Doping Engineering for Device Fabrication PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download Doping Engineering for Device Fabrication PDF full book. Access full book title Doping Engineering for Device Fabrication by . Download full books in PDF and EPUB format.
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 213
Get Book Here
Book Description
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 213
Get Book Here
Book Description
Author: B. J. Pawlak
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 240
Get Book Here
Book Description
This volume from the 2006 MRS Spring Meeting focuses on fundamental materials science and device research for current transistor technologies. Materials scientists come together with silicon technologists and TCAD researchers and activation technologies for integrated circuits, to discuss current achievements research directions.
Author: B. J. Pawlak
Publisher: Cambridge University Press
ISBN: 9781107408548
Category : Technology & Engineering
Languages : en
Pages : 336
Get Book Here
Book Description
Materials scientists, silicon technologists and TCAD researchers come together in this book to share experimental results and physical models, discuss achievements and challenges, and identify key issues for future research in this field. The volume focuses on many aspects related to doping of semiconductors (Si, SiGe and Ge) for device fabrication, and explores areas for single-gate as well as multi-gate devices with planar and vertical architectures. Surface properties, coverage, bonding saturation and passivation, and annealing ambient are also discussed.
Author: Stanley Middleman
Publisher: McGraw-Hill Companies
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 802
Get Book Here
Book Description
Written primarily for chemical engineering students, the material included in this new text is an extension of upper level chemical engineering courses. Covering a range of processes in semiconductor device fabrication, the authors try to present traditional chemical engineering methodology in a non-traditional context. The text covers such topics as crystal growth and filtration and contains over 300 worked examples and problems.
Author: E. F. Schubert
Publisher: Cambridge University Press
ISBN: 9780521482882
Category : Science
Languages : en
Pages : 628
Get Book Here
Book Description
This book is the first to give a comprehensive review of the theory, fabrication, characterisation, and device applications of abrupt, shallow, and narrow doping profiles in semiconductors. Such doping profiles are a key element in the development of modern semiconductor technology. After an introductory chapter setting out the basic theoretical and experimental concepts involved, the fabrication of abrupt and narrow doping profiles by several different techniques, including epitaxial growth, is discussed. The techniques for characterising doping distributions are then presented, followed by several chapters devoted to the inherent physical properties of narrow doping profiles. The latter part of the book deals with specific devices. The book will be of great interest to graduate students, researchers and engineers in the fields of semiconductor physics and microelectronic engineering.
Author: J. Meese
Publisher: Springer Science & Business Media
ISBN: 1468482491
Category : Technology & Engineering
Languages : en
Pages : 368
Get Book Here
Book Description
This volume contains the invited and contributed papers presented at the Second International Conference on Neutron Transmutation Doping in Semiconductors held April 23-26, 1978 at the University of Missouri-Columbia. The first "testing of the waters" symposium on this subject was organized by John Cleland and Dick Wood of the Solid-State Division of Oak Ridge National Laboratory in April of 1976, just one year after NTD-silicon appeared on the marketplace. Since this first meeting, NTD-silicon has become established as the starting material for the power device industry and reactor irradiations are now measured in tens of tons of material per annum making NTD processing the largest radiation effects technology in the semiconductor industry. Since the first conference at Oak Ridge, new applications and irradiation techniques have developed. Interest in a second con ference and in publishing the proceedings has been extremely high. The second conference at the University of Missouri was attended by 114 persons. Approximately 20% of the attendees came from countries outside the U.S.A. making the conference truly interna tional in scope.
Author: Guangzheng Zuo
Publisher: Linköping University Electronic Press
ISBN: 917685311X
Category :
Languages : en
Pages : 67
Get Book Here
Book Description
Thermoelectric materials can turn temperature differences directly into electricity. To use this to harvest e.g. waste heat with an efficiency that approaches the Carnot efficiency requires a figure of merit ZT larger than 1. Compared with their inorganic counterparts, organic thermoelectrics (OTE) have numerous advantages, such as low cost, large-area compatibility, flexibility, material abundance and an inherently low thermal conductivity. Therefore, organic thermoelectrics are considered by many to be a promising candidate material system to be used in lower cost and higher efficiency thermoelectric energy conversion, despite record ZT values for OTE currently lying around 0.25. A complete organic thermoelectric generator (TEG) normally needs both p-type and n-type materials to form its electric circuit. Molecular doping is an effective way to achieve p- and ntype materials using different dopants, and it is necessary to fundamentally understand the doping mechanism. We developed a simple yet quantitative analytical model and compare it with numerical kinetic Monte Carlo simulations to reveal the nature of the doping effect. The results show the formation of a deep tail in the Gaussian density of states (DOS) resulting from the Coulomb potentials of ionized dopants. It is this deep trap tail that negatively influences the charge carrier mobility with increasing doping concentration. The trends in mobilities and conductivities observed from experiments are in good agreement with the modeling results, for a large range of materials and doping concentrations. Having a high power factor PF is necessary for efficient TEG. We demonstrate that the doping method can heavily impact the thermoelectric properties of OTE. In comparison to conventional bulk doping, sequential doping can achieve higher conductivity by preserving the morphology, such that the power factor can improve over 100 times. To achieve TEG with high output power, not only a high PF is needed, but also having a significant active layer thickness is very important. We demonstrate a simple way to fabricate multi-layer devices by sequential doping without significantly sacrificing PF. In addition to the application discussed above, harvesting large amounts of heat at maximum efficiency, organic thermoelectrics may also find use in low-power applications like autonomous sensors where voltage is more important than power. A large output voltage requires a high Seebeck coefficient. We demonstrate that density of states (DOS) engineering is an effective tool to increase the Seebeck coefficient by tailoring the positions of the Fermi energy and the transport energy in n- and p-type doped blends of conjugated polymers and small molecules. In general, morphology heavily impacts the performance of organic electronic devices based on mixtures of two (or more) materials, and organic thermoelectrics are no exception. We experimentally find that the charge and energy transport is distinctly different in well-mixed and phase separated morphologies, which we interpreted in terms of a variable range hopping model. The experimentally observed trends in conductivity and Seebeck coefficient are reproduced by kinetic Monte Carlo simulations in which the morphology is accounted for.
Author: Mikhail Efimovich Levinshteĭn
Publisher: Wiley-Interscience
ISBN:
Category : Science
Languages : en
Pages : 272
Get Book Here
Book Description
Drawing on decades of Russian semiconductor research, this remarkable book makes available a great many Si and III-V semiconductor technologies that are practically unknown in the West. Often simpler and cheaper than conventional Western methods, these approaches will enable researchers to improve the quality of semiconductor materials and fabricate new types of devices. After a general introduction to semiconductor technology, the book describes transmutation doping, which offers all the advantages of neutron doping, permits controlled doping depth from 0.1 micron to 1mm, and offers the option of forming deep channels. Also presented is a novel technique using polymer spinon diffusant films for a uniform and reproducible introduction of impurities into silicon. Simpler and less expensive, too, are the reproducible processes using rare-earth elements in the synthesis of various III-V compounds. The parameters of monocrystals and epilayers grown with these elements are equal to those obtained by more complicated and expensive techniques, such as MBE and MOVPE. This invaluable manual explains the processes and advantages of generation-relaxation of nonequilibrium intrinsic defects in Si and introduces new ideas related to the role these defects may play in the formation of the generation-recombination centers in silicon. Also described in these chapters are many original techniques for external and intrinsic gettering in different semiconductors. Important experimental results dealing with isovalent doping of direct gap III-V compounds grown by different epitaxial methods are presented in detail by leading experts. These researchers also show how to achieve precise control of material properties for all principal methods of epitaxial growth. The final section describes nontraditional techniques for photochemical etching and the production of holographic diffraction grating by means of maskless chemical etching. This technique offers the highest resolution and can be applied to more than 20 semiconductor materials, including single crystal, polycrystalline, and amorphous materials. Researchers and graduate students in solid state physics, device physics, materials science, and electrical engineering will find a wealth of original, stimulating, and valuable information in this unique manual. New, more effective techniques for semiconductor processing and fabrication The product of decades of Russian research in semiconductor technology, this invaluable book offers Western researchers and engineers a wide range of new techniques, recipes, and characterization methods that provide simpler, cheaper, and more effective solutions to problems in semiconductor processing and fabrication. Many of these approaches appear here for the first time in Western technological literature. Included are: * Transmutation doping of semiconductors by charged particles * Polymer diffusants in semiconductor technology * Rare-earth elements in III-V compounds * Intrinsic point defect engineering in silicon high-voltage power device technology * Isovalent impurity doping of direct-gap III-V semiconductor layers * Surface passivation of III-V compounds by inorganic dielectrics and polymides * Precision profiling of semiconductor surfaces by means of photochemical etching
Author: D. R. Meyers
Publisher:
ISBN:
Category : Neutron irradiation
Languages : en
Pages : 40
Get Book Here
Book Description
Author: Materials Research Society. Meeting Symposium E.
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 344
Get Book Here
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
