Characterization and Modeling of Pattern Dependencies in Copper Interconnects for Integrated Circuits PDF Download

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Characterization and Modeling of Pattern Dependencies in Copper Interconnects for Integrated Circuits

Characterization and Modeling of Pattern Dependencies in Copper Interconnects for Integrated Circuits PDF Author: Tae Hong Park
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Languages : en
Pages : 204

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Book Description
(Cont.) Especially for the multi-level studies, electrical test structures and measurements in addition to surface profile scans are seen to be important in accurately determining thickness variations. The developed test vehicle and characterization of copper dishing and oxide erosion serve as a basis for further pattern dependent model development. Finally, integration of electroplating and CMP chip-scale models is illustrated; the simulated step and array heights as well as topography pattern density are used as an input for the initial starting topography for CMP simulation of subsequent polishing profile evolution.