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Author: F. Roozeboom
Publisher: Springer Science & Business Media
ISBN: 9401587116
Category : Science
Languages : en
Pages : 568
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Book Description
Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.
Author: F. Roozeboom
Publisher: Springer Science & Business Media
ISBN: 9401587116
Category : Science
Languages : en
Pages : 568
Get Book Here
Book Description
Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.
Author: Fred Roozeboom
Publisher: The Electrochemical Society
ISBN: 9781566772327
Category : Technology & Engineering
Languages : en
Pages : 470
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Book Description
Author:
Publisher:
ISBN:
Category : Rapid thermal processing
Languages : en
Pages : 534
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Book Description
Author: F. Roozeboom
Publisher:
ISBN: 9789401587129
Category :
Languages : en
Pages : 580
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Book Description
Author: Yoshio Nishi
Publisher: CRC Press
ISBN: 1351829823
Category : Technology & Engineering
Languages : en
Pages : 3276
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Book Description
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Author: Mac E. Van Valkenburg
Publisher: Newnes
ISBN: 9780750672917
Category : Technology & Engineering
Languages : en
Pages : 1696
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Book Description
This standard handbook for engineers covers the fundamentals, theory and applications of radio, electronics, computers, and communications equipment. It provides information on essential, need-to-know topics without heavy emphasis on complicated mathematics. It is a "must-have" for every engineer who requires electrical, electronics, and communications data. Featured in this updated version is coverage on intellectual property and patents, probability and design, antennas, power electronics, rectifiers, power supplies, and properties of materials. Useful information on units, constants and conversion factors, active filter design, antennas, integrated circuits, surface acoustic wave design, and digital signal processing is also included. This work also offers new knowledge in the fields of satellite technology, space communication, microwave science, telecommunication, global positioning systems, frequency data, and radar.
Author: Xinghuo Yu
Publisher: Springer
ISBN: 3319182900
Category : Technology & Engineering
Languages : en
Pages : 460
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Book Description
This volume is dedicated to Professor Okyay Kaynak to commemorate his life time impactful research and scholarly achievements and outstanding services to profession. The 21 invited chapters have been written by leading researchers who, in the past, have had association with Professor Kaynak as either his students and associates or colleagues and collaborators. The focal theme of the volume is the Sliding Modes covering a broad scope of topics from theoretical investigations to their significant applications from Control to Intelligent Mechatronics.
Author: Wolfgang Skorupa
Publisher: Springer Science & Business Media
ISBN: 3319031317
Category : Technology & Engineering
Languages : en
Pages : 330
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Book Description
The thermal processing of materials ranges from few fem to seconds by Swift Heavy Ion Implantation to about one second using advanced Rapid Thermal Annealing. This book offers after an historical excursus selected contributions on fundamental and applied aspects of thermal processing of classical elemental semiconductors and other advanced materials including nanostructures with novel optoelectronic, magnetic, and superconducting properties. Special emphasis is given on the diffusion and segregation of impurity atoms during thermal treatment. A broad range of examples describes the solid phase and/or liquid phase processing of elemental and compound semiconductors, dielectric composites and organic materials.
Author: Badih El-Kareh
Publisher: Springer Science & Business Media
ISBN: 0387690107
Category : Technology & Engineering
Languages : en
Pages : 614
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Book Description
Silicon Devices and Process Integration covers state-of-the-art silicon devices, their characteristics, and their interactions with process parameters. It serves as a comprehensive guide which addresses both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. The book is compiled from the author’s industrial and academic lecture notes and reflects years of experience in the development of silicon devices. Features include: A review of silicon properties which provides a foundation for understanding the device properties discussion, including mobility-enhancement by straining silicon; State-of-the-art technologies on high-K gate dielectrics, low-K dielectrics, Cu interconnects, and SiGe BiCMOS; CMOS-only applications, such as subthreshold current and parasitic latch-up; Advanced Enabling processes and process integration. This book is written for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science.
Author:
Publisher: Academic Press
ISBN: 0123785650
Category : Science
Languages : en
Pages : 479
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Book Description
This book describes the practice of radiation thermometry, both at a primary level and for a variety of applications, such as in the materials processing industries and remote sensing. This book is written for those who will a) apply radiation thermometry in industrial practice b) use radiation thermometers for scientific research, c) the radiation thermometry specialist in a national measurement institute d) developers of radiation thermometers who are working to innovate products for instrument manufacturers and e) developers non-contact thermometry methods to address challenging thermometry problems. The author(s) of each chapter were chosen from a group of international scientists who are experts in the field and specialist(s) on the subject matter covered in the chapter. A large number of references are included at the end of each chapter as a resource for those seeking a deeper or more detailed understanding. This book is more than a practice guide. Readers will gain in-depth knowledge in: (1) the proper selection of the type of thermometer; (2) the best practice in using the radiation thermometers; (3) awareness of the error sources and subsequent appropriate procedure to reduce the overall uncertainty; and (4) understanding of the calibration chain and its current limitations. - Coverage of all fundamental aspects of the radiometric measurements - Coverage of practical applications with details on the instrumentation, calibration, and error sources - Authors are from the national labs internationally leading in R&D in temperature measurements - Comprehensive coverage with large number of references
