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Author: Pin Su
Publisher:
ISBN:
Category :
Languages : en
Pages : 298
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Book Description
Author: Pin Su
Publisher:
ISBN:
Category :
Languages : en
Pages : 298
Get Book Here
Book Description
Author: Takayasu Sakurai
Publisher: Springer Science & Business Media
ISBN: 0387292187
Category : Technology & Engineering
Languages : en
Pages : 420
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Book Description
Fully-depleted SOI CMOS Circuits and Technology for Ultralow-Power Applications addresses the problem of reducing the supply voltage of conventional circuits for ultralow-power operation and explains power-efficient MTCMOS circuit design for FD-SOI devices at a supply voltage of 0.5 V. The topics include the minimum required knowledge of the fabrication of SOI substrates; FD-SOI devices and the latest developments in device and process technologies; and ultralow-voltage circuits, such as digital circuits, analog/RF circuits, and DC-DC converters. Each ultra-low-power technique related to devices and circuits is fully explained using figures to help understanding.
Author: Chenming Hu
Publisher: Woodhead Publishing
ISBN: 0081024029
Category : Technology & Engineering
Languages : en
Pages : 260
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Book Description
Industry Standard FDSOI Compact Model BSIM-IMG for IC Design helps readers develop an understanding of a FDSOI device and its simulation model. It covers the physics and operation of the FDSOI device, explaining not only how FDSOI enables further scaling, but also how it offers unique possibilities in circuits. Following chapters cover the industry standard compact model BSIM-IMG for FDSOI devices. The book addresses core surface-potential calculations and the plethora of real devices and potential effects. Written by the original developers of the industrial standard model, this book is an excellent reference for the new BSIM-IMG compact model for emerging FDSOI technology. The authors include chapters on step-by-step parameters extraction procedure for BSIM-IMG model and rigorous industry grade tests that the BSIM-IMG model has undergone. There is also a chapter on analog and RF circuit design in FDSOI technology using the BSIM-IMG model. - Provides a detailed discussion of the BSIM-IMG model and the industry standard simulation model for FDSOI, all presented by the developers of the model - Explains the complex operation of the FDSOI device and its use of two independent control inputs - Addresses the parameter extraction challenges for those using this model
Author: Kerry Bernstein
Publisher: Springer Science & Business Media
ISBN: 0387740996
Category : Technology & Engineering
Languages : en
Pages : 232
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Book Description
This book first introduces SOI device physics and its fundamental idiosyncrasies. It then walks the reader through realizations of these mechanisms, which are observed in common high-speed microprocessor designs. The book also offers rules of thumb and comparisons to conventional bulk CMOS to guide implementation and describes a number of unique circuit topologies that SOI supports.
Author: Stephen J. Gaul
Publisher: John Wiley & Sons
ISBN: 1119966345
Category : Technology & Engineering
Languages : en
Pages : 404
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Book Description
A practical guide to the effects of radiation on semiconductor components of electronic systems, and techniques for the designing, laying out, and testing of hardened integrated circuits This book teaches the fundamentals of radiation environments and their effects on electronic components, as well as how to design, lay out, and test cost-effective hardened semiconductor chips not only for today’s space systems but for commercial terrestrial applications as well. It provides a historical perspective, the fundamental science of radiation, and the basics of semiconductors, as well as radiation-induced failure mechanisms in semiconductor chips. Integrated Circuits Design for Radiation Environments starts by introducing readers to semiconductors and radiation environments (including space, atmospheric, and terrestrial environments) followed by circuit design and layout. The book introduces radiation effects phenomena including single-event effects, total ionizing dose damage and displacement damage) and shows how technological solutions can address both phenomena. Describes the fundamentals of radiation environments and their effects on electronic components Teaches readers how to design, lay out and test cost-effective hardened semiconductor chips for space systems and commercial terrestrial applications Covers natural and man-made radiation environments, space systems and commercial terrestrial applications Provides up-to-date coverage of state-of-the-art of radiation hardening technology in one concise volume Includes questions and answers for the reader to test their knowledge Integrated Circuits Design for Radiation Environments will appeal to researchers and product developers in the semiconductor, space, and defense industries, as well as electronic engineers in the medical field. The book is also helpful for system, layout, process, device, reliability, applications, ESD, latchup and circuit design semiconductor engineers, along with anyone involved in micro-electronics used in harsh environments.
Author: Electrochemical Society. Meeting
Publisher: The Electrochemical Society
ISBN: 9781566773751
Category : Science
Languages : en
Pages : 538
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Book Description
Author: Luciano Lavagno
Publisher: CRC Press
ISBN: 1351831003
Category : Technology & Engineering
Languages : en
Pages : 893
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Book Description
The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.
Author: Andrew Marshall
Publisher: Springer Science & Business Media
ISBN: 0306481618
Category : Technology & Engineering
Languages : en
Pages : 410
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Book Description
This title introduces state-of-the-art design principles for SOI circuit design, and is primarily concerned with circuit-related issues. It considers SOI material in terms of implementation that is promising or has been used elsewhere in circuit development, with historical perspective where appropriate.
Author: Konstantin Volkov
Publisher: BoD – Books on Demand
ISBN: 1789238692
Category : Computers
Languages : en
Pages : 148
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Book Description
The accurate prediction of multi-physical and multi-scale physical/chemical/mechanical processes in engineering remains a challenging problem despite considerable work in this area and the acceptance of finite element analysis and computational fluid dynamics as design tools. This book intends to provide the reader with an overview of the latest developments in computational techniques used in various engineering disciplines. The book includes leading-edge scientific contributions of computational and applied mathematics, computer science and engineering focusing on the modelling and simulation of complex engineering systems and multi-physical/multi-scale engineering problems. The following topics are covered: numerical analysis and algorithms, software development, coupled analysis, multi-criteria optimization as they applied to all kinds of applied and emerging problems in energy systems, additive manufacturing, propulsion systems, and thermal engineering.
Author: Peter L. F. Hemment
Publisher: The Electrochemical Society
ISBN: 9781566772259
Category : Technology & Engineering
Languages : en
Pages : 392
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Book Description
