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Author:
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ISBN:
Category :
Languages : en
Pages : 0
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Book Description
This is a Rapid Prototyping of Application Specific Signal Processors (RASSP) program funded by DARPA. The goal of this program is to develop languages, techniques, and tools for hardware, software cosynthesis of board and MCM-level Digital Signal Processing (DSP) systems from very high level requirements specifications. A second goal is to develop a usage guide for the Level 2 Waveform and Vector Exchange Specification (WAVES) language. The program includes the development of: (1) VSPEC, a declarative interface requirements specification language for VHDL entities, (2) hardware/software cosynthesis techniques for embedded DSP systems, (3) hierarchical multi-technology hardware partitioning tools, (4) software compilation techniques to compile behavioral VHDL into C, (5) a WAVES Level 2 usage guide, and (6) exploring WAVES usage in conjunction with BSDL and for hierarchical testing.
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
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Book Description
This is a Rapid Prototyping of Application Specific Signal Processors (RASSP) program funded by DARPA. The goal of this program is to develop languages, techniques, and tools for hardware, software cosynthesis of board and MCM-level Digital Signal Processing (DSP) systems from very high level requirements specifications. A second goal is to develop a usage guide for the Level 2 Waveform and Vector Exchange Specification (WAVES) language. The program includes the development of: (1) VSPEC, a declarative interface requirements specification language for VHDL entities, (2) hardware/software cosynthesis techniques for embedded DSP systems, (3) hierarchical multi-technology hardware partitioning tools, (4) software compilation techniques to compile behavioral VHDL into C, (5) a WAVES Level 2 usage guide, and (6) exploring WAVES usage in conjunction with BSDL and for hierarchical testing.
Author: Jun Dong Cho
Publisher: World Scientific
ISBN: 9814500267
Category : Technology & Engineering
Languages : en
Pages : 266
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Book Description
Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.
Author: Stanford University Stanford Electronics Laboratories. Digital Systems Laboratory
Publisher:
ISBN:
Category :
Languages : en
Pages : 48
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Book Description
Author: Jun-Dong Cho
Publisher: World Scientific
ISBN: 9789810223076
Category : Technology & Engineering
Languages : en
Pages : 272
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Book Description
Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.
Author:
Publisher:
ISBN:
Category : Computer engineering
Languages : en
Pages : 558
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Book Description
Author: Mark Birnbaum
Publisher: Prentice Hall Professional
ISBN: 9780131828292
Category : Technology & Engineering
Languages : en
Pages : 256
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Book Description
& Describes the engineering needs addressed by the individual EDA tools and covers EDA from both the provider and user viewpoints. & & Learn the importance of marketing and business trends in the EDA industry. & & The EDA consortium is made up of major corporations including SUN, HP, and Intel.
Author:
Publisher:
ISBN:
Category : Manufactures
Languages : en
Pages : 1956
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Book Description
This basic source for identification of U.S. manufacturers is arranged by product in a large multi-volume set. Includes: Products & services, Company profiles and Catalog file.
Author:
Publisher:
ISBN:
Category : CAD/CAM systems
Languages : en
Pages : 934
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Book Description
Author:
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ISBN:
Category : Computer-aided design
Languages : en
Pages : 758
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Book Description
The proceedings of the conference held in Anaheim, California, June 1992, comprise 125 papers organized into 44 sessions. There is increased emphasis on presentations (short tutorials, panels, and selected papers) of interest to the design automation user community, with a better balance between the
Author: Jörg Franke
Publisher: Springer Nature
ISBN: 3030928543
Category : Technology & Engineering
Languages : en
Pages : 283
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Book Description
Light signals in optical waveguides can be used to transmit very large amounts of data quickly and largely without interference. In the industrial and infrastructural sectors, e.g. in the automotive and aerospace industries, the demand to further exploit this potential is therefore increasing. Which technologies can be used to effectively integrate systems that transmit data by means of light into existing components? This is a central question for current research. So far, there have been some technical limitations in this regard. For example, it is difficult to couple the signal of an optical waveguide to other optical waveguides without interruption. There is also a lack of suitable fabrication technologies for three-dimensional waveguides, as well as design and simulation environments for 3D opto-MID. This book addresses these and other challenges.
