Author: G. Russell
Publisher: Springer Science & Business Media
ISBN: 9780747600015
Category : Computers
Languages : en
Pages : 406

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Book Description

Author: M. Bushnell
Publisher: Springer Science & Business Media
ISBN: 0792379918
Category : Technology & Engineering
Languages : en
Pages : 712

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Book Description
The modern electronic testing has a forty year history. Test professionals hold some fairly large conferences and numerous workshops, have a journal, and there are over one hundred books on testing. Still, a full course on testing is offered only at a few universities, mostly by professors who have a research interest in this area. Apparently, most professors would not have taken a course on electronic testing when they were students. Other than the computer engineering curriculum being too crowded, the major reason cited for the absence of a course on electronic testing is the lack of a suitable textbook. For VLSI the foundation was provided by semiconductor device techn- ogy, circuit design, and electronic testing. In a computer engineering curriculum, therefore, it is necessary that foundations should be taught before applications. The field of VLSI has expanded to systems-on-a-chip, which include digital, memory, and mixed-signalsubsystems. To our knowledge this is the first textbook to cover all three types of electronic circuits. We have written this textbook for an undergraduate “foundations” course on electronic testing. Obviously, it is too voluminous for a one-semester course and a teacher will have to select from the topics. We did not restrict such freedom because the selection may depend upon the individual expertise and interests. Besides, there is merit in having a larger book that will retain its usefulness for the owner even after the completion of the course. With equal tenacity, we address the needs of three other groups of readers.

Author: John B. Gosling
Publisher: Cambridge University Press
ISBN: 9780521426725
Category : Computers
Languages : en
Pages : 302

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Book Description
This description of the structure of simulators suitable for use in the design of digital electronic systems includes the compiled code and event driven algorithms for digital electronic system simulators, together with timing verification as well as structural limitations and problems.

Author: Stanley Leonard Hurst
Publisher: IET
ISBN: 9780852969014
Category : Computers
Languages : en
Pages : 560

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Book Description
Hurst, an editor at the Microelectronics Journal, analyzes common problems that electronics engineers and circuit designers encounter while testing integrated circuits and the systems in which they are used, and explains a variety of solutions available for overcoming them in both digital and mixed circuits. Among his topics are faults in digital circuits, generating a digital test pattern, signatures and self-tests, structured design for testability, testing structured digital circuits and microprocessors, and financial aspects of testing. The self- contained reference is also suitable as a textbook in a formal course on the subject. Annotation copyrighted by Book News, Inc., Portland, OR

Author: Suman Lata Tripathi
Publisher: CRC Press
ISBN: 1000168158
Category : Technology & Engineering
Languages : en
Pages : 379

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Book Description
This book facilitates the VLSI-interested individuals with not only in-depth knowledge, but also the broad aspects of it by explaining its applications in different fields, including image processing and biomedical. The deep understanding of basic concepts gives you the power to develop a new application aspect, which is very well taken care of in this book by using simple language in explaining the concepts. In the VLSI world, the importance of hardware description languages cannot be ignored, as the designing of such dense and complex circuits is not possible without them. Both Verilog and VHDL languages are used here for designing. The current needs of high-performance integrated circuits (ICs) including low power devices and new emerging materials, which can play a very important role in achieving new functionalities, are the most interesting part of the book. The testing of VLSI circuits becomes more crucial than the designing of the circuits in this nanometer technology era. The role of fault simulation algorithms is very well explained, and its implementation using Verilog is the key aspect of this book. This book is well organized into 20 chapters. Chapter 1 emphasizes on uses of FPGA on various image processing and biomedical applications. Then, the descriptions enlighten the basic understanding of digital design from the perspective of HDL in Chapters 2–5. The performance enhancement with alternate material or geometry for silicon-based FET designs is focused in Chapters 6 and 7. Chapters 8 and 9 describe the study of bimolecular interactions with biosensing FETs. Chapters 10–13 deal with advanced FET structures available in various shapes, materials such as nanowire, HFET, and their comparison in terms of device performance metrics calculation. Chapters 14–18 describe different application-specific VLSI design techniques and challenges for analog and digital circuit designs. Chapter 19 explains the VLSI testability issues with the description of simulation and its categorization into logic and fault simulation for test pattern generation using Verilog HDL. Chapter 20 deals with a secured VLSI design with hardware obfuscation by hiding the IC’s structure and function, which makes it much more difficult to reverse engineer.

Author: Peter J. Ashenden
Publisher: Springer Science & Business Media
ISBN: 1475732813
Category : Computers
Languages : en
Pages : 337

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Book Description
System-on-Chip Methodologies & Design Languages brings together a selection of the best papers from three international electronic design language conferences in 2000. The conferences are the Hardware Description Language Conference and Exhibition (HDLCon), held in the Silicon Valley area of USA; the Forum on Design Languages (FDL), held in Europe; and the Asia Pacific Chip Design Language (APChDL) Conference. The papers cover a range of topics, including design methods, specification and modeling languages, tool issues, formal verification, simulation and synthesis. The results presented in these papers will help researchers and practicing engineers keep abreast of developments in this rapidly evolving field.

Author: V. Litovski
Publisher: Springer Science & Business Media
ISBN: 9780412638602
Category : Technology & Engineering
Languages : en
Pages : 370

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Book Description
Circuit simulation has become an essential tool in circuit design and without it's aid, analogue and mixed-signal IC design would be impossible. However the applicability and limitations of circuit simulators have not been generally well understood and this book now provides a clear and easy to follow explanation of their function. The material covered includes the algorithms used in circuit simulation and the numerical techniques needed for linear and non-linear DC analysis, transient analysis and AC analysis. The book goes on to explain the numeric methods to include sensitivity and tolerance analysis and optimisation of component values for circuit design. The final part deals with logic simulation and mixed-signal simulation algorithms. There are comprehensive and detailed descriptions of the numerical methods and the material is presented in a way that provides for the needs of both experienced engineers who wish to extend their knowledge of current tools and techniques, and of advanced students and researchers who wish to develop new simulators.

Author: Stanley L. Hurst
Publisher: CRC Press
ISBN: 0824746406
Category : Technology & Engineering
Languages : en
Pages : 489

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Book Description
Focuses on the design and production of integrated circuits specifically designed for a particular application from original equipment manufacturers. The book outlines silicon and GaAs semiconductor fabrication techniques and circuit configurations; compares custom design style; discusses computer-aided design tools; and more.

Author: Peter Shepherd
Publisher: Bloomsbury Publishing
ISBN: 1349136565
Category : Technology & Engineering
Languages : en
Pages : 239

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Book Description
Integrated circuits have revolutionised the world of electronics and the associated areas of computing and communication. In past years the tasks of designing, manufacturing and testing these types of circuit were restricted to a few specialist engineers. However, within recent years the proliferation of computer tools and affordable access to IC manufacturing foundries has resulted in a substantial increase in the number of people designing ICs for the first time, both in universities and colleges and in industry. This book introduces the reader to all aspects of IC design, manufacture and testing with a minimum of mathematics, but with relevant examples at each stage. It examines the overall design strategies, the engineering trade-offs and the advantages, disadvantages and optimum applications of each available technology.

Author: Karl J. Puttlitz
Publisher: Springer Science & Business Media
ISBN: 1461513898
Category : Technology & Engineering
Languages : en
Pages : 1250

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Book Description
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.