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Author: Daniel J. D. Sullivan
Publisher: Walter de Gruyter GmbH & Co KG
ISBN: 1501524798
Category : Technology & Engineering
Languages : en
Pages : 130
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Book Description
The book presents a unique view of failure analysis of high technology devices. It describes capabilities and limitations of many analytical techniques and testing paths and decisions best followed in example failure analysis studies.
Author: Daniel J. D. Sullivan
Publisher: Walter de Gruyter GmbH & Co KG
ISBN: 1501524798
Category : Technology & Engineering
Languages : en
Pages : 130
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Book Description
The book presents a unique view of failure analysis of high technology devices. It describes capabilities and limitations of many analytical techniques and testing paths and decisions best followed in example failure analysis studies.
Author: Dongkai Shangguan
Publisher: CRC Press
ISBN: 1040028640
Category : Technology & Engineering
Languages : en
Pages : 463
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Book Description
In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.
Author: Jürg Schwizer
Publisher: Springer Science & Business Media
ISBN: 3540269452
Category : Technology & Engineering
Languages : en
Pages : 184
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Book Description
Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding and future development of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.
Author: Django Wexler
Publisher: Wizards of the Coast
ISBN: 0786967161
Category : Fiction
Languages : en
Pages : 165
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Book Description
Discover the monstrous realm of Ikoria in this thrilling story, inspired by Magic: The Gathering's card set Ikoria: Lair of Behemoths! Lukka is a proud captain of the Coppercoats, the elite military force that defends Drannith from the savage monsters lurking outside its city walls. For the Coppercoats, the only good monster is a dead monster. Lukka's world is forever altered when he unexpectedly forms a mystical connection with a ferocious, winged cat. But such bonds are high crimes in Drannith, punishable by death. Running for his life, Lukka flees the very home he was sworn to protect. Now an outcast monster "bonder," Lukka must survive the wilds of Ikoria while being ruthlessly hunted by his former brothers-in-arms, including the sadistic General Kudro. With help from planeswalker Vivien Reid, can Lukka learn to tame his newfound powers before he wields vengeance--and an army of nightmarish monsters--against his beloved Drannith?
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 40
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Book Description
Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 44
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Book Description
Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 44
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Book Description
Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 44
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Book Description
Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 40
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Book Description
Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Author: Anonymous
Publisher: Good Press
ISBN:
Category : Literary Criticism
Languages : en
Pages : 3440
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Book Description
The Collected Norse Sagas represents a seminal treasury of ancient lore, encapsulating the profound mythical and historical narratives that define the Viking Age. This collection showcases a vast range of literary styles, from the poetic eddas penned by anonymous skalds to the intricately constructed prose of Snorri Sturluson. It spans the gamut of heroic feats, divine machinations, and the fateful interplay between gods and men, all the while emphasizing the diversity, complexity, and depth of Norse literature. The compilation stands as a monument to the rich literary tradition of the North, immortalizing its characters and tales that have influenced countless generations. The contributing figures to this anthology, though largely anonymous save for Snorri Sturluson, collectively embody the essence of Norse literary and cultural heritage. These sagas are rooted in historical events, cultural beliefs, and the vibrant oral storytelling tradition of the Viking and medieval Scandinavian world. They reflect a mosaic of societal values of the time, offering insights into the mindset, spiritual beliefs, and social dynamics of an era defined by exploration, conquest, and a deep reverence for the natural and supernatural worlds. The Collected Norse Sagas presents readers with a unique gateway into the variegated tapestry of Norse mythology and history. For scholars and enthusiasts alike, this anthology is not merely an academic resource but a portal to the imagination of the Norse world. It invites a comprehensive exploration of its themes, promising an enriching experience to those who seek to understand the profound legacy of the Nordic people. This collection is an essential contribution to the fields of mythology, history, and literature, urging readers to delve into its pages and discover the enduring wisdom contained within.
