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Author: Pepin van Roojen
Publisher: Agile Rabbit Edition
ISBN: 9789057681431
Category : Design
Languages : fr
Pages : 432
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Book Description
BASIC PACKAGING, the first volume of a new series of packaging books ¿ Structural Package Design ¿ , contains 300 designs, including all major international packaging standards. The CDs also included a demo version of packaging software which folds and tests two-dimensional templates in 3-D.
Author: Pepin van Roojen
Publisher: Agile Rabbit Edition
ISBN: 9789057681431
Category : Design
Languages : fr
Pages : 432
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Book Description
BASIC PACKAGING, the first volume of a new series of packaging books ¿ Structural Package Design ¿ , contains 300 designs, including all major international packaging standards. The CDs also included a demo version of packaging software which folds and tests two-dimensional templates in 3-D.
Author: Candace Ellicott
Publisher: Rockport Publishers
ISBN: 1610580672
Category : Design
Languages : en
Pages : 209
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Book Description
This book outlines and demonstrates basic package design guidelines and rules through 100 principles in the areas of research, planning, and execution. This book is a quick reference and primer on package design, and the principles that make design projects successful. Highly visual and appealing to beginning designers, students, and working designers as a resource. The content helps to establish the rules and guides designers in knowing when and where to bend them. Visual examples demonstrate each principle so readers can see the principle at work in applied design.
Author: United States
Publisher:
ISBN:
Category : Military supplies
Languages : en
Pages : 252
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Book Description
Author: Roger C. Griffin
Publisher: Springer Science & Business Media
ISBN: 9401173826
Category : Science
Languages : en
Pages : 388
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Book Description
Since the first edition of "Principles of Packaging Development" was published, the packaging industry has undergone many profound changes. These have included the virtual elimination of cellophane and its replacement with oriented polypropylene as a carton overwrap, fluid milk in blow-molded HDPE bottles, PET beverage bottles, cookie bags and cartons lined with polyolefin coextrusions instead of waxed glassine, and bread in reclosable polyolefin and coextruded film bags. New phrases have also worked their way into the lexicon of the practic ing packaging technologist, such as "child resistance" and "tamper evident. " This most popular text on packaging demanded updating. How these phrases and ideas have affected the industry in the 1980s and how they will probably alter its course in the future are treated. New concepts of packaging system planning and forecasting tech niques are intruding into package management, and new chapters will introduce them to the reader. The years have added a certain degree of maturity to the packaging industry. Not only have the original authors broadened their per spectives and changed professional responsibilities, we have also in cluded a third co-author, Dr. Aaron L. Brody, whose experience in the industry, academic background, and erudite insights into the very na ture of packaging have added an unparalled degree of depth to this book. We would like to thank David L.
Author: Hermann J. Koch
Publisher: John Wiley & Sons
ISBN: 1119623618
Category : Technology & Engineering
Languages : en
Pages : 1237
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Book Description
GAS INSULATED SUBSTATIONS An essential reference guide to gas-insulated substations The second edition of Gas Insulated Substations (GIS) is an all-inclusive reference guide to gas insulated substations (GIS) and its advanced technologies. Updated to the latest technical developments and applications, the guide covers basic physics of gas insulated systems, SF6 insulating gas and its alternatives, safety aspects and factors to choose GIS. GIS technology, its modular structure, control and monitoring systems, testing, installation rules and guidelines for operation, specification, and maintenance. Detailed information on various types for GIS, with 14 reference project explanations and three extensive case studies give information for the best solutions of practical applications. Special solutions using mobile substations concepts, mixed technology switchgear (MTS) with air and gas insulated technology, underground substations, and the use of special GIS substation buildings e.g., shopping centers, parking lots, city parks, business complexes’ or subway stations are explained. Future developments of GIS technology are shown for the next steps in alternatives to SF6, low power instrument transformers, and digitalization of substations. A new chapter explains advanced technologies applied to GIS projects which cover the following; environmental issues for the substation permission process, insulation coordination studies for the network requirements including very fast transients, project scope development, risk-based asset management, health and safety impact, electromagnetic fields, SF6 decomposition byproducts and condition assessment. Disruptive development steps in gas insulated substations technologies are also covered in this second edition. Vacuum breaking and switching technology for rated voltages of up to 500 kV is explained in detail with its physical background. Principle function and possible implementation of low power instrument transformers (LPIT) are explained and examples of applications are given. The principles of digital twin for gas insulated substations (GIS) and gas insulated transmission lines (GIL) are explained in theory and project applications show the practical use and advantage. The wide and fast-growing technical field of offshore GIS applications for AC and DC is explained on many examples and gives information on special requirements when getting offshore. Theoretical requirements on DC gas insulated systems, methods of testing, prototype installation tests, modular design features, and advantages in applications are given. Finally, impact and advantages of digital substations using GIS are explained. Key features: Written by leading GIS experts involved in development and project applications Discusses practical and theoretical aspects Detailed material of GIS for new and experienced GIS users, and project planners Invaluable guide to practicing electrical, mechanical and civil engineers as well as third- and fourth-year electric power engineering students
Author: Beth Keser
Publisher: John Wiley & Sons
ISBN: 1119314135
Category : Technology & Engineering
Languages : en
Pages : 576
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Book Description
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
Author:
Publisher:
ISBN:
Category : Packaging
Languages : en
Pages : 54
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Book Description
Author: Alexandru Grumezescu
Publisher: Academic Press
ISBN: 0128166843
Category : Technology & Engineering
Languages : en
Pages : 462
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Book Description
Trends in Beverage Packaging, volume 16 in the Science of Beverages series, presents an interdisciplinary approach that provides a complete understanding of packaging theories, technologies and materials. This reference offers a broad perspective regarding current trends in packaging research, quality control techniques, packaging strategies and current concerns in the industry. Consumer demand for bottled and packaged beverages has increased, and the need for scientists and researchers to understand how to analyze quality, safety and control are essential. This is an all-encompassing resource for research and development in this flourishing field that covers everything from sensory and chemical composition, to materials and manufacturing. - Includes information on the monitoring of microbial activity using antimicrobial packaging detection of food borne pathogens - Presents the most up-to-date information on innovations in smart packaging and sensors for the beverages industry - Discusses the uses of natural and unnatural compounds for food safety and good manufacturing practices
Author: W.M. Wadman
Publisher: Routledge
ISBN: 1315501449
Category : Business & Economics
Languages : en
Pages : 334
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Book Description
Examines consumer decision-making on products and services of variable quality at the level of retail markets. Addresses for the first time consumer-producer interaction at the level of the individual consumer; issues of quality, consumption experience, and willingness-to-pay, as exhibited by individual consumers; and how these issues affect the decision-making process.
Author: Joseph F. Hanlon
Publisher: CRC Press
ISBN: 1498731937
Category : Technology & Engineering
Languages : en
Pages : 701
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Book Description
Now in its third edition, the Handbook of Package Engineering is still considered the standard industry reference on packaging materials and engineering. This text is a useful source of information for anyone involved in packaging. Designed as a refresher on packaging fundamentals, this complete guide also provides information on recent changes in
