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Author: Shi-Yong Yang
Publisher: Elsevier
ISBN: 0128126418
Category : Technology & Engineering
Languages : en
Pages : 499
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Book Description
Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research. The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation. - Reviews the latest research, development and future prospective of polyimides - Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers - Presents a highly organized work that is composed of different sections that are easily compared
Author: Shi-Yong Yang
Publisher: Elsevier
ISBN: 0128126418
Category : Technology & Engineering
Languages : en
Pages : 499
Get Book Here
Book Description
Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research. The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation. - Reviews the latest research, development and future prospective of polyimides - Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers - Presents a highly organized work that is composed of different sections that are easily compared
Author: Beth Keser
Publisher: John Wiley & Sons
ISBN: 1119314135
Category : Technology & Engineering
Languages : en
Pages : 576
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Book Description
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
Author: Sombel Diaham
Publisher: BoD – Books on Demand
ISBN: 1838800972
Category : Technology & Engineering
Languages : en
Pages : 336
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Book Description
Polyimide is one of the most efficient polymers in many industries for its excellent thermal, electrical, mechanical, and chemical properties as well as its easy processability. In the electronic and electrical engineering industries, polyimide has widely been used for decades thanks to its very good dielectric and insulating properties at the high electric field and at high temperatures of around 200°C in long term-service. Moreover, polyimide appears essential for the development of new electronic devices where further considerations such as high power density, integration, higher temperature, thermal conduction management, energy storage, reliability, or flexibility are required in order to sustain the growing global electrical energy consumption. This book gathers interdisciplinary chapters on polyimide in various topics through state-of-the-art and original ongoing research.
Author: Kash L. Mittal
Publisher: CRC Press
ISBN: 9047415140
Category : Science
Languages : en
Pages : 582
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Book Description
This volume chronicles the proceedings of the Third International Symposium on Polyimides and Other High Temperature Polymers: Synthesis, Characterization, and Applications, held in Orlando, December 17-19, 2003.This volume is divided into three parts. Part 1. a Synthesis, Properties and Bulk Characterizationa ; Part 2 a Hybrids and Compositesa
Author: Marc Abadie
Publisher: BoD – Books on Demand
ISBN: 9535108999
Category : Science
Languages : en
Pages : 260
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Book Description
The feature of polyimides and other heterocyclic polymers are now well-established and used for long term temperature durability in the range of 250 - 350'C. This book will review synthesis, mechanisms, ultimate properties, physico-chemical properties, processing and applications of such high performance materials needed in advanced technologies. It presents interdisciplinary papers on the state of knowledge of each topic under consideration through a combination of overviews and original unpublished research. The volume contains eleven chapters divided into three sections: Chemistry; Chemical and Physical Properties; and Applications.
Author: Michio Inagaki
Publisher: Butterworth-Heinemann
ISBN: 0124078389
Category : Technology & Engineering
Languages : en
Pages : 449
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Book Description
Carbon materials are exceptionally diverse in their preparation, structure, texture, and applications. In Advanced Materials Science and Engineering of Carbon, noted carbon scientist Michio Inagaki and his coauthors cover the most recent advances in carbon materials, including new techniques and processes, carbon materials synthesis, and up-to-date descriptions of current carbon-based materials, trends and applications. Beginning with the synthesis and preparation of nanocarbons, carbon nanotubes, and graphenes, the book then reviews recently developed carbonization techniques, such as templating, electrospinning, foaming, stress graphitization, and the formation of glass-like carbon. The last third of the book is devoted to applications, featuring coverage of carbon materials for energy storage, electrochemical capacitors, lithium-ion rechargeable batteries, and adsorptive storage of hydrogen and methane for environmental protection, photocatalysis, spilled oil recovery, and nuclear applications of isotropic high-density graphite. - A progression from synthesis through modern carbonization techniques to applications gives you a thorough understanding of carbon materials - Covers a wide range of precursor materials, preparation techniques, and characteristics to inspire your own development of carbonization techniques, carbon materials and applications - Applications-oriented chapters include timely content on hot topics such as the engineering of carbon nanofibers and carbon materials for various energy-related applications
Author: Mariana-Dana Damaceanu
Publisher: Elsevier
ISBN: 032390677X
Category : Technology & Engineering
Languages : en
Pages : 410
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Book Description
Polyimides: Advances in Blends and Nanocomposites brings together the latest research in the area of polyimide-based blends and nanocomposites, opening the door to a range of cutting-edge applications. The book begins by discussing polyimide architectures, synthetic pathways, processing, properties, challenges and application potential before introducing polyimide-based blends and nanocomposites and explaining the modification of polyimide chains for high performance composites matrices. This is followed by chapters offering detailed, methodical coverage of each main type of blend and nanocomposite, covering preparation techniques, structures, properties and current and emerging applications.Throughout the book's chapters, there is an emphasis on methods for high-performance polyimide-based materials, with a constant orientation towards applications and additional in-depth coverage at the end of the book on three key application areas, gas separation, fuel cells, and biomedical applications. This is a valuable resource for researchers and advanced students across polymer science, composite science, nanotechnology, materials chemistry, biomaterials, and chemical engineering, as well as R&D professionals, scientists and engineers working with polyimide-based materials for advanced industrial applications. - Provides comprehensive coverage of the different types of polyimide blends and nanocomposites - Offers a systematic approach, covering synthesis, characterization, properties and applications - Guides the reader towards a range of state-of-the-art applications such as fuel cells and biomedical applications
Author: Ayesha Kausar
Publisher: Elsevier
ISBN: 0443159092
Category : Science
Languages : en
Pages : 312
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Book Description
Polymer/Nanodiamond Nanocomposites: Fundamentals, Properties and Applications provides an up-to-date review of these materials. The structure, design, processing, and properties, as well as technological advancements, are all thoroughly discussed. Several practical and potential application areas are also identified such as tribological aerospace/automobile materials (thermally conducting, lubricant, and radiation shielding), coatings/anti-corrosion nanomaterials, shape memory nanocomposites, energy devices (Li ion batteries and solar cells), and biomedical nanomaterials (drug delivery, tissue engineering, biosensor, imaging). Current difficulties and potential opportunities are also discussed in detail. Polymer/Nanodiamond Nanocomposites: Fundamentals, Properties and Applications covers all aspects of these new novel materials' design, structure, manufacture, and applications. The book offers an up-to-date comprehensive knowledge resource for materials scientists, researchers, and engineers. - Covers the latest advances in polymer/nanodiamond nanocomposites - Includes important fundamentals, properties, and applications - Examines nanodiamond nanobifiller derived polymeric nanocomposites - Discusses a wide range of technical applications in aerospace, automobiles, coatings, corrosion resistance, shape memory, energy devices, and biomedical fields
Author: Jun-Wei Zha
Publisher: John Wiley & Sons
ISBN: 3527351825
Category :
Languages : en
Pages : 405
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Book Description
Provides a complete overview of the state-of-the-art high temperature polymer dielectrics, with a focus on fundamental background and recent advances.
Author: Andreea Irina Barzic
Publisher: CRC Press
ISBN: 1000095355
Category : Science
Languages : en
Pages : 379
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Book Description
This book reviews the latest research, development, and future potential of polyimides and green polymer chemistry. It combines the major interdisciplinary research in this area. Polymers with imidic structure, known as polyimides, are widely investigated owing to their practical implications in numerous industrial sectors. The book explains why polyimides offer versatility unparalleled in comparison to most other classes of macromolecules. In addition, developments in green polymer chemistry in this area have been stimulated by health and environmental concerns, interest in sustainability, desire to decrease the dependence on petroleum, and opportunities to design and produce “green” products and processes. Major advances include new uses of green processing methodologies, and green polymeric products. Imidic Polymers and Green Polymer Chemistry: New Technology and Developments in Process and Product is targeted to scientists, engineers, and students who are involved or interested in green polymer chemistry and imidic polymers. This book will serve as a valuable reference for those with an interest in synthesis of polyimides and the chemistry and physical chemistry of polyimide compounds.
