Components for Batch-Fabricated Chip-Scale Atomic Clocks PDF Download
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Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 15
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Book Description
We describe chip-scale batch-fabricated cesium cells utilizing semiconductor wafer processing, pin transfer of cesium, and silicon/Pyrex anodic bonding for cell sealing. Highspeed, single-mode linearly polarized VCSELs emitting at the 133Cs D1 line were fabricated, optimized for low threshold and high-speed operation with overall small power dissipation. Coherent population trapping (CPT) end-resonance signals with a contrast and linewidth of 5.4% and 7.1 kHz respectively are achieved using 1 mm optical path length cells and VCSEL driven with 1.25 mW RF modulation and 2.76 mW DC power dissipation. We demonstrate short-term stability with an atomic clock built with these components operating on the CPT end-resonance. The magnetic field is stabilized with a novel magnetic field locking scheme tapping the Zeeman resonance.
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 15
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Book Description
We describe chip-scale batch-fabricated cesium cells utilizing semiconductor wafer processing, pin transfer of cesium, and silicon/Pyrex anodic bonding for cell sealing. Highspeed, single-mode linearly polarized VCSELs emitting at the 133Cs D1 line were fabricated, optimized for low threshold and high-speed operation with overall small power dissipation. Coherent population trapping (CPT) end-resonance signals with a contrast and linewidth of 5.4% and 7.1 kHz respectively are achieved using 1 mm optical path length cells and VCSEL driven with 1.25 mW RF modulation and 2.76 mW DC power dissipation. We demonstrate short-term stability with an atomic clock built with these components operating on the CPT end-resonance. The magnetic field is stabilized with a novel magnetic field locking scheme tapping the Zeeman resonance.
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 17
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Book Description
A chip-scale atomic clock implemented with end-state physics has been fabricated and characterized. Batch-fabricated components were specifically designed and developed to enable integration within a small form-factor package. The full physics package, implemented with CW VCSEL optical pump, direct end-state hyperfine RF and Zeeman interrogation for magnetic field stabilization, was demonstrated within a 4 cm3 volume, consuming 25 mW of power, and exhibiting an Allan deviation stability. In addition, end-state signal contrast exceeded 40% from millimeter-scale vapor cells with buffer-gas pressures exceeding 2.5 atmospheres, demonstrating the route to submillimeter vapor-cells within high-performance CSACs for high shock/vibration environments.
Author:
Publisher:
ISBN: 9789276406662
Category :
Languages : en
Pages :
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Book Description
We report on a cycle of four presentations on Chip-Scale Atomic Clocks (CSACs) organized and chaired by DG DEFIS Unit B.2 and given by the author in April/May 2021 to an audience composed by policy officers from DG JRC, DG DEFIS, DG CNECT, DG DIGIT, DG MOVE, REA, EISMEA, HaDEA, COUNCIL, EUSPA, EDA, and ESA. The presentations provide an overview of the place of CSACs in the clock landscape, their underlying working principles and enabling technologies, the available commercial devices, and the research and development initiatives going on worldwide. Applications are also covered, from which it becomes apparent the importance of CSACs for several military uses, and in some civilian domains. The aim of the report is to provide scientific and technical background for policy initiatives in an area of potential interest for strategic autonomy. Indeed, this Technical Report shows that although the EU has a first-class research capability on CSACs and has developed advanced prototypes, the transition towards a market product with characteristics similar to those presently produced in the USA and in China needs attentive policy support. To be successful, a commercial CSAC needs to overcome the market uncertainties facing a product characterized by high manufacturing costs and an application domain falling mostly in the military and defence sector. Since in the EU accreditation and procurement of military equipment is determined by national regulations, there is a clear case for policy initiatives aimed at the institution of an EU-wide market space for CSACs, the only which can guarantee a demand large enough to enable the cost reductions associated with large-scale manufacturing. This point clearly emerged during the discussions which followed the presentations. Indeed, policy officer from both the European Commission and the European Defence Agency hinted at the necessity of establishing a mechanism for information exchange between relevant European institutions, national governments, and manufacturers of military equipment as a precondition to raise the interest of atomic clock producers towards a device which could contribute to EU strategic autonomy. It was agreed that the JRC will continue to provide the Commission the necessary assistance, in terms of technical know-how.
Author:
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN: 9780780382657
Category : Science
Languages : en
Pages : 926
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Book Description
Author: IEEE International Conference on Micro Electro Mechanical Systems 17, 2004, Maastricht, The Netherlands
Publisher:
ISBN: 9780780382657
Category :
Languages : en
Pages : 868
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Book Description
Author: Jakob Reichel
Publisher: John Wiley & Sons
ISBN: 3527643923
Category : Science
Languages : en
Pages : 412
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Book Description
This stimulating discussion of a rapidly developing field is divided into two parts. The first features tutorials in textbook style providing self-contained introductions to the various areas relevant to atom chip research. Part II contains research reviews that provide an integrated account of the current state in an active area of research where atom chips are employed, and explore possible routes of future progress. Depending on the subject, the length of the review and the relative weight of the 'review' and 'outlook' parts vary, since the authors include their own personal view and style in their accounts.
Author: Gary S. May
Publisher: John Wiley & Sons
ISBN: 0471790273
Category : Technology & Engineering
Languages : en
Pages : 428
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Book Description
A practical guide to semiconductor manufacturing from processcontrol to yield modeling and experimental design Fundamentals of Semiconductor Manufacturing and Process Controlcovers all issues involved in manufacturing microelectronic devicesand circuits, including fabrication sequences, process control,experimental design, process modeling, yield modeling, and CIM/CAMsystems. Readers are introduced to both the theory and practice ofall basic manufacturing concepts. Following an overview of manufacturing and technology, the textexplores process monitoring methods, including those that focus onproduct wafers and those that focus on the equipment used toproduce wafers. Next, the text sets forth some fundamentals ofstatistics and yield modeling, which set the foundation for adetailed discussion of how statistical process control is used toanalyze quality and improve yields. The discussion of statistical experimental design offers readers apowerful approach for systematically varying controllable processconditions and determining their impact on output parameters thatmeasure quality. The authors introduce process modeling concepts,including several advanced process control topics such asrun-by-run, supervisory control, and process and equipmentdiagnosis. Critical coverage includes the following: * Combines process control and semiconductor manufacturing * Unique treatment of system and software technology and managementof overall manufacturing systems * Chapters include case studies, sample problems, and suggestedexercises * Instructor support includes electronic copies of the figures andan instructor's manual Graduate-level students and industrial practitioners will benefitfrom the detailed exami?nation of how electronic materials andsupplies are converted into finished integrated circuits andelectronic products in a high-volume manufacturingenvironment. An Instructor's Manual presenting detailed solutions to all theproblems in the book is available from the Wiley editorialdepartment. An Instructor Support FTP site is also available.
Author: Ampere A. Tseng
Publisher: World Scientific
ISBN: 9812790896
Category : Technology & Engineering
Languages : en
Pages : 583
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Book Description
Many of the devices and systems used in modern industry are becoming progressively smaller and have reached the nanoscale domain. Nanofabrication aims at building nanoscale structures, which can act as components, devices, or systems, in large quantities at potentially low cost. Nanofabrication is vital to all nanotechnology fields, especially for the realization of nanotechnology that involves the traditional areas across engineering and science. This is the first book solely dedicated to the manufacturing technology in nanoscale structures, devices, and systems and is designed to satisfy the growing demands of researchers, professionals, and graduate students. Both conventional and non-conventional fabrication technologies are introduced with emphasis on multidisciplinary principles, methodologies, and practical applications. While conventional technologies consider the emerging techniques developed for next generation lithography, non-conventional techniques include scanning probe microscopy lithography, self-assembly, and imprint lithography, as well as techniques specifically developed for making carbon tubes and molecular circuits and devices. Sample Chapter(s). Chapter 1: Atom, Molecule, and Nanocluster Manipulations for Nanostructure Fabrication Using Scanning Probe Microscopy (3,320 KB). Contents: Atomic Force Microscope Lithography (N Kawasegi et al.); Nanowire Assembly and Integration (Z Gu & D H Gracias); Extreme Ultraviolet Lithography (H Kinoshita); Electron Projection Lithography (T Miura et al.); Electron Beam Direct Writing (K Yamazaki); Electron Beam Induced Deposition (K Mitsuishi); Focused Ion Beams and Interaction with Solids (T Ishitani et al.); Nanofabrication of Nanoelectromechanical Systems (NEMS): Emerging Techniques (K L Ekinci & J Brugger); and other papers. Readership: Researchers, professionals, and graduate students in the fields of nanoengineering and nanoscience.
Author: R. Jacob Baker
Publisher: John Wiley & Sons
ISBN: 0470229411
Category : Technology & Engineering
Languages : en
Pages : 1074
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Book Description
This edition provides an important contemporary view of a wide range of analog/digital circuit blocks, the BSIM model, data converter architectures, and more. The authors develop design techniques for both long- and short-channel CMOS technologies and then compare the two.
Author: Francis T. S. Yu
Publisher: Cambridge University Press
ISBN: 9780521465175
Category : Computers
Languages : en
Pages : 460
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Book Description
A comprehensive review of optical pattern recognition techniques and implementations, for graduate students and researchers.
