Ceramic Substrates and Packages for Electronic Applications PDF Download
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Author: Man F. Yan
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 632
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Book Description
Author: Man F. Yan
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 632
Get Book Here
Book Description
Author: ASM International. Handbook Committee
Publisher: ASM International
ISBN: 0871702835
Category : Technology & Engineering
Languages : en
Pages : 1313
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Book Description
A comprehensive reference on the properties, selection, processing, and applications of the most widely used nonmetallic engineering materials. Section 1, General Information and Data, contains information applicable both to polymers and to ceramics and glasses. It includes an illustrated glossary, a collection of engineering tables and data, and a guide to materials selection. Sections 2 through 7 focus on polymeric materials--plastics, elastomers, polymer-matrix composites, adhesives, and sealants--with the information largely updated and expanded from the first three volumes of the Engineered Materials Handbook. Ceramics and glasses are covered in Sections 8 through 12, also with updated and expanded information. Annotation copyright by Book News, Inc., Portland, OR
Author: Michael Pecht
Publisher: CRC Press
ISBN: 1351838415
Category : Technology & Engineering
Languages : en
Pages : 892
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Book Description
Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Author: Richard K. Ulrich
Publisher: John Wiley & Sons
ISBN: 0471466093
Category : Technology & Engineering
Languages : en
Pages : 852
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Book Description
As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
Author: James J. Licari
Publisher: William Andrew
ISBN: 1437778909
Category : Technology & Engineering
Languages : en
Pages : 415
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Book Description
Approx.512 pagesApprox.512 pages
Author: J.H. Lai
Publisher: CRC Press
ISBN: 1351084356
Category : Mathematics
Languages : en
Pages : 247
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Book Description
The object of this book is to review and to discuss some important applications of polymers in electronics. The first three chapters discuss the current primary applications of polymers in semiconductor device manufacturing: polymers as resist materials for integrated circuit fabrication, polyimides as electronics packaging materials, and polymers as integrated circuits encapsulates.
Author: Relva C. Buchanan
Publisher: CRC Press
ISBN: 1482293048
Category : Technology & Engineering
Languages : en
Pages : 693
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Book Description
The Third Edition of Ceramic Materials for Electronics studies a wide range of ceramic materials, including insulators, conductors, piezoelectrics, and ferroelectrics, through detailed discussion of their properties, characterization, fabrication, and applications in electronics. The author summarizes the latest trends and advancements in the field, and explores important topics such as ceramic thin film, functional device technology, and thick film technology. Edited by a leading expert on the subject, this new edition includes more than 150 pages of new information; restructured reference materials, figures, and tables; as well as additional device application-oriented segments.
Author: Fred D. Barlow, III
Publisher: CRC Press
ISBN: 1420018965
Category : Technology & Engineering
Languages : en
Pages : 458
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Book Description
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
Author: Frank Suli
Publisher: Woodhead Publishing
ISBN: 008102391X
Category : Technology & Engineering
Languages : en
Pages : 490
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Book Description
Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions.
Author: K. M. Nair
Publisher: John Wiley & Sons
ISBN: 1118144457
Category : Technology & Engineering
Languages : en
Pages : 272
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Book Description
This book contains 26 papers from the Magnetoelectric Multiferroic Thin Films and Multilayers; Dielectric Ceramic Materials and Electronic Devices; Recent Developments in High-Temperature Superconductivity; and Multifunctional Oxides symposia held during the 2010 Materials Science and Technology (MS&T'10) meeting, October 17-21, 2010, Houston, Texas. Topics include: Properties; Structures; Synthesis; Characterization; Device Applications; Multiferroics and Magnetoelectrics; YBCO Pinning Methods and Properties; YBCO Processing and Reliability Related Issues; New Superconductors and MgB2.
