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Author: Ajay Pasupuleti
Publisher:
ISBN:
Category : Microelectromechanical systems
Languages : en
Pages : 290
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Book Description
"This research aims at analyzing the effective mechanical properties of thin film materials that are used in MEMS. Using the effective mechanical properties, reliable simulations of new or slightly altered designs can be performed successfully. The main reason for investigating effective material properties of MEMS devices is that the existing techniques can not provide consistent prediction of the mechanical properties without timely and costly physical prototyping if the device or the fabrication recipe is slightly altered. To achieve this goal, two approaches were investigated: soft computing and analytical. In the soft computing approach, the effective material properties are empirically modeled and estimated based on experimental data and the relationships between the parameters affecting the mechanical properties of devices are discovered. In this approach, 2D-search, Micro Genetic Algorithms, neural networks, and Radial Basis Functions Networks were explored for the search of the effective material properties of the thin films with the help of a Finite Element Analysis (FEA) and modeling the mechanical behavior such that the effective material properties can be estimated for a new device. In the analytical approach, the physical behavior of the thin films is modeled analytically using standard elastic theories such as Stoney's formulae. As a case study, bilayer cantilevers of various dimensions were fabricated for extracting the effective Young's modulus of thin film materials: Aluminum, TetraEthylOrthoSilicate (TEOS) based SiO2, and Polyimide. In addition, a Matlab® graphical user interface (GUI), STEAM, is developed which interfaces with Ansys®. In STEAM, a fuzzy confidence factor is also developed which interfaces with Ansys®. In STEAM, a fuzzy confidence factor is also developed to validate the reliability of the estimates based on factors such as facility and recipe dependent variables. The results obtained from both approaches generated comparable effective material properties which are in accord with the experimental measurements. The results show that effective material properties of thin films can be estimated so that reliable MEMS devices can be designed without timely and costly physical prototyping"--Abstract.
Author: Ajay Pasupuleti
Publisher:
ISBN:
Category : Microelectromechanical systems
Languages : en
Pages : 290
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Book Description
"This research aims at analyzing the effective mechanical properties of thin film materials that are used in MEMS. Using the effective mechanical properties, reliable simulations of new or slightly altered designs can be performed successfully. The main reason for investigating effective material properties of MEMS devices is that the existing techniques can not provide consistent prediction of the mechanical properties without timely and costly physical prototyping if the device or the fabrication recipe is slightly altered. To achieve this goal, two approaches were investigated: soft computing and analytical. In the soft computing approach, the effective material properties are empirically modeled and estimated based on experimental data and the relationships between the parameters affecting the mechanical properties of devices are discovered. In this approach, 2D-search, Micro Genetic Algorithms, neural networks, and Radial Basis Functions Networks were explored for the search of the effective material properties of the thin films with the help of a Finite Element Analysis (FEA) and modeling the mechanical behavior such that the effective material properties can be estimated for a new device. In the analytical approach, the physical behavior of the thin films is modeled analytically using standard elastic theories such as Stoney's formulae. As a case study, bilayer cantilevers of various dimensions were fabricated for extracting the effective Young's modulus of thin film materials: Aluminum, TetraEthylOrthoSilicate (TEOS) based SiO2, and Polyimide. In addition, a Matlab® graphical user interface (GUI), STEAM, is developed which interfaces with Ansys®. In STEAM, a fuzzy confidence factor is also developed which interfaces with Ansys®. In STEAM, a fuzzy confidence factor is also developed to validate the reliability of the estimates based on factors such as facility and recipe dependent variables. The results obtained from both approaches generated comparable effective material properties which are in accord with the experimental measurements. The results show that effective material properties of thin films can be estimated so that reliable MEMS devices can be designed without timely and costly physical prototyping"--Abstract.
Author: Patrick Waters
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Book Description
ABSTRACT: Thin films are used for a variety of applications, which can include electronic devices, optical coatings and decorative parts. They are used for their physical, electrical, magnetic, optical and mechanical properties, and many times these properties are required simultaneously. Obtaining these desired properties starts with the deposition process and they are verified by a number of analysis techniques after deposition. A DC magnetron sputter system was used here to deposit tungsten films, with film thickness and residual stress uniformity being of primary interest. The film thickness was measured to vary by up to 45 % from the center to outer edge of a 4" wafer. Ar pressure was found to influence the thin film residual stress with lower Ar pressures leading to compressive residual stress ( -1.5 GPa) and higher Ar pressures leading to tensile residual stress (1 GPa). Residual stress measurements of the tungsten films were made using a wafer curvature technique and X-ray diffraction. The results of the two techniques were compared and found to be within 20 %. Nanoindentation was used to analyze the mechanical properties of several types of thin films that are commonly used in microelectronic devices. Thin film reduced modulus, hardness, interfacial toughness and fracture toughness were some of the mechanical properties measured. Difficulties with performing shallow indents (less than 100 nm) were addressed, with proper calibration procedures for the indentation equipment and tip area function detailed. Pile-up during the indentation of soft films will lead to errors in the indentation contact depth and area, leading to an overestimation of the films' reduced modulus and hardness. A method was developed to account for pile-up in determining the indentation contact depth and calculating a new contact area for improving the analysis of reduced modulus and hardness. Residual stresses in thin films are normally undesired because in extreme cases they may result in thru-film cracking or interfacial film delamination. With the use of lithography techniques to pattern wafers with areas of an adhesion reducing layer, thin film delamination was controlled. The patterned delamination microchannels may be used as an alternative method of creating microchannels for fluid transport in MEMS devices. Delamination morphology was influenced by the amount of residual stress in the film and the critical buckling stress, which was primarily controlled by the width of the adhesion reducing layers.
Author: Richard Vinci
Publisher: Cambridge University Press
ISBN: 9781107413306
Category : Technology & Engineering
Languages : en
Pages : 566
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Book Description
An understanding of mechanical behavior is crucial for a wide variety of thin-film technologies such as semiconductor devices and packaging (including advanced interconnects, dielectrics and silicides), information storage media, hard coatings, microelectromechanical systems (MEMS), and biomedical devices. The influence of mechanical behavior is seen in thin-film performance and reliability, as well as morphology development during processing and service. The increased need for understanding of these properties has challenged modern materials science because concepts, models and techniques developed for bulk materials often do not apply in small dimensions. This book addresses key issues in the still growing field of thin-film mechanical behavior. Topics include: multilayer thin films; metallic thin films; epitaxy, deposition parameters, microstructure and stresses; thin films for applications in MEMS; polymer thin films; mechanical properties of amorphous and crystalline carbon; adhesion and fracture; reliability in microelectronics; and nanoindentation and advanced testing techniques.
Author: Osamu Tabata
Publisher: John Wiley & Sons
ISBN: 9783527314942
Category : Technology & Engineering
Languages : en
Pages : 328
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Book Description
This first book to cover exclusively and in detail the principles, tools and methods for determining the reliability of microelectromechanical materials, components and devices covers both component materials as well as entire MEMS devices. Divided into two major parts, following a general introductory chapter to reliability issues, the first part looks at the mechanical properties of the materials used in MEMS, explaining in detail the necessary measuring technologies -- nanoindenters, bulge methods, bending tests, tensile tests, and others. Part Two treats the actual devices, organized by important device categories such as pressure sensors, inertial sensors, RF MEMS, and optical MEMS.
Author: Han Sung Kim
Publisher:
ISBN:
Category : Finite element method
Languages : en
Pages : 139
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Book Description
Abstract: Simulation algorithms are developed for the prediction of effective elastic properties of NEMS (Nano-Electro Mechanical Systems) and MEMS (Micro-Electro Mechanical Systems) thin films. Finite Element Method (FEM) is used for micro-scale simulation while ab-initio Molecular Dynamics (MD) is employed for nano-scale. A lattice model is utilized in order to simulate microstructures of thin films. The proposed method can generate a statistically equivalent microstructure to any single phase micrograph in terms of the number of grains and the grain size distribution. A desired grain size distribution (GSD) is achieved by manipulating nucleation process. Analytical functions for GSD are obtained by taking into account of the domain size and the number of grains. It is believed that nucleation and growth can be controlled by temperature and pressure. The influence of temperature and pressure on the grain size as well as the grain size distribution is investigated. A quasi-3D mesh of the thin film is generated by employing prism elements. By applying specific boundary conditions to the quasi-3D meshed microstructure, the elastic properties of MEMS thin films are obtained through FEM analysis. The simulation results show that stochastic distributions of grain anisotropy have a significant influence on overall elastic properties at micro-scale. A fundamental statistical methodology is adopted to characterize elastic properties of thin films. For nano-scale simulations, the bulk modulus (and other elastic properties) can be influenced by grain boundary when grain boundary volume fraction is not negligible. Consequently, it is desirable to determine the size limit when the grain boundary begins to influence the bulk modulus significantly. The developed MD simulation algorithm found that 6nm is the critical grain size for polysilicon. Moreover, equations are derived from the simulation results for estimating bulk modulus by considering both grain and grain boundary. The developed MD simulation technique can be used to characterize bulk modulus of NEMS materials and to determine the size limit above which grain boundary can be ignored in bulk modulus simulation.
Author: Thomas E. Buchheit
Publisher: Cambridge University Press
ISBN: 9781558998292
Category : Technology & Engineering
Languages : en
Pages : 480
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Book Description
This book has a long tradition of representing current topics in thin-film properties and how they are related to the performance and reliability of thin-film structures. Several emerging and well-developed technologies rely on understanding the behavior of these structures. This book provides a forum for an exchange of ideas among researchers who are interested in the mechanical behavior of thin films, broadly applied to their materials choice or methodology. The book focuses on stress-related phenomena in thin films for a wide range of materials. Of particular interest are studies that explore the frontiers of thin-film materials science with regard to materials selection or size scale. Topics include: elasticity in thin films; characterizing thin films by nanoindentation; mechanical behavior of nanostructured films; mechanical properties of thin; thin-film plasticity; thin-film plasticity; thin-film plasticity; novel testing techniques; in situ characterization techniques; adhesion and fracture of thin films; fatigue and stress in interconnect and metallization; deformation, growth and microstructure in thin films and thin-film processing.
Author: Amer Society Composi
Publisher: CRC Press
ISBN: 9781566763769
Category : Technology & Engineering
Languages : en
Pages : 670
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Book Description
Conference proceedings from the American Society of Composites, Tenth Technology Proceedings: Composite Materials, Mechanics and Processing on October 18-20, 1995 at the Miramar Sheraton Hotel Santa Monica, California
Author: Y.L. Bai
Publisher: Springer Science & Business Media
ISBN: 1402056249
Category : Technology & Engineering
Languages : en
Pages : 260
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Book Description
This volume contains the proceedings of the IUTAM Symposium on Mechanical Behavior and Micro-mechanics of Nanostructured Materials, held in Beijing on June 27-30, 2005. The proceedings consist of approximately 30 presentations. Nano-scale, micro-scale, theoretical, experimental and numerical aspects of the subjects are covered. A wide scope of research and progress are displayed. This is the first work in print on this particular subject.
Author:
Publisher:
ISBN:
Category : Thin films
Languages : en
Pages : 576
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Book Description
Author: Paul H. Townsend
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 808
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
