Publisher: Springer Science & Business Media
ISBN: 1489915222
Category : Science
Languages : en
Pages : 467
Book Description
Although exploratory and developmental activity in electron beam testing (EBT) 25 years, it was not had already been in existence in research laboratories for over until the beginning of the 1980s that it was taken up seriously as a technique for integrated circuit (IC) testing. While ICs were being fabricated on design rules of several microns, the mechanical ne edle probe served quite adequately for internal chip probing. This scenario changed with growing device complexity and shrinking geometries, prompting IC manufacturers to take note ofthis new testing technology. It required several more years and considerable investment by electron beam tester manufacturers, however, to co me up with user-friendly automated systems that were acceptable to IC test engineers. These intervening years witnessed intense activity in the development of instrumentation, testing techniques, and system automation, as evidenced by the proliferation of technical papers presented at conferences. With the shift of interest toward applications, the technology may now be considered as having come of age.
Publisher: Springer Science & Business Media
ISBN: 1489915222
Category : Science
Languages : en
Pages : 467
Book Description
Although exploratory and developmental activity in electron beam testing (EBT) 25 years, it was not had already been in existence in research laboratories for over until the beginning of the 1980s that it was taken up seriously as a technique for integrated circuit (IC) testing. While ICs were being fabricated on design rules of several microns, the mechanical ne edle probe served quite adequately for internal chip probing. This scenario changed with growing device complexity and shrinking geometries, prompting IC manufacturers to take note ofthis new testing technology. It required several more years and considerable investment by electron beam tester manufacturers, however, to co me up with user-friendly automated systems that were acceptable to IC test engineers. These intervening years witnessed intense activity in the development of instrumentation, testing techniques, and system automation, as evidenced by the proliferation of technical papers presented at conferences. With the shift of interest toward applications, the technology may now be considered as having come of age.
Vacuum Electronics
Author: Joseph A. Eichmeier
Publisher: Springer Science & Business Media
ISBN: 3540719296
Category : Technology & Engineering
Languages : en
Pages : 548
Book Description
Nineteen experts from the electronics industry, research institutes and universities have joined forces to prepare this book. It does nothing less than provide a complete overview of the electrophysical fundamentals, the present state of the art and applications, as well as the future prospects of microwave tubes and systems. The book does the same for optoelectronics vacuum devices, electron and ion beam devices, light and X-ray emitters, particle accelerators and vacuum interrupters.
Publisher: Springer Science & Business Media
ISBN: 3540719296
Category : Technology & Engineering
Languages : en
Pages : 548
Book Description
Nineteen experts from the electronics industry, research institutes and universities have joined forces to prepare this book. It does nothing less than provide a complete overview of the electrophysical fundamentals, the present state of the art and applications, as well as the future prospects of microwave tubes and systems. The book does the same for optoelectronics vacuum devices, electron and ion beam devices, light and X-ray emitters, particle accelerators and vacuum interrupters.
Electron Beam Wire Deposition Technology and Its Application
Author: Shuili Gong
Publisher: Springer Nature
ISBN: 9811907595
Category : Technology & Engineering
Languages : en
Pages : 346
Book Description
This book provides a systematic and comprehensive introduction to the technical principles, materials, processes, and equipment of the electron beam wire deposition technology (EBWD), while focusing on the research results of the author’s scientific research team engaged in this technology in China. It mainly introduces the conceptual connotation, principle, and characteristics of the EBWD technology, its position and function in the additive manufacturing technology system, the direction and trend of technological development at home and abroad, the fundamentals and application results of the EBWD technology, including technical principles, equipment technology, special materials, manufacturing technology, quality testing, and application practices. So this book can serve as a reference book for teachers, students, and scientific researchers in scientific research institutions who are engaged in relevant studies.
Publisher: Springer Nature
ISBN: 9811907595
Category : Technology & Engineering
Languages : en
Pages : 346
Book Description
This book provides a systematic and comprehensive introduction to the technical principles, materials, processes, and equipment of the electron beam wire deposition technology (EBWD), while focusing on the research results of the author’s scientific research team engaged in this technology in China. It mainly introduces the conceptual connotation, principle, and characteristics of the EBWD technology, its position and function in the additive manufacturing technology system, the direction and trend of technological development at home and abroad, the fundamentals and application results of the EBWD technology, including technical principles, equipment technology, special materials, manufacturing technology, quality testing, and application practices. So this book can serve as a reference book for teachers, students, and scientific researchers in scientific research institutions who are engaged in relevant studies.
Advanced Nano Deposition Methods
Author: Yuan Lin
Publisher: John Wiley & Sons
ISBN: 3527696458
Category : Technology & Engineering
Languages : en
Pages : 328
Book Description
This concise reference summarizes the latest results in nano-structured thin films, the first to discuss both deposition methods and electronic applications in detail. Following an introduction to this rapidly developing field, the authors present a variety of organic and inorganic materials along with new deposition techniques, and conclude with an overview of applications and considerations for their technology deployment.
Publisher: John Wiley & Sons
ISBN: 3527696458
Category : Technology & Engineering
Languages : en
Pages : 328
Book Description
This concise reference summarizes the latest results in nano-structured thin films, the first to discuss both deposition methods and electronic applications in detail. Following an introduction to this rapidly developing field, the authors present a variety of organic and inorganic materials along with new deposition techniques, and conclude with an overview of applications and considerations for their technology deployment.
Multi-Chip Module Test Strategies
Author: Yervant Zorian
Publisher: Springer Science & Business Media
ISBN: 1461561078
Category : Technology & Engineering
Languages : en
Pages : 161
Book Description
MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).
Publisher: Springer Science & Business Media
ISBN: 1461561078
Category : Technology & Engineering
Languages : en
Pages : 161
Book Description
MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).
ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis
Author: ASM International
Publisher: ASM International
ISBN: 1627082735
Category : Technology & Engineering
Languages : en
Pages : 540
Book Description
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Publisher: ASM International
ISBN: 1627082735
Category : Technology & Engineering
Languages : en
Pages : 540
Book Description
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Electron Beam Welding
Author: H Schultz
Publisher: Elsevier
ISBN: 1845698789
Category : Technology & Engineering
Languages : en
Pages : 245
Book Description
Translated from the German, this is a practical book for engineers which explains the trials, development and manufacturing processes involved in electron beam welding.
Publisher: Elsevier
ISBN: 1845698789
Category : Technology & Engineering
Languages : en
Pages : 245
Book Description
Translated from the German, this is a practical book for engineers which explains the trials, development and manufacturing processes involved in electron beam welding.
Advances in Imaging and Electron Physics
Author: Peter W. Hawkes
Publisher: Elsevier
ISBN: 0080490107
Category : Technology & Engineering
Languages : en
Pages : 605
Book Description
* A special volume devoted principally to therole of the late Sir Charles Oatley in the development of the scanning electron microscopeings* It contains historical articles and reminiscences by most of the scientists who have worked on the scanning electron microscope in Oatley's laboratory * Emphasizes broad and in depth article collaborations between world-renowned scientists in the field of image and electron physicsAlthough the scanning electron microscope had a prehistory in Germany and the USA, its real champion was Charles Oatley, who launched his projectin the Cambridge University Engineering Department shortly after the end of World War II. A first microscope was built successfully by D. McMullan, oneof the Guest Editors of this volume and a succession of progressively improved instruments followed. One in particular, built by K.C.A. Smith was commissioned specially for the Canadian Pulp and Paper Research Institute for use in their Montreal laboratories. All these efforts culminated in the commercial model built by the Cambridge Instrument Company and marketed in 1965 under the trade name, Stereoscan.Although this story has been told on several occasions, in particular in these Advances, it seemed appropriate, in the centenary year of the birth of Sir Charles Oatley, that more details should be published to celebrate these achievements. This volume is the result. It contains not only historical articles and reminiscences by most of the scientists who have worked on the scanning electron microscope in Oatley's laboratory but also full or partial reproductions of many of the key publications, beginning with McMullan's early paper of 1953 and including Oatley's own "Early history of the scanning electron microscope" (1982). A website has been created, in which supplementary material is collected.This volume is a tribute to a bold pioneering scientist and a vivid record of the creation of the first commercial scanning electron microscopes and of subsequent developments. * A special volume devoted principally to therole of the late Sir Charles Oatley in the development of the scanning electron microscopeings* It contains historical articles and reminiscences by most of the scientists who have worked on the scanning electron microscope in Oatley's laboratory* Emphasizes broad and in depth article collaborations between world-renowned scientists in the field of image and electron physics
Publisher: Elsevier
ISBN: 0080490107
Category : Technology & Engineering
Languages : en
Pages : 605
Book Description
* A special volume devoted principally to therole of the late Sir Charles Oatley in the development of the scanning electron microscopeings* It contains historical articles and reminiscences by most of the scientists who have worked on the scanning electron microscope in Oatley's laboratory * Emphasizes broad and in depth article collaborations between world-renowned scientists in the field of image and electron physicsAlthough the scanning electron microscope had a prehistory in Germany and the USA, its real champion was Charles Oatley, who launched his projectin the Cambridge University Engineering Department shortly after the end of World War II. A first microscope was built successfully by D. McMullan, oneof the Guest Editors of this volume and a succession of progressively improved instruments followed. One in particular, built by K.C.A. Smith was commissioned specially for the Canadian Pulp and Paper Research Institute for use in their Montreal laboratories. All these efforts culminated in the commercial model built by the Cambridge Instrument Company and marketed in 1965 under the trade name, Stereoscan.Although this story has been told on several occasions, in particular in these Advances, it seemed appropriate, in the centenary year of the birth of Sir Charles Oatley, that more details should be published to celebrate these achievements. This volume is the result. It contains not only historical articles and reminiscences by most of the scientists who have worked on the scanning electron microscope in Oatley's laboratory but also full or partial reproductions of many of the key publications, beginning with McMullan's early paper of 1953 and including Oatley's own "Early history of the scanning electron microscope" (1982). A website has been created, in which supplementary material is collected.This volume is a tribute to a bold pioneering scientist and a vivid record of the creation of the first commercial scanning electron microscopes and of subsequent developments. * A special volume devoted principally to therole of the late Sir Charles Oatley in the development of the scanning electron microscopeings* It contains historical articles and reminiscences by most of the scientists who have worked on the scanning electron microscope in Oatley's laboratory* Emphasizes broad and in depth article collaborations between world-renowned scientists in the field of image and electron physics
Scientific and Technical Aerospace Reports
Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 426
Book Description
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 426
Book Description
Microelectronic Failure Analysis Desk Reference
Author:
Publisher: ASM International
ISBN: 0871707454
Category : Technology & Engineering
Languages : en
Pages : 162
Book Description
Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee.
Publisher: ASM International
ISBN: 0871707454
Category : Technology & Engineering
Languages : en
Pages : 162
Book Description
Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee.