Computer Aided Design of Optoelectronic Multi-chip Modules PDF Download
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Author: Jiao Fan
Publisher:
ISBN:
Category :
Languages : en
Pages : 404
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Book Description
Author: Jiao Fan
Publisher:
ISBN:
Category :
Languages : en
Pages : 404
Get Book Here
Book Description
Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 702
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Author:
Publisher:
ISBN:
Category : Computers
Languages : en
Pages : 352
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Book Description
Author: Sing H. Lee
Publisher: SPIE-International Society for Optical Engineering
ISBN:
Category : Computers
Languages : en
Pages : 744
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Book Description
SPIE Milestones are collections of seminal papers from the world literature covering important discoveries and developments in optics and photonics.
Author: Edmund Pierzchala
Publisher: Springer Science & Business Media
ISBN: 1475752245
Category : Technology & Engineering
Languages : en
Pages : 166
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Book Description
Field-Programmable Analog Arrays brings together in one place important contributions and up-to-date research results in this fast moving area. Field-Programmable Analog Arrays serves as an excellent reference, providing insight into some of the most challenging research issues in the field.
Author:
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 208
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Author: Brian S. Wherrett
Publisher: CRC Press
ISBN:
Category : Art
Languages : en
Pages : 690
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Book Description
This proceedings volume covers architectures & algorithms for optical computing, optical interconnections & switching, devices & components, & quantum optoelectronics.
Author: Glenn R. Blackwell
Publisher: CRC Press
ISBN: 9781420049848
Category : Technology & Engineering
Languages : en
Pages : 648
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Book Description
The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
Author:
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ISBN:
Category : Physics
Languages : en
Pages : 1224
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Author: Shigeru Kawai
Publisher: CRC Press
ISBN: 1420027778
Category : Computers
Languages : en
Pages : 470
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Book Description
As we reach the data transmission limits of copper wire and communications experts seek to bring the speed of long-haul fiber optics networks closer to access points, optical interconnects promise to provide efficient, high-speed data transmission for the next generation of networks and systems. They offer higher bit-rates, virtually no crosstalk, lower demands on power requirements and thermal management, and the possibility of two-dimensional channel arrays for chip-to-chip communication. The Handbook of Optical Interconnects introduces the systems and devices that will bring the speed and quality of optical transmission closer to the circuit board. Contributed by active experts, most from leading technology companies in the US and Japan, this outstanding handbook details various low-cost and small-size configurations, illustrates the discussion with more than 300 figures, and offers a look at the applications and future of this exciting and rapidly growing field. The book includes a detailed introduction to vertical cavity surface-emitting lasers (VCSELs); the use of optical interconnects in metropolitan, local-area, and access networks through FTTP (FTTH); and Jisso technologies, which are critical for developing low-cost, small-size modules. Driving down the size and cost of optical interconnects is vital for integrating these technologies into the network and onto microprocessors, and the Handbook of Optical Interconnects provides the knowledge and tools necessary to accomplish these goals.
