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Author: Shekhar Bhansali
Publisher: Elsevier
ISBN: 0857096273
Category : Technology & Engineering
Languages : en
Pages : 511
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Book Description
The application of Micro Electro Mechanical Systems (MEMS) in the biomedical field is leading to a new generation of medical devices. MEMS for biomedical applications reviews the wealth of recent research on fabrication technologies and applications of this exciting technology.The book is divided into four parts: Part one introduces the fundamentals of MEMS for biomedical applications, exploring the microfabrication of polymers and reviewing sensor and actuator mechanisms. Part two describes applications of MEMS for biomedical sensing and diagnostic applications. MEMS for in vivo sensing and electrical impedance spectroscopy are investigated, along with ultrasonic transducers, and lab-on-chip devices. MEMS for tissue engineering and clinical applications are the focus of part three, which considers cell culture and tissue scaffolding devices, BioMEMS for drug delivery and minimally invasive medical procedures. Finally, part four reviews emerging biomedical applications of MEMS, from implantable neuroprobes and ocular implants to cellular microinjection and hybrid MEMS.With its distinguished editors and international team of expert contributors, MEMS for biomedical applications provides an authoritative review for scientists and manufacturers involved in the design and development of medical devices as well as clinicians using this important technology. - Reviews the wealth of recent research on fabrication technologies and applications of Micro Electro Mechanical Systems (MEMS) in the biomedical field - Introduces the fundamentals of MEMS for biomedical applications, exploring the microfabrication of polymers and reviewing sensor and actuator mechanisms - Considers MEMS for biomedical sensing and diagnostic applications, along with MEMS for in vivo sensing and electrical impedance spectroscopy
Author: Shekhar Bhansali
Publisher: Elsevier
ISBN: 0857096273
Category : Technology & Engineering
Languages : en
Pages : 511
Get Book Here
Book Description
The application of Micro Electro Mechanical Systems (MEMS) in the biomedical field is leading to a new generation of medical devices. MEMS for biomedical applications reviews the wealth of recent research on fabrication technologies and applications of this exciting technology.The book is divided into four parts: Part one introduces the fundamentals of MEMS for biomedical applications, exploring the microfabrication of polymers and reviewing sensor and actuator mechanisms. Part two describes applications of MEMS for biomedical sensing and diagnostic applications. MEMS for in vivo sensing and electrical impedance spectroscopy are investigated, along with ultrasonic transducers, and lab-on-chip devices. MEMS for tissue engineering and clinical applications are the focus of part three, which considers cell culture and tissue scaffolding devices, BioMEMS for drug delivery and minimally invasive medical procedures. Finally, part four reviews emerging biomedical applications of MEMS, from implantable neuroprobes and ocular implants to cellular microinjection and hybrid MEMS.With its distinguished editors and international team of expert contributors, MEMS for biomedical applications provides an authoritative review for scientists and manufacturers involved in the design and development of medical devices as well as clinicians using this important technology. - Reviews the wealth of recent research on fabrication technologies and applications of Micro Electro Mechanical Systems (MEMS) in the biomedical field - Introduces the fundamentals of MEMS for biomedical applications, exploring the microfabrication of polymers and reviewing sensor and actuator mechanisms - Considers MEMS for biomedical sensing and diagnostic applications, along with MEMS for in vivo sensing and electrical impedance spectroscopy
Author: Reza Ghodssi
Publisher: Springer Science & Business Media
ISBN: 0387473181
Category : Technology & Engineering
Languages : en
Pages : 1211
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Book Description
MEMs Materials and Processes Handbook" is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on "Materials" and "Processes". The extensive Material Selection Guide" and a "Material Database" guides the reader through the selection of appropriate materials for the required task at hand. The "Processes" section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs.
Author: Tai-Ran Hsu
Publisher: McGraw-Hill Science, Engineering & Mathematics
ISBN:
Category : Computers
Languages : en
Pages : 456
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Book Description
Microsystems and MEMS technology is one of the biggest breakthroughs in the area of mechanical and electronic technology in recent years. This is the technology of extremely small and powerful devices, and systems built around them, which have mechanical and electrical components. MEMS technology is expanding rapidly, with major application areas being telecommunications, biomedical technology, manufacturing and robotic systems, transportation and aerospace. Academics are desperate for texts to familiarise future engineers with this broad-ranging technology. This text provides an engineering design approach to MEMS and microsystems which is appropriate for professionals and senior level students. This design approach is conveyed through good examples, cases and applied problems. The book is appropriate for mechanical and aerospace engineers, since it carefully explains the electrical/electronic aspects of the subject. Electrical engineering students will be given strong coverage of the mechanical side of MEMS, something they may not receive elsewhere.
Author: Alper Erturk
Publisher: John Wiley & Sons
ISBN: 1119991358
Category : Technology & Engineering
Languages : en
Pages : 377
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Book Description
The transformation of vibrations into electric energy through the use of piezoelectric devices is an exciting and rapidly developing area of research with a widening range of applications constantly materialising. With Piezoelectric Energy Harvesting, world-leading researchers provide a timely and comprehensive coverage of the electromechanical modelling and applications of piezoelectric energy harvesters. They present principal modelling approaches, synthesizing fundamental material related to mechanical, aerospace, civil, electrical and materials engineering disciplines for vibration-based energy harvesting using piezoelectric transduction. Piezoelectric Energy Harvesting provides the first comprehensive treatment of distributed-parameter electromechanical modelling for piezoelectric energy harvesting with extensive case studies including experimental validations, and is the first book to address modelling of various forms of excitation in piezoelectric energy harvesting, ranging from airflow excitation to moving loads, thus ensuring its relevance to engineers in fields as disparate as aerospace engineering and civil engineering. Coverage includes: Analytical and approximate analytical distributed-parameter electromechanical models with illustrative theoretical case studies as well as extensive experimental validations Several problems of piezoelectric energy harvesting ranging from simple harmonic excitation to random vibrations Details of introducing and modelling piezoelectric coupling for various problems Modelling and exploiting nonlinear dynamics for performance enhancement, supported with experimental verifications Applications ranging from moving load excitation of slender bridges to airflow excitation of aeroelastic sections A review of standard nonlinear energy harvesting circuits with modelling aspects.
Author: Jacob Fraden
Publisher: Springer Science & Business Media
ISBN: 0387216049
Category : Technology & Engineering
Languages : en
Pages : 596
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Book Description
Seven years have passed since the publication of the previous edition of this book. During that time, sensor technologies have made a remarkable leap forward. The sensitivity of the sensors became higher, the dimensions became smaller, the sel- tivity became better, and the prices became lower. What have not changed are the fundamental principles of the sensor design. They are still governed by the laws of Nature. Arguably one of the greatest geniuses who ever lived, Leonardo Da Vinci, had his own peculiar way of praying. He was saying, “Oh Lord, thanks for Thou do not violate your own laws. ” It is comforting indeed that the laws of Nature do not change as time goes by; it is just our appreciation of them that is being re?ned. Thus, this new edition examines the same good old laws of Nature that are employed in the designs of various sensors. This has not changed much since the previous edition. Yet, the sections that describe the practical designs are revised substantially. Recent ideas and developments have been added, and less important and nonessential designs were dropped. Probably the most dramatic recent progress in the sensor technologies relates to wide use of MEMS and MEOMS (micro-electro-mechanical systems and micro-electro-opto-mechanical systems). These are examined in this new edition with greater detail. This book is about devices commonly called sensors. The invention of a - croprocessor has brought highly sophisticated instruments into our everyday lives.
Author: Andrea Chen
Publisher: CRC Press
ISBN: 1439862079
Category : Technology & Engineering
Languages : en
Pages : 216
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Book Description
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Author: Henry Baltes
Publisher: John Wiley & Sons
ISBN: 3527616934
Category : Technology & Engineering
Languages : en
Pages : 612
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Book Description
Microstructures, electronics, nanotechnology - these vast fields of research are growing together as the size gap narrows and many different materials are combined. Current research, engineering sucesses and newly commercialized products hint at the immense innovative potentials and future applications that open up once mankind controls shape and function from the atomic level right up to the visible world without any gaps. Sensor systems, microreactors, nanostructures, nanomachines, functional surfaces, integrated optics, displays, communications technology, biochips, human/machine interfaces, prosthetics, miniaturized medical and surgery equipment and many more opportunities are being explored. This new series, Advanced Micro and Nano Systems, provides cutting-edge reviews from top authors on technologies, devices and advanced systems from the micro and nano worlds.
Author: Ravinder S. Dahiya
Publisher: Springer Science & Business Media
ISBN: 9400705794
Category : Technology & Engineering
Languages : en
Pages : 258
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Book Description
Future robots are expected to work closely and interact safely with real-world objects and humans alike. Sense of touch is important in this context, as it helps estimate properties such as shape, texture, hardness, material type and many more; provides action related information, such as slip detection; and helps carrying out actions such as rolling an object between fingers without dropping it. This book presents an in-depth description of the solutions available for gathering tactile data, obtaining aforementioned tactile information from the data and effectively using the same in various robotic tasks. The efforts during last four decades or so have yielded a wide spectrum of tactile sensing technologies and engineered solutions for both intrinsic and extrinsic touch sensors. Nowadays, new materials and structures are being explored for obtaining robotic skin with physical features like bendable, conformable, and stretchable. Such features are important for covering various body parts of robots or 3D surfaces. Nonetheless, there exist many more hardware, software and application related issues that must be considered to make tactile sensing an effective component of future robotic platforms. This book presents an in-depth analysis of various system related issues and presents the trade-offs one may face while developing an effective tactile sensing system. For this purpose, human touch sensing has also been explored. The design hints coming out of the investigations into human sense of touch can be useful in improving the effectiveness of tactile sensory modality in robotics and other machines. Better integration of tactile sensors on a robot’s body is prerequisite for the effective utilization of tactile data. The concept of semiconductor devices based sensors is an interesting one, as it allows compact and fast tactile sensing systems with capabilities such as human-like spatio-temporal resolution. This book presents a comprehensive description of semiconductor devices based tactile sensing. In particular, novel Piezo Oxide Semiconductor Field Effect Transistor (POSFET) based approach for high resolution tactile sensing has been discussed in detail. Finally, the extension of semiconductors devices based sensors concept to large and flexile areas has been discussed for obtaining robotic or electronic skin. With its multidisciplinary scope, this book is suitable for graduate students and researchers coming from diverse areas such robotics (bio-robots, humanoids, rehabilitation etc.), applied materials, humans touch sensing, electronics, microsystems, and instrumentation. To better explain the concepts the text is supported by large number of figures.
Author: Mohamed Gad-el-Hak
Publisher: CRC Press
ISBN: 1420036556
Category : Technology & Engineering
Languages : en
Pages : 576
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Book Description
As our knowledge of microelectromechanical systems (MEMS) continues to grow, so does The MEMS Handbook. The field has changed so much that this Second Edition is now available in three volumes. Individually, each volume provides focused, authoritative treatment of specific areas of interest. Together, they comprise the most comprehensive collection
Author: Eric J. Mittemeijer
Publisher: Springer Nature
ISBN: 3030600564
Category : Technology & Engineering
Languages : en
Pages : 754
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Book Description
This textbook offers a strong introduction to the fundamental concepts of materials science. It conveys the quintessence of this interdisciplinary field, distinguishing it from merely solid-state physics and solid-state chemistry, using metals as model systems to elucidate the relation between microstructure and materials properties. Mittemeijer's Fundamentals of Materials Science provides a consistent treatment of the subject matter with a special focus on the microstructure-property relationship. Richly illustrated and thoroughly referenced, it is the ideal adoption for an entire undergraduate, and even graduate, course of study in materials science and engineering. It delivers a solid background against which more specialized texts can be studied, covering the necessary breadth of key topics such as crystallography, structure defects, phase equilibria and transformations, diffusion and kinetics, and mechanical properties. The success of the first edition has led to this updated and extended second edition, featuring detailed discussion of electron microscopy, supermicroscopy and diffraction methods, an extended treatment of diffusion in solids, and a separate chapter on phase transformation kinetics. “In a lucid and masterly manner, the ways in which the microstructure can affect a host of basic phenomena in metals are described.... By consistently staying with the postulated topic of the microstructure - property relationship, this book occupies a singular position within the broad spectrum of comparable materials science literature .... it will also be of permanent value as a reference book for background refreshing, not least because of its unique annotated intermezzi; an ambitious, remarkable work.” G. Petzow in International Journal of Materials Research. “The biggest strength of the book is the discussion of the structure-property relationships, which the author has accomplished admirably.... In a nutshell, the book should not be looked at as a quick ‘cook book’ type text, but as a serious, critical treatise for some significant time to come.” G.S. Upadhyaya in Science of Sintering. “The role of lattice defects in deformation processes is clearly illustrated using excellent diagrams . Included are many footnotes, ‘Intermezzos’, ‘Epilogues’ and asides within the text from the author’s experience. This ..... soon becomes valued for the interesting insights into the subject and shows the human side of its history. Overall this book provides a refreshing treatment of this important subject and should prove a useful addition to the existing text books available to undergraduate and graduate students and researchers in the field of materials science.” M. Davies in Materials World.
