Author: Anders Nilsson
Publisher: Elsevier
ISBN: 0080551912
Category : Science
Languages : en
Pages : 533
Get Book Here
Book Description
Molecular surface science has made enormous progress in the past 30 years. The development can be characterized by a revolution in fundamental knowledge obtained from simple model systems and by an explosion in the number of experimental techniques. The last 10 years has seen an equally rapid development of quantum mechanical modeling of surface processes using Density Functional Theory (DFT). Chemical Bonding at Surfaces and Interfaces focuses on phenomena and concepts rather than on experimental or theoretical techniques. The aim is to provide the common basis for describing the interaction of atoms and molecules with surfaces and this to be used very broadly in science and technology. The book begins with an overview of structural information on surface adsorbates and discusses the structure of a number of important chemisorption systems. Chapter 2 describes in detail the chemical bond between atoms or molecules and a metal surface in the observed surface structures. A detailed description of experimental information on the dynamics of bond-formation and bond-breaking at surfaces make up Chapter 3. Followed by an in-depth analysis of aspects of heterogeneous catalysis based on the d-band model. In Chapter 5 adsorption and chemistry on the enormously important Si and Ge semiconductor surfaces are covered. In the remaining two Chapters the book moves on from solid-gas interfaces and looks at solid-liquid interface processes. In the final chapter an overview is given of the environmentally important chemical processes occurring on mineral and oxide surfaces in contact with water and electrolytes. - Gives examples of how modern theoretical DFT techniques can be used to design heterogeneous catalysts - This book suits the rapid introduction of methods and concepts from surface science into a broad range of scientific disciplines where the interaction between a solid and the surrounding gas or liquid phase is an essential component - Shows how insight into chemical bonding at surfaces can be applied to a range of scientific problems in heterogeneous catalysis, electrochemistry, environmental science and semiconductor processing - Provides both the fundamental perspective and an overview of chemical bonding in terms of structure, electronic structure and dynamics of bond rearrangements at surfaces
Author: Department of Department of Defense
Publisher:
ISBN: 9781986310178
Category :
Languages : en
Pages : 396
Get Book Here
Book Description
MIL-HDBK-419A 29 DECEMBER 1987 Volume 2 of 2 Applications Unfortunately, few Military Handbooks address the need for defense against electromagnetic pulse (EMP) and cybersecurity. While EMP has been thought of as a remote possibility (who in his right mind is going to launch a nuclear weapon of any kind against the U.S.?) Advances in non-nuclear EMP, miniaturization of electronics and autonomous drones suddenly brings EMP into the role of the possible. No longer would an adversary need to risk retaliation when a drone from an unknown source attacks a vital facility. The information in this book is part of the solution to the question "How do we defend against EMP?" List of Applicable EMP and Cybersecurity Publications: MIL-STD-188-125-1 High-altitude electromagnetic pulse (HEMP) Protection For Ground-Based C4I Facilities Performing Critical, Time-Urgent Missions MIL-STD-188-124A Grounding, Bonding and Shielding for Common Long Haul/Tactical Communication Systems MIL-HDBK -1195 Radio Frequency Shielded Enclosures TOP 01-2-620 High-Altitude Electromagnetic Pulse (HEMP) Testing MIL-HDBK-1012/1 Electronic Facilities Engineering MIL-HDBK-1013/1A Design Guidelines for Physical Security of Facilities
Author: J. Paul Guyer, P.E., R.A.
Publisher: Guyer Partners
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 49
Get Book Here
Book Description
Introductory technical guidance for electrical and telecommunications engineers interested in telecommunication cabling systems. Here is what is discussed: 1. INTRODUCTION 2. BUILDING TELECOMMUNICATIONS CABLING SYSTEM SPECIFICATIONS 3. BUILDING TELECOMMUNICATIONS WIRING 4. BUILDING INFRASTRUCTURE 5. TELECOMMUNICATIONS ROOM 6. EQUIPMENT ROOM 7. GROUNDING 8. TELECOMMUNICATIONS SYSTEM LABELING 9. BUILDING ENTRANCE FACILITY 10. TESTING 11. APPENDIX A: REFERENCES 12. APPENDIX B: FIGURES.
Author: J. Paul Guyer, P.E., R.A.
Publisher: Guyer Partners
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 395
Get Book Here
Book Description
Introductory technical guidance for electrical engineers and construction managers interested in electric power distribution. Here is what is discussed: 1. 400 HZ SYSTEMS 2. POWER REQUIREMENTS FOR BUILDINGS 3. EXTERIOR POWER DISTRIBUTION 4. INTERIOR POWER DISTRIBUTION 5. INTERIOR LIGHTING DESIGN 6. ELECTRICAL SYSTEMS FOR MEDICAL FACILITIES 7. COMMUNICATION SYSTEMS FOR MEDICAL FACILITIES 8. LIGHTNING AND STATIC ELECTRICITY PROTECTION 9. SUSTAINABLE LIGHTING DESIGN 10. TELECOMMUNICATION CABLING SYSTEMS 11. TROPICAL ENGINEERING: MECHANICAL AND ELECTRICAL 12. UTILIDORS, POWER DISTRIBUTION AND COMMUNICATION SYSTEMS IN COLD REGIONS.
Author: Anna Rudawska
Publisher: Academic Press
ISBN: 0128170115
Category : Technology & Engineering
Languages : en
Pages : 292
Get Book Here
Book Description
Surface Treatment in Bonding Technology provides valuable advice on surface treatment methods, modern measuring devices, and the appropriate experimentation techniques that are essential to create strong joints with a reliable service life. The book's focus is on the detailed and up-to-date analysis of surface treatment methods for metallic and polymer substrates. An analysis of factors affecting the surface preparation stage, together with advice on selection, is also provided. Essential theory is combined with experimentation techniques and industry practice to provide a guide that is both practical and academically rigorous. Including a general introduction to bonding, as well as coverage of mechanical, chemical and electrochemical methods, this book is the ideal primer for anyone working with or researching adhesive bonding. - Provides detailed descriptions of surface treatments and their mechanisms that will help readers build a deep understanding of these fundamental techniques - Includes a thorough survey of recent advances in research in surface treatments of metals and polymers - Provides technical advice on experimental testing methods throughout the book
Author: J Paul Guyer
Publisher: Independently Published
ISBN:
Category :
Languages : en
Pages : 56
Get Book Here
Book Description
Introductory technical guidance for electrical engineers and construction managers interested in electrical design of electronic equipment buildings. Here is what is discussed: 1. DEFINITION OF BONDING, 2. PURPOSES OF BONDING, 3. RESISTANCE CRITERIA, 4. DIRECT BONDS, 5. INDIRECT BONDS, 6. SURFACE PREPARATION, 7. COMPLETION OF THE BOND, 8. BOND CORROSION, 9. WORKMANSHIP, 10. SUMMARY OF GUIDELINES.
Author: James J. Licari
Publisher: William Andrew
ISBN: 1437778909
Category : Technology & Engineering
Languages : en
Pages : 415
Get Book Here
Book Description
Approx.512 pagesApprox.512 pages
Author: Valentine Korah
Publisher:
ISBN:
Category : Antitrust law
Languages : en
Pages : 2354
Get Book Here
Book Description
Author: Paul Flowers
Publisher:
ISBN: 9781951693008
Category :
Languages : en
Pages : 0
Get Book Here
Book Description
Chemistry 2e is designed to meet the scope and sequence requirements of the two-semester general chemistry course. The textbook provides an important opportunity for students to learn the core concepts of chemistry and understand how those concepts apply to their lives and the world around them. The book also includes a number of innovative features, including interactive exercises and real-world applications, designed to enhance student learning. The second edition has been revised to incorporate clearer, more current, and more dynamic explanations, while maintaining the same organization as the first edition. Substantial improvements have been made in the figures, illustrations, and example exercises that support the text narrative. Changes made in Chemistry 2e are described in the preface to help instructors transition to the second edition.
Author: Sina Ebnesajjad
Publisher: William Andrew
ISBN: 0323356028
Category : Technology & Engineering
Languages : en
Pages : 437
Get Book Here
Book Description
Covering a wide range of industrial applications across sectors including medical applications, automotive/aerospace, packaging, electronics, and consumer goods, this book provides a complete guide to the selection of adhesives, methods of use, industrial applications, and the fundamentals of adhesion. Dr Ebnesajjad examines the selection of adhesives and adhesion methods and challenges for all major groups of substrate including plastics (thermosets and thermoplastics), elastomers, metals, ceramics and composite materials. His practical guidance covers joint design and durability, application methods, test methods and troubleshooting techniques. The science and technology of adhesion, and the principles of adhesive bonding are explained in a way that enhances the reader's understanding of the fundamentals that underpin the successful use and design of adhesives. The third edition has been updated throughout to include recent developments in the industry, with new sections covering technological advances such as nanotechnology, micro adhesion systems, and the replacement of toxic chromate technology. Provides practitioners of adhesion technology with a complete guide to bonding materials successfully Covers the whole range of commonly used substrates including plastics, metals, elastomers and ceramics, explaining basic principles and describing common materials and application techniques Introduces the range of commercially available adhesives and the selection process alongside the science and technology of adhesion
