Asymptotic Waveform Evaluation for timing analysis PDF Download
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Author: Lawrence T. Pillage
Publisher:
ISBN:
Category :
Languages : en
Pages : 71
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Book Description
Author: Lawrence T. Pillage
Publisher:
ISBN:
Category :
Languages : en
Pages : 71
Get Book Here
Book Description
Author: Jeong-Taek Kong
Publisher: Springer Science & Business Media
ISBN: 1461523214
Category : Technology & Engineering
Languages : en
Pages : 276
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Book Description
Digital Timing Macromodeling for VLSI Design Verification first of all provides an extensive history of the development of simulation techniques. It presents detailed discussion of the various techniques implemented in circuit, timing, fast-timing, switch-level timing, switch-level, and gate-level simulation. It also discusses mixed-mode simulation and interconnection analysis methods. The review in Chapter 2 gives an understanding of the advantages and disadvantages of the many techniques applied in modern digital macromodels. The book also presents a wide variety of techniques for performing nonlinear macromodeling of digital MOS subcircuits which address a large number of shortcomings in existing digital MOS macromodels. Specifically, the techniques address the device model detail, transistor coupling capacitance, effective channel length modulation, series transistor reduction, effective transconductance, input terminal dependence, gate parasitic capacitance, the body effect, the impact of parasitic RC-interconnects, and the effect of transmission gates. The techniques address major sources of errors in existing macromodeling techniques, which must be addressed if macromodeling is to be accepted in commercial CAD tools by chip designers. The techniques presented in Chapters 4-6 can be implemented in other macromodels, and are demonstrated using the macromodel presented in Chapter 3. The new techniques are validated over an extremely wide range of operating conditions: much wider than has been presented for previous macromodels, thus demonstrating the wide range of applicability of these techniques.
Author: Mustafa Celik
Publisher: Springer Science & Business Media
ISBN: 0306479710
Category : Technology & Engineering
Languages : en
Pages : 316
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Book Description
As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components. Once viewed as merely parasitics in terms of their relevance to the overall circuit behavior, the interconnect can now have a dominant impact on the IC area and performance. Beginning in the late 1980's there was significant research toward better modeling and characterization of the resistance, capacitance and ultimately the inductance of on-chip interconnect. IC Interconnect Analysis covers the state-of-the-art methods for modeling and analyzing IC interconnect based on the past fifteen years of research. This is done at a level suitable for most practitioners who work in the semiconductor and electronic design automation fields, but also includes significant depth for the research professionals who will ultimately extend this work into other areas and applications. IC Interconnect Analysis begins with an in-depth coverage of delay metrics, including the ubiquitous Elmore delay and its many variations. This is followed by an outline of moment matching methods, calculating moments efficiently, and Krylov subspace methods for model order reduction. The final two chapters describe how to interface these reduced-order models to circuit simulators and gate-level timing analyzers respectively. IC Interconnect Analysis is written for CAD tool developers, IC designers and graduate students.
Author: Wai-Kai Chen
Publisher: CRC Press
ISBN: 9781420049671
Category : Technology & Engineering
Languages : en
Pages : 1788
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Book Description
Over the years, the fundamentals of VLSI technology have evolved to include a wide range of topics and a broad range of practices. To encompass such a vast amount of knowledge, The VLSI Handbook focuses on the key concepts, models, and equations that enable the electrical engineer to analyze, design, and predict the behavior of very large-scale integrated circuits. It provides the most up-to-date information on IC technology you can find. Using frequent examples, the Handbook stresses the fundamental theory behind professional applications. Focusing not only on the traditional design methods, it contains all relevant sources of information and tools to assist you in performing your job. This includes software, databases, standards, seminars, conferences and more. The VLSI Handbook answers all your needs in one comprehensive volume at a level that will enlighten and refresh the knowledge of experienced engineers and educate the novice. This one-source reference keeps you current on new techniques and procedures and serves as a review for standard practice. It will be your first choice when looking for a solution.
Author: Luciano Lavagno
Publisher: CRC Press
ISBN: 1420007955
Category : Technology & Engineering
Languages : en
Pages : 608
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Book Description
Presenting a comprehensive overview of the design automation algorithms, tools, and methodologies used to design integrated circuits, the Electronic Design Automation for Integrated Circuits Handbook is available in two volumes. The second volume, EDA for IC Implementation, Circuit Design, and Process Technology, thoroughly examines real-time logic to GDSII (a file format used to transfer data of semiconductor physical layout), analog/mixed signal design, physical verification, and technology CAD (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability at the nanoscale, power supply network design and analysis, design modeling, and much more. Save on the complete set.
Author: Wai-Kai Chen
Publisher: CRC Press
ISBN: 0203009282
Category : Technology & Engineering
Languages : en
Pages : 314
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Book Description
As the complexity of electronic systems continues to increase, the micro-electronic industry depends upon automation and simulations to adapt quickly to market changes and new technologies. Compiled from chapters contributed to CRC's best-selling VLSI Handbook, this volume of the Principles and Applications in Engineering series covers a broad rang
Author: Balsha R. Stanisic
Publisher: Springer Science & Business Media
ISBN: 1461313996
Category : Technology & Engineering
Languages : en
Pages : 221
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Book Description
In the early days of VLSI, the design of the power distribution for an integrated cir cuit was rather simple. Power distribution --the design of the geometric topology for the network of wires that connect the various power supplies, the widths of the indi vidual segments for each of these wires, the number and location of the power I/O pins around the periphery of the chip --was simple because the chips were simpler. Few available wiring layers forced floorplans that allowed simple, planar (non-over lapping) power networks. Lower speeds and circuit density made the choice of the wire widths easier: we made them just fat enough to avoid resistive voltage drops due to switching currents in the supply network. And we just didn't need enormous num bers of power and ground pins on the package for the chips to work. It's not so simple any more. Increased integration has forced us to focus on reliability concerns such as metal elec tromigration, which affects wire sizing decisions in the power network. Extra metal layers have allowed more flexibility in the topological layout of the power networks.
Author: Clayton R. Paul
Publisher: John Wiley & Sons
ISBN: 0470131543
Category : Technology & Engineering
Languages : en
Pages : 821
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Book Description
The essential textbook for electrical engineering students and professionals-now in a valuable new edition The increasing use of high-speed digital technology requires that all electrical engineers have a working knowledge of transmission lines. However, because of the introduction of computer engineering courses into already-crowded four-year undergraduate programs, the transmission line courses in many electrical engineering programs have been relegated to a senior technical elective, if offered at all. Now, Analysis of Multiconductor Transmission Lines, Second Edition has been significantly updated and reorganized to fill the need for a structured course on transmission lines in a senior undergraduate- or graduate-level electrical engineering program. In this new edition, each broad analysis topic, e.g., per-unit-length parameters, frequency-domain analysis, time-domain analysis, and incident field excitation, now has a chapter concerning two-conductor lines followed immediately by a chapter on MTLs for that topic. This enables instructors to emphasize two-conductor lines or MTLs or both. In addition to the reorganization of the material, this Second Edition now contains important advancements in analysis methods that have developed since the previous edition, such as methods for achieving signal integrity (SI) in high-speed digital interconnects, the finite-difference, time-domain (FDTD) solution methods, and the time-domain to frequency-domain transformation (TDFD) method. Furthermore, the content of Chapters 8 and 9 on digital signal propagation and signal integrity application has been considerably expanded upon to reflect all of the vital information current and future designers of high-speed digital systems need to know. Complete with an accompanying FTP site, appendices with descriptions of numerous FORTRAN computer codes that implement all the techniques in the text, and a brief but thorough tutorial on the SPICE/PSPICE circuit analysis program, Analysis of Multiconductor Transmission Lines, Second Edition is an indispensable textbook for students and a valuable resource for industry professionals.
Author: Hartmut Grabinski
Publisher: Springer Science & Business Media
ISBN: 1475765126
Category : Technology & Engineering
Languages : en
Pages : 150
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Book Description
This book comprises a selection of the most representative contributions to the 1st IEEE Workshop on Signal Propagation on Interconnects that was held at Travemunde, Germany, in May 1997. It represents, therefore, a survey of the actual problems currently concerning researchers and professionals in the field of signal propagation on interconnects. Signal Propagation on Interconnects contains chapters which cover a wide area of important research results dealing with simulation and measurement of noise and radiated emissions on boards, describing ground bounce effects as well as inductance calculations in multilayer packages. There is also reference and coverage of timing simulation techniques on chip as well as on board level. Signal Propagation on Interconnects is intended to give developers and researchers in the field of chip and package design a review of the state of the art regarding the influence of interconnect effects on the electrical performance of electronic circuits. In addition, the book illustrates ways to overcome performance problems related to the parasitic influences of interconnects. It is an invaluable text for circuit design engineers, developers and researchers in the field of signal integrity.
Author: Heow-pueh Lee
Publisher: World Scientific
ISBN: 9814480207
Category : Mathematics
Languages : en
Pages : 395
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Book Description
This volume documents the research carried out by visiting scientists attached to the Institute for Mathematical Sciences (IMS) at the National University of Singapore and the Institute of High Performance Computing (IHPC) under the program “Advances and Mathematical Issues in Large Scale Simulation.” From 2002 to 2003, researchers from various countries gathered to initiate interesting and innovative work on various themes related to multiscale simulation and fast algorithms.Today, modeling and simulation are used extensively to solve complex problems and to reduce the use of experimentation during the design and analysis stage. It is important to know the various issues that have to be considered in the successful development of computational methodologies for such work.This volume is a compilation of the research by various visiting scientists in the area of modeling and multiscale simulation. Each article covers a major project and documents how computational methodology, mathematical modeling, high performance computing and simulation are combined in a multiscale scheme to solve a variety of complex problems. Some of these include the design, synthesis, processing, characterization and manufacture of nanomaterials and nanostructures, new algorithms for computational work, and grid computing.Through the included examples, readers can realize the vast potential of computational modeling and large scale simulation for the solution of problems in a variety of disciplines and applications.
