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Languages : en
Pages : 80
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Book Description
Under the support of this contract, we have been successful in mitigating the current collapse that is found in nitride based high electron mobility transistors (HEMTs) that is responsible for low power performance from these devices. We have successfully and repeatedly grown oxide material that, along with surface cleaning recipes, reduce the surface states and reduce the device-device surface leakage. As part of the recipe development we have studied fundamental characteristics of the native oxides on GaN and AlGaN surfaces using XPS and compared the results to oxides generated by exposure to UV ozone, We have developed a lattice matched oxide, magnesium calcium oxide (M8CaO), and deposition recipe that provides for the lowest level of surface traps and thus the highest level of surface passivation. Along with this oxide, we have shown that a thin layer of scandium oxide (Sc203), approximately Sam thick, is sufficient for protection of environmental degradation of the MgCaO in environments of 100% humidity and elevated temperatures. This oxide/nitride interface is also able to withstand the processing temperatures of the nitride based HEMTs.
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 80
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Book Description
Under the support of this contract, we have been successful in mitigating the current collapse that is found in nitride based high electron mobility transistors (HEMTs) that is responsible for low power performance from these devices. We have successfully and repeatedly grown oxide material that, along with surface cleaning recipes, reduce the surface states and reduce the device-device surface leakage. As part of the recipe development we have studied fundamental characteristics of the native oxides on GaN and AlGaN surfaces using XPS and compared the results to oxides generated by exposure to UV ozone, We have developed a lattice matched oxide, magnesium calcium oxide (M8CaO), and deposition recipe that provides for the lowest level of surface traps and thus the highest level of surface passivation. Along with this oxide, we have shown that a thin layer of scandium oxide (Sc203), approximately Sam thick, is sufficient for protection of environmental degradation of the MgCaO in environments of 100% humidity and elevated temperatures. This oxide/nitride interface is also able to withstand the processing temperatures of the nitride based HEMTs.
Author: Minh-Trang Teresa Ha
Publisher:
ISBN:
Category :
Languages : en
Pages : 43
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Book Description
AlGaN/GaN HEMTs are the most promising high power switching devices. The material properties of III-nitrides are exceptionally better than that of Si and GaAs. GaN-based devices have been recorded to have higher operating temperatures and higher breakdown field due to the wide bandgap. AlGaN/GaN heterostructures forms 2DEG without doping due to the spontaneous polarization. The performance and reliability of AlGaN/GaN HEMTs are dependent on the structure of the AlGaN/GaN heterostructures. Surface passivation has been proven to improve the 2DEG conductivity and device performance. 20 nm of plasma-enhanced chemical vapor deposition (PECVD) SiN was deposited on AlGaN/GaN HEMTs, and the PECVD SiN passivated sample demonstrated higher carrier concentration of 9.88 ? 1012 cm-2 compared to the un-passivated sample, 8.08 ? 1012 cm-2. High temperature annealing is an important processing step in the fabrication of the devices, and the effects have shown to improve the DC and RF performance. High temperature annealing may affect the structure and the 2DEG conductivity. The annealing effects modifies the AlGaN layer and the AlGaN/GaN interface. Herein, we present the a study on the thermal stability of the PECVD SiN passivation layer on AlGaN/GaN HEMT structures at high temperature anneals. High-resolution x-ray diffraction (HRXRD) measurements were used to investigate the strain of AlGaN layer, and Hall measurements were used to investigate the 2DEG conductivity. PECVD SiN passivated and un-passivated AGaN/GaN HEMTs structure underwent high temperature thermal anneals for 30 minutes in N2. The starting temperature of the annealing is 400?C with step of 50?C until degradation. Degradation was determined through Hall sheet resistivity and mobility measurements. The ending annealed temperature is 1000 ?C and 700 ?C for passivated and control samples, respectively. From no anneal to degradation temperature, the 2DEG conductivity dropped by 15% and 34% for passivated and un-passivated samples, respectively. The HRXRD measurements found the change in-plane strain of the AlGaN layer after high temperature anneals. Higher in-plane strain showed higher 2DEG conductivity. In-plane strain from no anneal to degradation temperature dropped from 2% and 7% for passivated and un-passivated samples, respectively. Therefore, the passivated sample demonstrated to be more stable at high temperatures. The SiN passivation layer adds tensile stress to the AlGaN layer thus increased the piezoelectric effect and 2DEG conductivity.
Author: Maurizio Di Paolo Emilio
Publisher: Springer Nature
ISBN: 3031632389
Category :
Languages : en
Pages : 388
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Author:
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ISBN:
Category :
Languages : en
Pages : 0
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Book Description
This award provided funding to purchase a new metal organic chemical vapor deposition (MOCVD) system for growth of GaN-based materials and devices. By combining the money provided by the DURIP award with donations from industry and matching funds from the University of Florida, an epitaxial facility worth $1 M has been constructed. This facility will be used to provide device structures for fabrication of high power GaN-based HEMTs and MOSFETs. This facility will benefit multiple DOD programs including two currently funded by the electronics programs at the U.S. Office of Naval Research (Development Of GaN MOSFETS And MISFETS, US Navy NOOOl4-98-l-0204, Dr. Harry Dietrich) and the U.S. Air Force Office of Scientific Research (Development Of Passivation Technology For Improved GaN/AlGaN HEMT Performance And Reliability, U.S. Air Force F4962O-O2-l-0366, Dr. Gerald Witt). These contracts are aimed at developing improved dielectrics for high power GaN devices and to date have produced significant advances in the quality and effectiveness of dielectric/GaN interfaces. Because of this award, we can now capitalize on the successful oxide development generated by these programs. This equipment will provide a controlled in-house supply of GaN/AlGaN device material in order to identify much more precisely the role of a variety of material parameters as well as device layer structure in the performance of devices containing oxide/nitride interfaces. Acquisition of this system will also enable new avenues of investigation including resistance to thermal, electrical and radiation degradation for both all-nitride and nitride/oxide devices. Finally, acquisition of this MOCVD system will now allow development of a well controlled in-house device technology of the type needed to fabricate more advanced structures and prototypes including ultra-broadband high power and high dynamic range direct- conversion RF transmitters and high temperature III-nitride based gas sensors.
Author: Yue Hao
Publisher: CRC Press
ISBN: 1315351838
Category : Computers
Languages : en
Pages : 325
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Book Description
This book systematically introduces physical characteristics and implementations of III-nitride wide bandgap semiconductor materials and electronic devices, with an emphasis on high-electron-mobility transistors (HEMTs). The properties of nitride semiconductors make the material very suitable for electronic devices used in microwave power amplification, high-voltage switches, and high-speed digital integrated circuits.
Author: D. Nirmal
Publisher: CRC Press
ISBN: 0429862520
Category : Science
Languages : en
Pages : 434
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Book Description
This book focusses on III-V high electron mobility transistors (HEMTs) including basic physics, material used, fabrications details, modeling, simulation, and other important aspects. It initiates by describing principle of operation, material systems and material technologies followed by description of the structure, I-V characteristics, modeling of DC and RF parameters of AlGaN/GaN HEMTs. The book also provides information about source/drain engineering, gate engineering and channel engineering techniques used to improve the DC-RF and breakdown performance of HEMTs. Finally, the book also highlights the importance of metal oxide semiconductor high electron mobility transistors (MOS-HEMT). Key Features Combines III-As/P/N HEMTs with reliability and current status in single volume Includes AC/DC modelling and (sub)millimeter wave devices with reliability analysis Covers all theoretical and experimental aspects of HEMTs Discusses AlGaN/GaN transistors Presents DC, RF and breakdown characteristics of HEMTs on various material systems using graphs and plots
Author: Matteo Meneghini
Publisher: Springer
ISBN: 3319431994
Category : Technology & Engineering
Languages : en
Pages : 383
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Book Description
This book presents the first comprehensive overview of the properties and fabrication methods of GaN-based power transistors, with contributions from the most active research groups in the field. It describes how gallium nitride has emerged as an excellent material for the fabrication of power transistors; thanks to the high energy gap, high breakdown field, and saturation velocity of GaN, these devices can reach breakdown voltages beyond the kV range, and very high switching frequencies, thus being suitable for application in power conversion systems. Based on GaN, switching-mode power converters with efficiency in excess of 99 % have been already demonstrated, thus clearing the way for massive adoption of GaN transistors in the power conversion market. This is expected to have important advantages at both the environmental and economic level, since power conversion losses account for 10 % of global electricity consumption. The first part of the book describes the properties and advantages of gallium nitride compared to conventional semiconductor materials. The second part of the book describes the techniques used for device fabrication, and the methods for GaN-on-Silicon mass production. Specific attention is paid to the three most advanced device structures: lateral transistors, vertical power devices, and nanowire-based HEMTs. Other relevant topics covered by the book are the strategies for normally-off operation, and the problems related to device reliability. The last chapter reviews the switching characteristics of GaN HEMTs based on a systems level approach. This book is a unique reference for people working in the materials, device and power electronics fields; it provides interdisciplinary information on material growth, device fabrication, reliability issues and circuit-level switching investigation.
Author: Krzysztof Iniewski
Publisher: CRC Press
ISBN: 143984836X
Category : Technology & Engineering
Languages : en
Pages : 600
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Book Description
With contributions from top international experts from both industry and academia, Nano-Semiconductors: Devices and Technology is a must-read for anyone with a serious interest in future nanofabrication technologies. Taking into account the semiconductor industry’s transition from standard CMOS silicon to novel device structures—including carbon nanotubes (CNT), graphene, quantum dots, and III-V materials—this book addresses the state of the art in nano devices for electronics. It provides an all-encompassing, one-stop resource on the materials and device structures involved in the evolution from micro- to nanoelectronics. The book is divided into three parts that address: Semiconductor materials (i.e., carbon nanotubes, memristors, and spin organic devices) Silicon devices and technology (i.e., BiCMOS, SOI, various 3D integration and RAM technologies, and solar cells) Compound semiconductor devices and technology This reference explores the groundbreaking opportunities in emerging materials that will take system performance beyond the capabilities of traditional CMOS-based microelectronics. Contributors cover topics ranging from electrical propagation on CNT to GaN HEMTs technology and applications. Approaching the trillion-dollar nanotech industry from the perspective of real market needs and the repercussions of technological barriers, this resource provides vital information about elemental device architecture alternatives that will lead to massive strides in future development.
Author: Farid Medjdoub
Publisher: CRC Press
ISBN: 1482220040
Category : Technology & Engineering
Languages : en
Pages : 372
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Book Description
Addresses a Growing Need for High-Power and High-Frequency Transistors Gallium Nitride (GaN): Physics, Devices, and Technology offers a balanced perspective on the state of the art in gallium nitride technology. A semiconductor commonly used in bright light-emitting diodes, GaN can serve as a great alternative to existing devices used in microelectronics. It has a wide band gap and high electron mobility that gives it special properties for applications in optoelectronic, high-power, and high-frequency devices, and because of its high off-state breakdown strength combined with excellent on-state channel conductivity, GaN is an ideal candidate for switching power transistors. Explores Recent Progress in High-Frequency GaN Technology Written by a panel of academic and industry experts from around the globe, this book reviews the advantages of GaN-based material systems suitable for high-frequency, high-power applications. It provides an overview of the semiconductor environment, outlines the fundamental device physics of GaN, and describes GaN materials and device structures that are needed for the next stage of microelectronics and optoelectronics. The book details the development of radio frequency (RF) semiconductor devices and circuits, considers the current challenges that the industry now faces, and examines future trends. In addition, the authors: Propose a design in which multiple LED stacks can be connected in a series using interband tunnel junction (TJ) interconnects Examine GaN technology while in its early stages of high-volume deployment in commercial and military products Consider the potential use of both sunlight and hydrogen as promising and prominent energy sources for this technology Introduce two unique methods, PEC oxidation and vapor cooling condensation methods, for the deposition of high-quality oxide layers A single-source reference for students and professionals, Gallium Nitride (GaN): Physics, Devices, and Technology provides an overall assessment of the semiconductor environment, discusses the potential use of GaN-based technology for RF semiconductor devices, and highlights the current and emerging applications of GaN.
Author: Farid Medjdoub
Publisher: MDPI
ISBN: 3036505660
Category : Technology & Engineering
Languages : en
Pages : 242
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Book Description
Emerging wide bandgap (WBG) semiconductors hold the potential to advance the global industry in the same way that, more than 50 years ago, the invention of the silicon (Si) chip enabled the modern computer era. SiC- and GaN-based devices are starting to become more commercially available. Smaller, faster, and more efficient than their counterpart Si-based components, these WBG devices also offer greater expected reliability in tougher operating conditions. Furthermore, in this frame, a new class of microelectronic-grade semiconducting materials that have an even larger bandgap than the previously established wide bandgap semiconductors, such as GaN and SiC, have been created, and are thus referred to as “ultra-wide bandgap” materials. These materials, which include AlGaN, AlN, diamond, Ga2O3, and BN, offer theoretically superior properties, including a higher critical breakdown field, higher temperature operation, and potentially higher radiation tolerance. These attributes, in turn, make it possible to use revolutionary new devices for extreme environments, such as high-efficiency power transistors, because of the improved Baliga figure of merit, ultra-high voltage pulsed power switches, high-efficiency UV-LEDs, and electronics. This Special Issue aims to collect high quality research papers, short communications, and review articles that focus on wide bandgap device design, fabrication, and advanced characterization. The Special Issue will also publish selected papers from the 43rd Workshop on Compound Semiconductor Devices and Integrated Circuits, held in France (WOCSDICE 2019), which brings together scientists and engineers working in the area of III–V, and other compound semiconductor devices and integrated circuits. In particular, the following topics are addressed: – GaN- and SiC-based devices for power and optoelectronic applications – Ga2O3 substrate development, and Ga2O3 thin film growth, doping, and devices – AlN-based emerging material and devices – BN epitaxial growth, characterization, and devices
