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Author: D.J. Stephenson
Publisher: Springer Science & Business Media
ISBN: 9401136742
Category : Technology & Engineering
Languages : en
Pages : 326
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Book Description
There is currently great interest in the process of diffusion bonding. The main thrust has been in the joining of advanced materials such as superplastic alloys, metal matrix composites and ceramics and, most importantly, to introduce the process into mass-production operations. Diffusion bonding has also led to reduced manufacturing costs and weight savings in conventional materials and developments in hot isostatic pressing have allowed greater design flexibility. Since the first conference on Diffusion Bonding, held at Cranfield in 1987, considerable advances have been made and it was therefore considered appropriate to organise the Second International Conference on Diffusion Bonding which was held at Cranfield Institute of Technology on 28 and 29 March 1990. The meeting provided a forum for the presentation and discussion of recent developments in Diffusion Bonding and was divided into four main subject areas: steel bonding and quality control, diffusion bonding of aluminium alloys, bonding of high temperature materials and general applications. This structure is retained in the proceedings. DAVID STEPHENSON vii CONTENTS v Preface ......................... .
Author: D.J. Stephenson
Publisher: Springer Science & Business Media
ISBN: 9401136742
Category : Technology & Engineering
Languages : en
Pages : 326
Get Book Here
Book Description
There is currently great interest in the process of diffusion bonding. The main thrust has been in the joining of advanced materials such as superplastic alloys, metal matrix composites and ceramics and, most importantly, to introduce the process into mass-production operations. Diffusion bonding has also led to reduced manufacturing costs and weight savings in conventional materials and developments in hot isostatic pressing have allowed greater design flexibility. Since the first conference on Diffusion Bonding, held at Cranfield in 1987, considerable advances have been made and it was therefore considered appropriate to organise the Second International Conference on Diffusion Bonding which was held at Cranfield Institute of Technology on 28 and 29 March 1990. The meeting provided a forum for the presentation and discussion of recent developments in Diffusion Bonding and was divided into four main subject areas: steel bonding and quality control, diffusion bonding of aluminium alloys, bonding of high temperature materials and general applications. This structure is retained in the proceedings. DAVID STEPHENSON vii CONTENTS v Preface ......................... .
Author: N.F. Kazakov
Publisher: Elsevier
ISBN: 1483150550
Category : Technology & Engineering
Languages : en
Pages : 305
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Book Description
Diffusion Beading of Materials is an attempt to pool the experience in vacuum diffusion bonding accumulated by a number of mechanical engineering works, research establishments, and colleges. The book discusses the principal bonding variables and recommended procedures for diffusion bonding in vacuum; the equipment for diffusion bonding and production rate; and the mechanization and automation of equipment. The text also describes the diffusion bonding of steels; the bonding of cast iron and cast iron to steel; and the bonding of dissimilar metals and alloys. The bonding of refractory and active metals and their alloys; the bonding of high-temperature alloys, nickel and nickel alloys; and the bonding of cemented carbides and of a cemented carbide to steel are also considered. The book further tackles the repair and reconditioning by diffusion bonding; the bonding of porous materials; and diffusion metallurgy. The text also encompasses nonmetals and their joining to metals; quality control of diffusion-bonded joints; accident prevention; and cleanliness in vacuum diffusion bonding.
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Author: Yōichi Ishida
Publisher: Elsevier Publishing Company
ISBN:
Category : Science
Languages : en
Pages : 540
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Book Description
Author: Masayoshi Esashi
Publisher: John Wiley & Sons
ISBN: 3527346473
Category : Technology & Engineering
Languages : en
Pages : 44
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Book Description
3D and Circuit Integration of MEMS Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
Author: The Minerals, Metals & Materials Society
Publisher: Springer Nature
ISBN: 3030362965
Category : Technology & Engineering
Languages : en
Pages : 2046
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Book Description
This collection presents papers from the 149th Annual Meeting & Exhibition of The Minerals, Metals & Materials Society.
Author: Zhiqiang Li
Publisher: Springer Nature
ISBN: 9819939097
Category : Technology & Engineering
Languages : en
Pages : 289
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Book Description
This book provides a comprehensive illustration to the superplastic forming/diffusion bonding (SPF/DB) technology developed over decades of research on titanium alloys, process modeling, and its application. SPF/DB technology plays key roles in building aviation components with complicated structures, with highly beneficial effects when well designed. With the ever-increasing demand on components with multiple layers, there is an urgent need for an updated assessment of traditional and modern SPF/DB processing methods. Success critically depends on making the most practical and effective choice of SPF/DB method for a given application. The book introduces titanium and titanium alloys, SPF/DB processing and its modeling, and applications for building typical single or multiple layer(s) structures. Particular attention is paid to illustrating the microstructure evolution during SPF/DB processes. The information for making technical decisions about optimal choice of measurement and evaluation methods is also given in the book. Each chapter follows a focused and pragmatic format. Fully illustrated throughout, the book presents the state of the art in SPF/DB technology in a manner that makes it useful for engineers to improve the established forming processes and quality of components. This book is an essential reading material for industrial practitioners, academic researchers and postgraduates.
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Category : Diffusion bonding (Metals)
Languages : en
Pages : 40
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Author: G. F. Blank
Publisher:
ISBN:
Category :
Languages : en
Pages : 212
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Author: R. A. Wolfe
Publisher:
ISBN:
Category : Diffusion bonding (Metals)
Languages : en
Pages : 120
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Book Description
