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Author: Xiaoming Tao
Publisher: Springer
ISBN: 9789814451444
Category : Technology & Engineering
Languages : en
Pages : 0
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Book Description
The “Handbook of Smart Textiles” aims to provide a comprehensive overview in the field of smart textile describing the state of the art in the research sector as well as the well-established techniques applied in industries. The handbook is planned to cover from fundamental theories, experimental techniques, characterization methods, as well as real applications with successful commercialized examples. The book is structured in a way in which it is appropriate for graduate students, PhD candidates, and professionals in diverse scientific and engineering communities devoted to relevant fields, including textile engineering, chemistry, bioengineering, material engineering, mechanical engineering, electrical engineering. The book will also provide a solid reference for industrial players who look for innovative technologies as well as environmental, safety concerns for the development of smart textile related products.
Author: Ravinder S. Dahiya
Publisher: Springer Science & Business Media
ISBN: 9400705794
Category : Technology & Engineering
Languages : en
Pages : 258
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Book Description
Future robots are expected to work closely and interact safely with real-world objects and humans alike. Sense of touch is important in this context, as it helps estimate properties such as shape, texture, hardness, material type and many more; provides action related information, such as slip detection; and helps carrying out actions such as rolling an object between fingers without dropping it. This book presents an in-depth description of the solutions available for gathering tactile data, obtaining aforementioned tactile information from the data and effectively using the same in various robotic tasks. The efforts during last four decades or so have yielded a wide spectrum of tactile sensing technologies and engineered solutions for both intrinsic and extrinsic touch sensors. Nowadays, new materials and structures are being explored for obtaining robotic skin with physical features like bendable, conformable, and stretchable. Such features are important for covering various body parts of robots or 3D surfaces. Nonetheless, there exist many more hardware, software and application related issues that must be considered to make tactile sensing an effective component of future robotic platforms. This book presents an in-depth analysis of various system related issues and presents the trade-offs one may face while developing an effective tactile sensing system. For this purpose, human touch sensing has also been explored. The design hints coming out of the investigations into human sense of touch can be useful in improving the effectiveness of tactile sensory modality in robotics and other machines. Better integration of tactile sensors on a robot’s body is prerequisite for the effective utilization of tactile data. The concept of semiconductor devices based sensors is an interesting one, as it allows compact and fast tactile sensing systems with capabilities such as human-like spatio-temporal resolution. This book presents a comprehensive description of semiconductor devices based tactile sensing. In particular, novel Piezo Oxide Semiconductor Field Effect Transistor (POSFET) based approach for high resolution tactile sensing has been discussed in detail. Finally, the extension of semiconductors devices based sensors concept to large and flexile areas has been discussed for obtaining robotic or electronic skin. With its multidisciplinary scope, this book is suitable for graduate students and researchers coming from diverse areas such robotics (bio-robots, humanoids, rehabilitation etc.), applied materials, humans touch sensing, electronics, microsystems, and instrumentation. To better explain the concepts the text is supported by large number of figures.
Author: Jacob Breslow
Publisher: U of Minnesota Press
ISBN: 1452962022
Category : Social Science
Languages : en
Pages : 293
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Book Description
Explores childhood in relation to blackness, transfeminism, queerness, and deportability to interrogate what “the child” makes possible The concept of childhood contains many contested and ambivalent meanings that have extraordinary implications, particularly for those staking their claim for belonging and justice on the wish for inclusion within it. In Ambivalent Childhoods, Jacob Breslow examines contemporary U.S. social justice movements (including Black Lives Matter, transfeminism, queer youth activism, and antideportation movements) to discover and reveal how childhood operates within and against them. Ambivalent Childhoods brings together critical race, trans, feminist, queer, critical migration, and psychoanalytic theories to explore the role of childhood in shaping and challenging the disposability of young black life, the steadfastness of the gender binary, the queer life of children’s desires, and the precarious status of migrants. Through an engagement with“the psychic life of the child” that combines theoretical discussions of childhood, blackness, transfeminism, and deportability with critical readings of films, narrative, images, and social justice movements, Breslow demonstrates how childhood requires sustained attention as a complex and ambivalent site for contesting the workings of power, not only for the young. Ambivalent Childhoods is a forward-thinking and intersectional analysis of how childhood affects activism, national belonging, and the violence directed against queer, trans, and racialized people.
Author: Vikas Choudhary
Publisher: CRC Press
ISBN: 1466515821
Category : Medical
Languages : en
Pages : 478
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Book Description
The microelectromechanical systems (MEMS) industry has experienced explosive growth over the last decade. Applications range from accelerometers and gyroscopes used in automotive safety to high-precision on-chip integrated oscillators for reference generation and mobile phones. MEMS: Fundamental Technology and Applications brings together groundbreaking research in MEMS technology and explores an eclectic set of novel applications enabled by the technology. The book features contributions by top experts from industry and academia from around the world. The contributors explain the theoretical background and supply practical insights on applying the technology. From the historical evolution of nano micro systems to recent trends, they delve into topics including: Thin-film integrated passives as an alternative to discrete passives The possibility of piezoelectric MEMS Solutions for MEMS gyroscopes Advanced interconnect technologies Ambient energy harvesting Bulk acoustic wave resonators Ultrasonic receiver arrays using MEMS sensors Optical MEMS-based spectrometers The integration of MEMS resonators with conventional circuitry A wearable inertial and magnetic MEMS sensor assembly to estimate rigid body movement patterns Wireless microactuators to enable implantable MEMS devices for drug delivery MEMS technologies for tactile sensing and actuation in robotics MEMS-based micro hot-plate devices Inertial measurement units with integrated wireless circuitry to enable convenient, continuous monitoring Sensors using passive acousto-electric devices in wired and wireless systems Throughout, the contributors identify challenges and pose questions that need to be resolved, paving the way for new applications. Offering a wide view of the MEMS landscape, this is an invaluable resource for anyone working to develop and commercialize MEMS applications.
Author: IEEE Staff
Publisher:
ISBN: 9781665409124
Category :
Languages : en
Pages :
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Book Description
The major areas of activity in the development of MEMS and NEMS solicited and expected at this conference include but are not limited to materials, design, simulation, fabrication, assembly, packaging, experimental verification and analysis of micro and nanocomponents
Author: Maurizio Valle
Publisher: MDPI
ISBN: 3039365010
Category : Technology & Engineering
Languages : en
Pages : 136
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Book Description
Tactile sensors are basically distributed sensors which translate mechanical and physical variables and pain stimuli into electrical variables. Contact information is further processed and conveyed to a supervising system. Tactile arrays ought to be mechanically flexible (i.e., conformable to the object it is applied to) and stretchable and tactile information decoding must be implemented in real time. The development of artificial tactile sensing is a big challenge as it involves numerous research areas. Application domains include humanoid and industrial robotics, prosthetics, biomedical instrumentation, health care, cyber physical systems, virtual reality, arts, to name but a few. Recent and relevant achievements in materials and transducers have not yet successfully boosted system developments due to the challenging gaps which still need to be filled at many levels, e.g. data decoding and processing, miniaturization, mechanical compliance, robustness, among others. Tactile sensing has developed rapidly over the past three decades, but has yet to achieve high impact breakthroughs in application domains. In this Special Issue, we focus on both insights and advancements in tactile sensing with the goal of bridging different research areas, e.g., material science, electronics, robotics, neuroscience, mechanics, sensors, MEMS/NEMS, addictive and 3D manufacturing, bio and neuro-engineering.
Author: Xiaoming Tao
Publisher: Springer
ISBN: 9789814451444
Category : Technology & Engineering
Languages : en
Pages : 0
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Book Description
The “Handbook of Smart Textiles” aims to provide a comprehensive overview in the field of smart textile describing the state of the art in the research sector as well as the well-established techniques applied in industries. The handbook is planned to cover from fundamental theories, experimental techniques, characterization methods, as well as real applications with successful commercialized examples. The book is structured in a way in which it is appropriate for graduate students, PhD candidates, and professionals in diverse scientific and engineering communities devoted to relevant fields, including textile engineering, chemistry, bioengineering, material engineering, mechanical engineering, electrical engineering. The book will also provide a solid reference for industrial players who look for innovative technologies as well as environmental, safety concerns for the development of smart textile related products.
Author: Shekhar Bhansali
Publisher: Elsevier
ISBN: 0857096273
Category : Technology & Engineering
Languages : en
Pages : 511
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Book Description
The application of Micro Electro Mechanical Systems (MEMS) in the biomedical field is leading to a new generation of medical devices. MEMS for biomedical applications reviews the wealth of recent research on fabrication technologies and applications of this exciting technology.The book is divided into four parts: Part one introduces the fundamentals of MEMS for biomedical applications, exploring the microfabrication of polymers and reviewing sensor and actuator mechanisms. Part two describes applications of MEMS for biomedical sensing and diagnostic applications. MEMS for in vivo sensing and electrical impedance spectroscopy are investigated, along with ultrasonic transducers, and lab-on-chip devices. MEMS for tissue engineering and clinical applications are the focus of part three, which considers cell culture and tissue scaffolding devices, BioMEMS for drug delivery and minimally invasive medical procedures. Finally, part four reviews emerging biomedical applications of MEMS, from implantable neuroprobes and ocular implants to cellular microinjection and hybrid MEMS.With its distinguished editors and international team of expert contributors, MEMS for biomedical applications provides an authoritative review for scientists and manufacturers involved in the design and development of medical devices as well as clinicians using this important technology. - Reviews the wealth of recent research on fabrication technologies and applications of Micro Electro Mechanical Systems (MEMS) in the biomedical field - Introduces the fundamentals of MEMS for biomedical applications, exploring the microfabrication of polymers and reviewing sensor and actuator mechanisms - Considers MEMS for biomedical sensing and diagnostic applications, along with MEMS for in vivo sensing and electrical impedance spectroscopy
Author: Anindya Nag
Publisher: Springer
ISBN: 3030137651
Category : Technology & Engineering
Languages : en
Pages : 205
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Book Description
This book presents recent advances in the design, fabrication and implementation of flexible printed sensors. It explores a range of materials for developing the electrode and substrate parts of the sensors, on the basis of their electrical and mechanical characteristics. The sensors were processed using laser cutting and 3D printing techniques, and the sensors developed were employed in a number of healthcare, environmental and industrial applications, including: monitoring of physiological movements, respiration, salinity and nitrate measurement, and tactile sensing. The type of sensor selected for each application depended on its dimensions, robustness and sensitivity. The sensors fabricated were also embedded in an IoT-based system, allowing them to be integrated into real-time applications.
Author: Stephen D. Senturia
Publisher: Springer Science & Business Media
ISBN: 0306476010
Category : Technology & Engineering
Languages : en
Pages : 699
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Book Description
It is a real pleasure to write the Foreword for this book, both because I have known and respected its author for many years and because I expect this book’s publication will mark an important milestone in the continuing worldwide development of microsystems. By bringing together all aspects of microsystem design, it can be expected to facilitate the training of not only a new generation of engineers, but perhaps a whole new type of engineer – one capable of addressing the complex range of problems involved in reducing entire systems to the micro- and nano-domains. This book breaks down disciplinary barriers to set the stage for systems we do not even dream of today. Microsystems have a long history, dating back to the earliest days of mic- electronics. While integrated circuits developed in the early 1960s, a number of laboratories worked to use the same technology base to form integrated sensors. The idea was to reduce cost and perhaps put the sensors and circuits together on the same chip. By the late-60s, integrated MOS-photodiode arrays had been developed for visible imaging, and silicon etching was being used to create thin diaphragms that could convert pressure into an electrical signal. By 1970, selective anisotropic etching was being used for diaphragm formation, retaining a thick silicon rim to absorb package-induced stresses. Impurity- and electrochemically-based etch-stops soon emerged, and "bulk micromachining" came into its own.
Author: Masayoshi Esashi
Publisher: John Wiley & Sons
ISBN: 3527823255
Category : Technology & Engineering
Languages : en
Pages : 528
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Book Description
Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
