Author: Shi-Yong Yang
Publisher: Elsevier
ISBN: 0128126418
Category : Technology & Engineering
Languages : en
Pages : 499
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Book Description
Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research. The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation. - Reviews the latest research, development and future prospective of polyimides - Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers - Presents a highly organized work that is composed of different sections that are easily compared
Author: Beth Keser
Publisher: John Wiley & Sons
ISBN: 1119314135
Category : Technology & Engineering
Languages : en
Pages : 576
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Book Description
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
Author: Kash L. Mittal
Publisher: CRC Press
ISBN: 9067644226
Category : Technology & Engineering
Languages : en
Pages : 582
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Book Description
This volume chronicles the proceedings of the Third International Symposium on Polyimides and Other High Temperature Polymers: Synthesis, Characterization, and Applications, held in Orlando, December 17-19, 2003. This volume is divided into three parts. Part 1. “Synthesis, Properties and Bulk Characterization”; Part 2 “Hybrids and Composites” and Part 3 “Applications and General Papers”. The topics covered include: Synthesis, characterization and processing (including some novel approaches) of a variety of polyimides and other high temperature polymers; structure-property relationships; hybrids and nanocomposites using these materials and their characterization, properties and applications; segmental dynamics in polyimide materials; photoalignable polyimides; photoconductivity and photosensitivity of polyimides; ultrafiltration membranes from polyetherimide; polyimide as a tunneling barrier; polymer materials for nonlinear optical applications; alignment of SWNTs in rigid-rod polymer compositions; surface modification of polyimide; adhesion of Cu to polyimide surfaces; and polyimide erosion in a low Earth orbit space environment.
Author: Doug Wilson
Publisher: Springer
ISBN: 9789401096638
Category : Science
Languages : en
Pages : 297
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Book Description
The last twenty years or so have seen a flurry of activity in the synthesis of new polymer systems. This interest has developed largely as a result of the increased need for advanced materials. Despite the emergence of a number of outstanding polymers, it is the polyimides that have captured the imagination of scientists and engineers alike as materials that offer outstanding promise for the high technology applic ations of the future. The reputation of the polyimide has been established on the bases of outstanding thermal stability, excellent mechanical properties and the ability to be fabricated into useful articles. Polyimides offer a versatility unparalleled in most other classes of macromolecules. Polymers can be prepared from a variety of starting materials, by a variety of synthetic routes. They can be tailor-made to suit specific applications. By judicious choice of starting materials, polymers can be made that offer variations in such properties as glass transition tempera ture, oxidative stability, toughness, adhesion, and permeability. It is this versatility that has led to the use of polyimides in a wide variety of applications. The electronics industry makes extensive use of poly imide films in, ior example, semiconductor applications. The leading polymer matrices for high temperature advanced composites are polyimides. High temperature adhesive systems for the bonding of metals or composites are often based on polyimides. In addition, polyimides are now finding use as fibres, foams, sealents and even membranes for the low energy separation of industrial gases.
Author: Marc Abadie
Publisher: BoD – Books on Demand
ISBN: 9535108999
Category : Science
Languages : en
Pages : 260
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Book Description
The feature of polyimides and other heterocyclic polymers are now well-established and used for long term temperature durability in the range of 250 - 350'C. This book will review synthesis, mechanisms, ultimate properties, physico-chemical properties, processing and applications of such high performance materials needed in advanced technologies. It presents interdisciplinary papers on the state of knowledge of each topic under consideration through a combination of overviews and original unpublished research. The volume contains eleven chapters divided into three sections: Chemistry; Chemical and Physical Properties; and Applications.
Author: Sombel Diaham
Publisher: BoD – Books on Demand
ISBN: 1838800972
Category : Technology & Engineering
Languages : en
Pages : 336
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Book Description
Polyimide is one of the most efficient polymers in many industries for its excellent thermal, electrical, mechanical, and chemical properties as well as its easy processability. In the electronic and electrical engineering industries, polyimide has widely been used for decades thanks to its very good dielectric and insulating properties at the high electric field and at high temperatures of around 200°C in long term-service. Moreover, polyimide appears essential for the development of new electronic devices where further considerations such as high power density, integration, higher temperature, thermal conduction management, energy storage, reliability, or flexibility are required in order to sustain the growing global electrical energy consumption. This book gathers interdisciplinary chapters on polyimide in various topics through state-of-the-art and original ongoing research.
Author: Xingyi Huang
Publisher: John Wiley & Sons
ISBN: 1119719658
Category : Technology & Engineering
Languages : en
Pages : 452
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Book Description
Explore the diverse electrical engineering application of polymer composite materials with this in-depth collection edited by leaders in the field Polymer Composites for Electrical Engineering delivers a comprehensive exploration of the fundamental principles, state-of-the-art research, and future challenges of polymer composites. Written from the perspective of electrical engineering applications, like electrical and thermal energy storage, high temperature applications, fire retardance, power cables, electric stress control, and others, the book covers all major application branches of these widely used materials. Rather than focus on polymer composite materials themselves, the distinguished editors have chosen to collect contributions from industry leaders in the area of real and practical electrical engineering applications of polymer composites. The books relevance will only increase as advanced polymer composites receive more attention and interest in the area of advanced electronic devices and electric power equipment. Unique amongst its peers, Polymer Composites for Electrical Engineering offers readers a collection of practical and insightful materials that will be of great interest to both academic and industrial audiences. Those resources include: A comprehensive discussion of glass fiber reinforced polymer composites for power equipment, including GIS, bushing, transformers, and more) Explorations of polymer composites for capacitors, outdoor insulation, electric stress control, power cable insulation, electrical and thermal energy storage, and high temperature applications A treatment of semi-conductive polymer composites for power cables In-depth analysis of fire-retardant polymer composites for electrical engineering An examination of polymer composite conductors Perfect for postgraduate students and researchers working in the fields of electrical, electronic, and polymer engineering, Polymer Composites for Electrical Engineering will also earn a place in the libraries of those working in the areas of composite materials, energy science and technology, and nanotechnology.
Author: Ayesha Kausar
Publisher: Elsevier
ISBN: 0443159092
Category : Science
Languages : en
Pages : 312
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Book Description
Polymer/Nanodiamond Nanocomposites: Fundamentals, Properties and Applications provides an up-to-date review of these materials. The structure, design, processing, and properties, as well as technological advancements, are all thoroughly discussed. Several practical and potential application areas are also identified such as tribological aerospace/automobile materials (thermally conducting, lubricant, and radiation shielding), coatings/anti-corrosion nanomaterials, shape memory nanocomposites, energy devices (Li ion batteries and solar cells), and biomedical nanomaterials (drug delivery, tissue engineering, biosensor, imaging). Current difficulties and potential opportunities are also discussed in detail. Polymer/Nanodiamond Nanocomposites: Fundamentals, Properties and Applications covers all aspects of these new novel materials' design, structure, manufacture, and applications. The book offers an up-to-date comprehensive knowledge resource for materials scientists, researchers, and engineers. - Covers the latest advances in polymer/nanodiamond nanocomposites - Includes important fundamentals, properties, and applications - Examines nanodiamond nanobifiller derived polymeric nanocomposites - Discusses a wide range of technical applications in aerospace, automobiles, coatings, corrosion resistance, shape memory, energy devices, and biomedical fields
Author: Sanjay Mavinkere Rangappa
Publisher: Elsevier
ISBN: 0443184631
Category : Technology & Engineering
Languages : en
Pages : 586
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Book Description
Additive Manufacturing Materials and Technologies discusses the recent developments and future possibilities in additive manufacturing. The book focuses on advanced technologies and materials, with chapters centered on shape memory materials, alloys and metals, polymers, ceramics, thermosets, biomaterials, and composites. Fiber-reinforced materials are covered as well, as are the life cycle and performance criteria of 3D printed materials. Other chapters look at the various applications of these materials and processing techniques, covering their use in the aerospace and automotive sectors, construction, bioengineering, and the pharmaceutical industry. Various additive manufacturing techniques such as electron beam melting, selective laser melting, laser sintered, fused deposition, and more are also studied. - Presents a comprehensive overview of recent advances in additive manufacturing technology and materials research and development - Outlines the processing methods, functionalization, mechanics, and applications of additive manufactured materials and technology - Summarizes lifecycles and performance parameters of 3D printed materials - Focuses on the types of shape memory materials and smart materials used in 3D printing in industrial applications and their applications
Author: Melih Cemal Kuşhan
Publisher: Springer Nature
ISBN: 3030918734
Category : Technology & Engineering
Languages : en
Pages : 423
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Book Description
This book offers a comprehensive look at materials science topics in aerospace, air vehicle structures and manufacturing methods for aerospace products, examining recent trends and new technological developments. Coverage includes additive manufacturing, advanced material removal operations, novel wing systems, design of landing gear, eco-friendly aero-engines, and light alloys, advanced polymers, composite materials and smart materials for structural components. Case studies and coverage of practical applications demonstrate how these technologies are being successfully deployed. Materials, Structures & Manufacturing for Aircraft will appeal to a broad readership in the aviation community, including students, engineers, scientists, and researchers, as a reference source for material science and modern production techniques.
