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Author: Yi (Grace) Li
Publisher: Springer Science & Business Media
ISBN: 0387887830
Category : Technology & Engineering
Languages : en
Pages : 445
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Book Description
“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.
Author: Yi (Grace) Li
Publisher: Springer Science & Business Media
ISBN: 0387887830
Category : Technology & Engineering
Languages : en
Pages : 445
Get Book Here
Book Description
“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.
Author: Rajesh Gomatam
Publisher: CRC Press
ISBN: 9004187820
Category : Science
Languages : en
Pages : 436
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Book Description
With all the environmental concerns and constraints today and stricter future regulations, there is a patent need to replace materials noxious to the environment by environmentally-friendly alternatives. Electrically conductive adhesives (ECAs) are one such example. ECAs offer an excellent alternative to lead-solder interconnects for microelectroni
Author: Rajesh Gomatam
Publisher: BRILL
ISBN: 9004165924
Category : Technology & Engineering
Languages : en
Pages : 434
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Book Description
This book is based on two Special Issues of the Journal of Adhesion Science and Technology (JAST vol. 22, no. 8-9 and vol. 22, no. 14) dedicated to the logic of electrically conductive adhesives. The contains a total of 21 papers (reflecting overviews and original research).
Author: James J. Licari
Publisher: William Andrew
ISBN: 1437778909
Category : Technology & Engineering
Languages : en
Pages : 415
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Book Description
Approx.512 pages Approx.512 pages
Author: Guy Rabilloud
Publisher: Institut Francais Du Petrole P
ISBN: 9782710807162
Category : Science
Languages : en
Pages : 0
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Book Description
Please, please don't order this book from State Mutual Book and Periodical Service which lists it in Books in Print for a whopping $680. Editions Technip, a French publisher, has no designated US distributor, and no protection against such skullduggery. The volume reviews the present status of electrically conductive and thermally conductive adhesive technology, primarily for the well established die attach market, but also for the anisotropic adhesive films used to interconnect electronic drivers to liquid crystal display panels, and adhesives which are currently tested to replace soft solders in surface mount technology. Coverage includes applications, market survey, and standards; electrical and thermal conductivities; fillers and resins; properties of uncured and of cured adhesives; thermally-induced stresses; reliability concerns; and current developments. Annotation copyrighted by Book News, Inc., Portland, OR
Author: Bin Su
Publisher:
ISBN:
Category : Adhesives
Languages : en
Pages :
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Book Description
The first part of the dissertation focuses on understanding and modeling the conduction mechanism of conductive adhesives. The contact resistance is measured between silver rods with different coating materials, and the relationship between tunnel resistivity and contact pressure is obtained based on the experimental results. Three dimensional microstructure models and resistor networks are built to simulate electrical conduction in conductive adhesives. The bulk resistivity of conductive adhesives is calculated from the computer-simulated model. The effects of the geometric properties of filler particles, such as size, shape and distribution, on electrical conductivity are studied by the method of factorial design. The second part of the dissertation evaluates the reliability and investigates the failure mechanism of conductive adhesives subjected to fatigue loading, moisture conditioning and drop impacts. In fatigue tests it is found that electrical conduction failure occurs prior to mechanical failure. The experimental data show that electrical fatigue life can be described well by the power law equation. The electrical failure of conductive adhesives in fatigue is due to the impaired epoxy-silver interfacial adhesion. Moisture uptake in conductive adhesives is measured after moisture conditioning and moisture recovery. The fatigue life of conductive adhesives is significantly shortened after moisture conditioning and moisture recovery. The moisture accelerates the debonding of silver flakes from epoxy resin, which results in a reduced fatigue life. Drop tests are performed on test vehicles with conductive adhesive joints. The electrical conduction failure happens at the same time as joint breakage. The drop failure life is found to be correlated with the strain energy caused by the drop impact, and a power law life model is proposed for drop tests. The fracture is found to be interfacial between the conductive adhesive joints and components/substrates. This research provides a comprehensive understanding of the conduction mechanism of conductive adhesives. The computer-simulated modeling approach presents a useful design tool for the conductive adhesive industry. The reliability tests and proposed failure mechanisms are helpful to prevent failure of conductive adhesives in electronic packages. Moreover, the fatigue and impact life models provide tools in product design and failure prediction of conductive adhesives.
Author: M O Alam
Publisher: Elsevier
ISBN: 0857092898
Category : Technology & Engineering
Languages : en
Pages : 279
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Book Description
Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques
Author: Ho-Ming Tong
Publisher: Springer Science & Business Media
ISBN: 1441957685
Category : Technology & Engineering
Languages : en
Pages : 562
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Book Description
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Author: Ephraim Trinidad
Publisher:
ISBN:
Category : Adhesion
Languages : en
Pages : 112
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Book Description
An electrically conductive adhesive (ECA) is a composite material acting as a conductive paste, which consists of a thermoset loaded with conductive fillers (typically silver (Ag)). Many works that focus on this line of research were successful at making strides to improve its main weakness of low electrical conductivity. Most research focused on developing better silver fillers and co-fillers, or utilizing conductive polymers to improve its electrical conductivity, however, most of these works are carried out on small scale. In this work, we aim to produce larger quantities of hybrid ECA to successfully test its properties. Industry is interested in materials with superior physical properties. As such, rheological behavior and mechanical strength were explored as it has been theoretically hinted that incorporation of exfoliated graphene within the composite could impact those factors listed in a positive manner. In the first step of this project, pre-treated sodium dodecyl sulfate (SDS)-decorated graphene's rheological properties were examined. An epoxy resin diglycidylether of bisphenol-A (DGEBA) was the main polymer used for this study: a well-known material that can behave either as a shear-thinning or shear-thickening material depending on the supplier. We showed how composites that contain graphene (Gr) had higher viscosities than ones that contained SDS decorated graphene Gr(s). Not only did we confirm that surfactant was a key factor in the decrease of viscosity, but we also report how Gr and Gr(s) had a special effect that suppresses the intrinsic shear thickening behavior of epoxy resin at weight concentrations (wt%) higher than 0.5 wt%. The results showed that Gr(s) is not only beneficial in terms of improving the conductivity of conventional ECAs, but it also acts as a solid lubricant that decreases the viscosity of the composite paste at higher weight concentrations. In the second step of the project, pre-treated SDS decorated graphene's mechanical properties were examined. In specific, its lap-shear strength (LSS) as well as the effect of residual solvent when present in our hybrid ECA system were studied in order to follow up on the thermal results obtained from a previous study. We showed that our initial suspicion was correct as the LSS did decrease for all of the solvent-assisted formulations that contained Gr(s) ranging from 66 to 84%, however, we were not able to tell whether or not that decrease was caused by lower crosslinking density. Instead, we uncovered another reason for this decrease: bubble formation during the curing step. This suspicion was confirmed qualitatively through light microscopy and quantitatively through optical profilometry, where we present an increase in surface roughness for the solvent-assisted samples. Furthermore, by using SEM, we also confirmed that this bubble formation extends throughout the entire bulk material rather than just at the interface. Lastly, we investigated whether the use of solvent to assist in the mixing process significantly improves the electrical conductivity at a lower weight loading of Ag, and compared the electrical conductivity with that of the products prepared under the same higher weight loading of Ag using a solvent-free mixing method from previous work. Thirdly, we investigated another mechanical property of our hybrid ECAs through indentation tests, where we use Hertizan equations to characterize elastic modulus. Since we learned that the addition of Ag flakes is detrimental to the mechanical strength, we focused on the difference between the elastic moduli for Gr and Gr(s) in a solvent-free environment. In the last step of this project, we explored the use of a liquid-suspended co-filler (instead of carbon filler-based materials) in Poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS): a conductive polymer that is frequently in conductive thin-films. We report that by using PEDOT:PSS as a conductive co-filler into the conventional ECA with 60 wt% of Ag, we observed higher conductivity equivalent to adding an extra 20 wt% of Ag into the system. Furthermore, we report that an increase of PEDOT:PSS in the composite appears to decrease the LSS of the material by 20%.
Author: Daniel Lu
Publisher: Springer
ISBN: 3319450980
Category : Technology & Engineering
Languages : en
Pages : 974
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Book Description
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
