Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 75
Book Description
A study was conducted to investigate the reliability of organic adhesives in hybrid microcircuits. The objectives of this study were twofold: (1) to identify and investigate problem areas that could result from the use of organic adhesives and (2) to develop evaluation tests to quantify the extent to which these problems occur for commercially available adhesives. Efforts were focused on electrically conductive adhesives. Also, a study was made to evaluate selected organic coatings for contamination protection for hybrid microcircuits. The results of these studies are reported. jg p2.
Design Guidelines for Use of Adhesives and Organic Coatings in Hybrid Microcircuits
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 75
Book Description
A study was conducted to investigate the reliability of organic adhesives in hybrid microcircuits. The objectives of this study were twofold: (1) to identify and investigate problem areas that could result from the use of organic adhesives and (2) to develop evaluation tests to quantify the extent to which these problems occur for commercially available adhesives. Efforts were focused on electrically conductive adhesives. Also, a study was made to evaluate selected organic coatings for contamination protection for hybrid microcircuits. The results of these studies are reported. jg p2.
Publisher:
ISBN:
Category :
Languages : en
Pages : 75
Book Description
A study was conducted to investigate the reliability of organic adhesives in hybrid microcircuits. The objectives of this study were twofold: (1) to identify and investigate problem areas that could result from the use of organic adhesives and (2) to develop evaluation tests to quantify the extent to which these problems occur for commercially available adhesives. Efforts were focused on electrically conductive adhesives. Also, a study was made to evaluate selected organic coatings for contamination protection for hybrid microcircuits. The results of these studies are reported. jg p2.
Adhesives Technology for Electronic Applications
Author: James J. Licari
Publisher: Elsevier
ISBN: 0815516002
Category : Technology & Engineering
Languages : en
Pages : 477
Book Description
This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references.
Publisher: Elsevier
ISBN: 0815516002
Category : Technology & Engineering
Languages : en
Pages : 477
Book Description
This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references.
NBS Special Publication
Author:
Publisher:
ISBN:
Category : Weights and measures
Languages : en
Pages : 532
Book Description
Publisher:
ISBN:
Category : Weights and measures
Languages : en
Pages : 532
Book Description
Microcircuit Reliability Bibliography
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 412
Book Description
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 412
Book Description
Scientific and Technical Aerospace Reports
Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 292
Book Description
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 292
Book Description
Hybrid Microcircuit Technology Handbook
Author: James J. Licari
Publisher: William Andrew
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 456
Book Description
The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will be of value to materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.
Publisher: William Andrew
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 456
Book Description
The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will be of value to materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.
Government Reports Announcements & Index
Author:
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 456
Book Description
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 456
Book Description
Reliability Technology for Cardiac Pacemakers II
Author: Harry A. Schafft
Publisher:
ISBN:
Category : Cardiac pacemakers
Languages : en
Pages : 52
Book Description
Publisher:
ISBN:
Category : Cardiac pacemakers
Languages : en
Pages : 52
Book Description
Semiconductor Measurement Technology
Author: Harry A. Schafft
Publisher:
ISBN:
Category : Cardiac pacemakers
Languages : en
Pages : 52
Book Description
Publisher:
ISBN:
Category : Cardiac pacemakers
Languages : en
Pages : 52
Book Description
Selected Reports, Including Best New Titles from NTIS
Author: United States. National Technical Information Service
Publisher:
ISBN:
Category : Technology
Languages : en
Pages : 16
Book Description
Publisher:
ISBN:
Category : Technology
Languages : en
Pages : 16
Book Description