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Author: Cher Ming Tan
Publisher: Springer Science & Business Media
ISBN: 9814451215
Category : Technology & Engineering
Languages : en
Pages : 111
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Book Description
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.
Author: Cher Ming Tan
Publisher: Springer Science & Business Media
ISBN: 9814451215
Category : Technology & Engineering
Languages : en
Pages : 111
Get Book Here
Book Description
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.
Author: Jens Lienig
Publisher: Springer
ISBN: 3319735586
Category : Technology & Engineering
Languages : en
Pages : 171
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Book Description
The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.
Author: Cher Ming Tan
Publisher: World Scientific
ISBN: 9814273325
Category : Technology & Engineering
Languages : en
Pages : 312
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Book Description
Electromigration in ULSI Interconnections provides a comprehensive description of the electromigration in integrated circuits. It is intended for both beginner and advanced readers on electromigration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electromigration, and examines the various interconnected systems and their evolution employed in integrated circuit technology. The subsequent chapters provide a detailed description of the physics of electromigration in both Al- and Cu-based Interconnections, in the form of theoretical, experimental and numerical modeling studies. The differences in the electromigration of Al- and Cu-based interconnections and the corresponding underlying physical mechanisms for these differences are explained. The test structures, testing methodology, failure analysis methodology and statistical analysis of the test data for the experimental studies on electromigration are presented in a concise and rigorous manner. Methods of numerical modeling for the interconnect electromigration and their applications to the understanding of electromigration physics are described in detail with the aspects of material properties, interconnection design, and interconnect process parameters on the electromigration performances of interconnects in ULSI further elaborated upon. Finally, the extension of the studies to narrow interconnections is introduced, and future challenges on the study of electromigration are outlined and discussed.
Author: Harry Veendrick
Publisher: Springer Nature
ISBN: 303164249X
Category :
Languages : en
Pages : 697
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Book Description
Author: University of Illinois (Urbana-Champaign campus). Engineering Experiment Station
Publisher:
ISBN:
Category : Engineering
Languages : en
Pages : 416
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Book Description
Author: Rob A. Rutenbar
Publisher: John Wiley & Sons
ISBN: 047122782X
Category : Technology & Engineering
Languages : en
Pages : 773
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Book Description
The tools and techniques you need to break the analog design bottleneck! Ten years ago, analog seemed to be a dead-end technology. Today, System-on-Chip (SoC) designs are increasingly mixed-signal designs. With the advent of application-specific integrated circuits (ASIC) technologies that can integrate both analog and digital functions on a single chip, analog has become more crucial than ever to the design process. Today, designers are moving beyond hand-crafted, one-transistor-at-a-time methods. They are using new circuit and physical synthesis tools to design practical analog circuits; new modeling and analysis tools to allow rapid exploration of system level alternatives; and new simulation tools to provide accurate answers for analog circuit behaviors and interactions that were considered impossible to handle only a few years ago. To give circuit designers and CAD professionals a better understanding of the history and the current state of the art in the field, this volume collects in one place the essential set of analog CAD papers that form the foundation of today's new analog design automation tools. Areas covered are: * Analog synthesis * Symbolic analysis * Analog layout * Analog modeling and analysis * Specialized analog simulation * Circuit centering and yield optimization * Circuit testing Computer-Aided Design of Analog Integrated Circuits and Systems is the cutting-edge reference that will be an invaluable resource for every semiconductor circuit designer and CAD professional who hopes to break the analog design bottleneck.
Author: Karim Abbas
Publisher: Springer Nature
ISBN: 3030371956
Category : Technology & Engineering
Languages : en
Pages : 653
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Book Description
This book provides a comprehensive reference for everything that has to do with digital circuits. The author focuses equally on all levels of abstraction. He tells a bottom-up story from the physics level to the finished product level. The aim is to provide a full account of the experience of designing, fabricating, understanding, and testing a microchip. The content is structured to be very accessible and self-contained, allowing readers with diverse backgrounds to read as much or as little of the book as needed. Beyond a basic foundation of mathematics and physics, the book makes no assumptions about prior knowledge. This allows someone new to the field to read the book from the beginning. It also means that someone using the book as a reference will be able to answer their questions without referring to any external sources.
Author: Terry C. Edwards
Publisher: John Wiley & Sons
ISBN: 1118936183
Category : Technology & Engineering
Languages : en
Pages : 688
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Book Description
Building on the success of the previous three editions, Foundations for Microstrip Circuit Design offers extensive new, updated and revised material based upon the latest research. Strongly design-oriented, this fourth edition provides the reader with a fundamental understanding of this fast expanding field making it a definitive source for professional engineers and researchers and an indispensable reference for senior students in electronic engineering. Topics new to this edition: microwave substrates, multilayer transmission line structures, modern EM tools and techniques, microstrip and planar transmision line design, transmission line theory, substrates for planar transmission lines, Vias, wirebonds, 3D integrated interposer structures, computer-aided design, microstrip and power-dependent effects, circuit models, microwave network analysis, microstrip passive elements, and slotline design fundamentals.
Author: Vassilis Paliouras
Publisher: Springer
ISBN: 3540320806
Category : Computers
Languages : en
Pages : 767
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Book Description
Welcome to the proceedings of PATMOS 2005, the 15th in a series of international workshops.PATMOS2005wasorganizedbyIMECwithtechnicalco-sponsorshipfrom the IEEE Circuits and Systems Society. Over the years, PATMOS has evolved into an important European event, where - searchers from both industry and academia discuss and investigate the emerging ch- lenges in future and contemporary applications, design methodologies, and tools - quired for the developmentof upcominggenerationsof integrated circuits and systems. The technical program of PATMOS 2005 contained state-of-the-art technical contri- tions, three invited talks, a special session on hearing-aid design, and an embedded - torial. The technical program focused on timing, performance and power consumption, as well as architectural aspects with particular emphasis on modeling, design, char- terization, analysis and optimization in the nanometer era. The Technical Program Committee, with the assistance of additional expert revi- ers, selected the 74 papers to be presented at PATMOS. The papers were divided into 11 technical sessions and 3 poster sessions. As is always the case with the PATMOS workshops, the review process was anonymous, full papers were required, and several reviews were carried out per paper. Beyond the presentations of the papers, the PATMOS technical program was - riched by a series of speeches offered by world class experts, on important emerging research issues of industrial relevance. Prof. Jan Rabaey, Berkeley, USA, gave a talk on “Traveling the Wild Frontier of Ulta Low-Power Design”, Dr. Sung Bae Park, S- sung, gave a presentation on “DVL (Deep Low Voltage): Circuits and Devices”, Prof.
Author: Aida Todri-Sanial
Publisher: CRC Press
ISBN: 1351830198
Category : Technology & Engineering
Languages : en
Pages : 409
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Book Description
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
