Design and fabrication of heterostructure devices using epitaxial Si, SiGe and SiGeC layers PDF Download
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Author: Sandeep Kesrimal Oswal
Publisher:
ISBN:
Category :
Languages : en
Pages : 118
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Book Description
Author: Sandeep Kesrimal Oswal
Publisher:
ISBN:
Category :
Languages : en
Pages : 118
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Book Description
Author: Eugene A. Fitzgerald
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 414
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Book Description
The April 13-17, 1998 symposium held in San Francisco offered an intriguing mix of SiGe device and circuit technology, and the latest developments in SiGE materials and SiGeC alloys. The 53 papers pivot around the themes of: technologies and devices; devices, processing, and characterization; photonics and optoelectronics; epitaxy of quantum structures; SiGeC alloys; and epitaxy of SiGe/ related materials. A sample title from each of the six parts includes: carrier transport and velocity overshoot in strained Si on SiGe heterostructures, device and fabrication issues of high-performance Si/SiGe FETS, photonic crystals based on macroporous silicon, stacked layers of self-assembled Ge islands, photoluminescence in strain compensated Si/SiGeC multiple quantum wells, and a novel layer-by-layer heteroepitaxy of germanium on silicon (100) surface. Annotation copyrighted by Book News, Inc., Portland, OR
Author: John D. Cressler
Publisher: CRC Press
ISBN: 1420066862
Category : Technology & Engineering
Languages : en
Pages : 264
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Book Description
What seems routine today was not always so. The field of Si-based heterostructures rests solidly on the shoulders of materials scientists and crystal growers, those purveyors of the semiconductor “black arts” associated with the deposition of pristine films of nanoscale dimensionality onto enormous Si wafers with near infinite precision. We can now grow near-defect free, nanoscale films of Si and SiGe strained-layer epitaxy compatible with conventional high-volume silicon integrated circuit manufacturing. SiGe and Si Strained-Layer Epitaxy for Silicon Heterostructure Devices tells the materials side of the story and details the many advances in the Si-SiGe strained-layer epitaxy for device applications. Drawn from the comprehensive and well-reviewed Silicon Heterostructure Handbook, this volume defines and details the many advances in the Si/SiGe strained-layer epitaxy for device applications. Mining the talents of an international panel of experts, the book covers modern SiGe epitaxial growth techniques, epi defects and dopant diffusion in thin films, stability constraints, and electronic properties of SiGe, strained Si, and Si-C alloys. It includes appendices on topics such as the properties of Si and Ge, the generalized Moll-Ross relations, integral charge-control relations, and sample SiGe HBT compact model parameters.
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 19
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Book Description
The primary motivation of this work has been to investigate the growth, fabrication, and device physics of Silicon-based Heterostructure Devices. The goal is to extend performance limitations of existing devices and to develop silicon-based heterojunction technology for the fabrication of new types of transistors (e.g. quantum devices). The basic device structures investigated in this work are the Si/SiGe Heterojunction Bipolar Transistor (HBT) and the Strained-Si n-MOSFET. Epitaxial layers are grown by the rapid thermal, low pressure chemical vapor deposition technique known as limited reaction processing. The research involves materials characterization and semiconductor processing, with an emphasis on obtaining a fundamental understanding of electronic properties and device physics. The specific problems studied in this research include characterizing minority carrier transport and heavy doping effects in Si/SiGe/Si HBTs, investigation of boron diffusion in SiGe, fabrication and analysis of the first high mobility, strained-Si MOSFETs, and preliminary study of the feasibility of adding carbon to SiGe layers to expand the opportunities for Column IV heterostructures. The HBT research was carried out in collaboration with Hewlett-Packard (Palo Alto, CA), and Motorola (Mesa, AZ) has maintained a strong interest in our work on the strained-Si MOSFET.
Author: John D. Cressler
Publisher: CRC Press
ISBN: 1420026585
Category : Technology & Engineering
Languages : en
Pages : 1248
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Book Description
An extraordinary combination of material science, manufacturing processes, and innovative thinking spurred the development of SiGe heterojunction devices that offer a wide array of functions, unprecedented levels of performance, and low manufacturing costs. While there are many books on specific aspects of Si heterostructures, the Silicon Heterostructure Handbook: Materials, Fabrication, Devices, Circuits, and Applications of SiGe and Si Strained-Layer Epitaxy is the first book to bring all aspects together in a single source. Featuring broad, comprehensive, and in-depth discussion, this handbook distills the current state of the field in areas ranging from materials to fabrication, devices, CAD, circuits, and applications. The editor includes "snapshots" of the industrial state-of-the-art for devices and circuits, presenting a novel perspective for comparing the present status with future directions in the field. With each chapter contributed by expert authors from leading industrial and research institutions worldwide, the book is unequalled not only in breadth of scope, but also in depth of coverage, timeliness of results, and authority of references. It also includes a foreword by Dr. Bernard S. Meyerson, a pioneer in SiGe technology. Containing nearly 1000 figures along with valuable appendices, the Silicon Heterostructure Handbook authoritatively surveys materials, fabrication, device physics, transistor optimization, optoelectronics components, measurement, compact modeling, circuit design, and device simulation.
Author: Guilei Wang
Publisher: Springer Nature
ISBN: 9811500460
Category : Technology & Engineering
Languages : en
Pages : 115
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Book Description
This thesis presents the SiGe source and drain (S/D) technology in the context of advanced CMOS, and addresses both device processing and epitaxy modelling. As the CMOS technology roadmap calls for continuously downscaling traditional transistor structures, controlling the parasitic effects of transistors, e.g. short channel effect, parasitic resistances and capacitances is becoming increasingly difficult. The emergence of these problems sparked a technological revolution, where a transition from planar to three-dimensional (3D) transistor design occurred in the 22nm technology node. The selective epitaxial growth (SEG) method has been used to deposit SiGe as stressor material in S/D regions to induce uniaxial strain in the channel region. The thesis investigates issues of process integration in IC production and concentrates on the key parameters of high-quality SiGe selective epitaxial growth, with a special focus on its pattern dependency behavior and on key integration issues in both 2D and 3D transistor structures, the goal being to improve future applications of SiGe SEG in advanced CMOS.
Author: Jeff J. Peterson
Publisher:
ISBN:
Category :
Languages : en
Pages : 634
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Book Description
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 35
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Book Description
We have developed new molecular beam epitaxy (MBE) materials growth and doping processes for the fabrication of Si/SiGe heterostructure devices. We applied these new materials processes to the demonstration of cryogenic n-p-n Si/Si 1-x Gex/Si heterojunction bipolar transistors (HBT). This application has special significance as an enabling DoD technology for fast low noise, high performance readout and signal processing circuits for IR focal systems. We succeeded in developing reliable, versatile methods to grow very high quality Si/SiGe strained layer heterostructures and multilayers. In connection with this program we developed methods to dope the Si and SiGe with B, Sb and Ga. B and Sb were found to be the preferred dopants for p and n regions respectively, of our HBT devices. Our test devices clearly displayed gain enhancement due to the heterojunction and provided useful gains from room temperature down to 10K.
Author: C.K Maiti
Publisher: CRC Press
ISBN: 1420034693
Category : Science
Languages : en
Pages : 402
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Book Description
The first book to deal with the design and optimization of transistors made from strained layers, Applications of Silicon-Germanium Heterostructure Devices combines three distinct topics-technology, device design and simulation, and applications-in a comprehensive way. Important aspects of the book include key technology issues for the growth of st
Author: Yuanwei Dong
Publisher: LAP Lambert Academic Publishing
ISBN: 9783659586699
Category :
Languages : en
Pages : 212
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Book Description
This book focused on interdiffusion behaviors in SiGe heterostructures under different strain conditions. A unified Si-Ge interdiffusivity model without strain's impact was built over the full Ge fraction range for the first time. It was demonstrated that the unified model is valid for Si-Ge interdiffusion under conventional furnace anneals, and advanced anneal techniques such as soak and spike rapid thermal anneals. In addition, the role of biaxial compressive strain in Si-Ge interdiffusion was fully clarified. Compressive strain can enhance Si-Ge interdiffusion greatly, by tens to a hundred times at certain temperature range. Moreover, some new light was shed on a more complicated case, interdiffusion with strain relaxation. The interdiffusivity models can be employed to predict and estimate interdiffusion in SiGe heterostructures for next-generation semiconductor devices, and to optimize the design of SiGe epitaxial structures and thermal budgets for fabrication processes. On the theoretical side, these models can be used as reference lines for studies on Si-Ge interdiffusion with doping and/or with defects.
