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Author: Sina Ebnesajjad
Publisher: William Andrew
ISBN: 0323356028
Category : Technology & Engineering
Languages : en
Pages : 437
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Book Description
Covering a wide range of industrial applications across sectors including medical applications, automotive/aerospace, packaging, electronics, and consumer goods, this book provides a complete guide to the selection of adhesives, methods of use, industrial applications, and the fundamentals of adhesion. Dr Ebnesajjad examines the selection of adhesives and adhesion methods and challenges for all major groups of substrate including plastics (thermosets and thermoplastics), elastomers, metals, ceramics and composite materials. His practical guidance covers joint design and durability, application methods, test methods and troubleshooting techniques. The science and technology of adhesion, and the principles of adhesive bonding are explained in a way that enhances the reader's understanding of the fundamentals that underpin the successful use and design of adhesives. The third edition has been updated throughout to include recent developments in the industry, with new sections covering technological advances such as nanotechnology, micro adhesion systems, and the replacement of toxic chromate technology. Provides practitioners of adhesion technology with a complete guide to bonding materials successfully Covers the whole range of commonly used substrates including plastics, metals, elastomers and ceramics, explaining basic principles and describing common materials and application techniques Introduces the range of commercially available adhesives and the selection process alongside the science and technology of adhesion
Author: Sina Ebnesajjad
Publisher: William Andrew
ISBN: 0323356028
Category : Technology & Engineering
Languages : en
Pages : 437
Get Book Here
Book Description
Covering a wide range of industrial applications across sectors including medical applications, automotive/aerospace, packaging, electronics, and consumer goods, this book provides a complete guide to the selection of adhesives, methods of use, industrial applications, and the fundamentals of adhesion. Dr Ebnesajjad examines the selection of adhesives and adhesion methods and challenges for all major groups of substrate including plastics (thermosets and thermoplastics), elastomers, metals, ceramics and composite materials. His practical guidance covers joint design and durability, application methods, test methods and troubleshooting techniques. The science and technology of adhesion, and the principles of adhesive bonding are explained in a way that enhances the reader's understanding of the fundamentals that underpin the successful use and design of adhesives. The third edition has been updated throughout to include recent developments in the industry, with new sections covering technological advances such as nanotechnology, micro adhesion systems, and the replacement of toxic chromate technology. Provides practitioners of adhesion technology with a complete guide to bonding materials successfully Covers the whole range of commonly used substrates including plastics, metals, elastomers and ceramics, explaining basic principles and describing common materials and application techniques Introduces the range of commercially available adhesives and the selection process alongside the science and technology of adhesion
Author: Alphonsus V. Pocius
Publisher: Hanser Gardner Publications
ISBN: 9781569903193
Category : Technology & Engineering
Languages : en
Pages : 319
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Book Description
This book describes, in clear, understandable language, the three main disciplines of adhesion technology:
Author: M O Alam
Publisher: Elsevier
ISBN: 0857092898
Category : Technology & Engineering
Languages : en
Pages : 279
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Book Description
Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties.The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics.With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. - Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications - Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems - Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques
Author: Alphonsus V. Pocius
Publisher: Hanser Gardner Publications
ISBN: 9781569905111
Category : Technology & Engineering
Languages : en
Pages : 370
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Book Description
This book describes, in clear understandable language, the three main disciplines of adhesion technology: mechanics of the adhesive bond, chemistry of adhesives, and surface science. Some knowledge of physical and organic chemistry is assumed, but no familiarity with the science of adhesion is required. The emphasis is on understanding adhesion, how surfaces can be prepared and modified, and how adhesives can be formulated to perform a given task. Throughout the book, the author provides a broad view of the field, with a consistent style that leads the reader from one step to the next in gaining an understanding of the science.
Author: Sina Ebnesajjad
Publisher: William Andrew
ISBN: 1437744621
Category : Science
Languages : en
Pages : 449
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Book Description
Handbook of Adhesives and Surface Preparation provides a thoroughly practical survey of all aspects of adhesives technology from selection and surface preparation to industrial applications and health and environmental factors. The resulting handbook is a hard-working reference for a wide range of engineers and technicians working in the adhesives industry and a variety of industry sectors that make considerable use of adhesives. Particular attention is given to adhesives applications in the automotive, aerospace, medical, dental and electronics sectors. - A handbook that truly focuses on the applied aspects of adhesives selection and applications: this is a book that won't gather dust on the shelf - Provides practical techniques for rendering materials surfaces adherable - Sector-based studies explore the specific issues for automotive and aerospace, medical, dental and electronics
Author: James J. Licari
Publisher: William Andrew
ISBN: 1437778909
Category : Technology & Engineering
Languages : en
Pages : 415
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Book Description
Approx.512 pagesApprox.512 pages
Author: Eduardo Andre Sousa Marques
Publisher: John Wiley & Sons
ISBN: 3527830537
Category : Technology & Engineering
Languages : en
Pages : 272
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Book Description
Introduction to Adhesive Bonding A step-by-step introduction to basic principles and practical applications of adhesive bonding, designed for students and professionals alike Adhesive bonding—the process of joining two surfaces using glues, epoxies, plastic agents, and other adhesives—is a major technique with wide applications in industries as a diverse as aerospace, footwear manufacturing, and food packaging. Adhesive bonding holds several advantages over conventional joining techniques, such as uniform stress concentrations, protection of the bonded surfaces or joints, and the ability to join a variety of different materials and irregular surfaces. Introduction to Adhesive Bonding provides an accessible overview of the principles and common applications of adhesive bonding. Using a systematic approach, the authors thoroughly explain each step necessary to achieve a successful adhesive bond, including surface preparation, bonding agent selection, design and construction of bonded joints, health and safety considerations, and quality control. Readers are provided with both the theoretical foundation and practical information required to plan and complete their own adhesive bonding projects. This comprehensive yet reader-friendly volume: Highlights the inherent advantages of adhesive bonding in various applications Describes the use of adhesive bonding in the development of novel and advanced projects in different industries Features numerous real-world examples of adhesive bonding in areas such as the transportation industry, civil engineering, medical applications, and sports equipment Discusses how adhesives enable development of new products and constructions of reduced weight and size Identifies important limitations and durability concerns of the use of adhesives in specific applications Introduction to Adhesive Bonding is an ideal textbook for undergraduate or graduate Engineering and Chemistry programs, and a useful reference for researchers and industry professionals working in fields such as Engineering, Surface and Polymer Chemistry, and Materials Science.
Author: Istvan Benedek
Publisher: CRC Press
ISBN: 0824751140
Category : Technology & Engineering
Languages : en
Pages : 678
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Book Description
Pressure-Sensitive Adhesives and Applications, Second Edition explains how pressure-sensitive adhesives (PSAs) work, why they are used, and the technology used to manufacture them. This second edition features the latest developments in the field. Dr. Benedek discusses the factors that affect the rheology and special flow characteristics responsible for the adhesivity of liquid and solid PSAs. His book explores the viscoelastic behavior of PSAs, and compares them to plastics, rubbers, and polymers properties and examines the parameters that influence the conversion process of PSAs from the coating of carrier materials to the properties of the final laminate. The author covers adhesion/cohesion balance, time-temperature dependence of pressure sensitivity, chemical composition, coating properties, and coating processes affect the adhesive properties of PSA and their end products and how application-specific performance indices are used to determine the formulation and manufacture of raw materials. In addition, up-to-date coating machines, converting technology, and environmental considerations in the manufacture of PSA final products as well as industry-specific methods of testing for quality assurance and control are discussed. Pressure-Sensitive Adhesives and Applications, Second Edition combines the theoretical basis of pressure sensitivity with the practical aspects of manufacturing, testing, and use of PSAs. Readers are offered an exhaustive as well as comparative look at the engineering of plastics, adhesives, and pressure-sensitives, resulting in an indispensable, up-to-date reference for adhesive and polymer chemists and technologists.
Author: Anthony J. Kinloch
Publisher: Springer Science & Business Media
ISBN: 9401577641
Category : Technology & Engineering
Languages : en
Pages : 452
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Book Description
Over the last decade, or so, the growth in the use of adhesives, especially in ever more technically demanding applications, has been rapid and many major developments in the technology of adhesives have been reported. This growth has also led to attention being focused on somewhat more basic studies of the science of adhesion and adhesives, and in recent years our level of fundamental knowledge concerning the formation and mechanical performance of adhesive joints has increased dramatically. Such studies have, of course, been aided greatly by the development of the tools at the disposal of the investigators. For example, specific surface analytical techniques, such as X-ray photoelectron and secondary-ion mass spectroscopy, and the increasingly sophisticated methods of stress analysis and fracture mechanics have been put to good use in furthering our understanding of the science of adhesion and adhesives. The present book attempts to review the multidisciplined subject of adhesion and adhesives, considering both the science and technology involved in the formation and mechanical performance of adhesive joints. The author would like to thank his friends and colleagues for useful discus sions and help in the preparation of this book. I am particularly grateful to P. Cawley, J. Comyn, W. A. Lees, A. C. Roulin-Moloney, W. C. Wake, J. G. Williams and R. J. Young who have read and commented on various chapters and P. Farr for preparing the diagrams.
Author: Robert D. Adams
Publisher: Elsevier
ISBN: 1845690753
Category : Technology & Engineering
Languages : en
Pages : 560
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Book Description
This important collection reviews key research on adhesive behaviour and applications in sectors as diverse as construction and automotive engineering. The book is divided into three main parts: fundamentals, mechanical properties and applications. Part one focuses on the basic properties of adhesives, surface assessment and treatment. Part two concentrates on understanding how adhesives perform under stress and the factors affecting fatigue and failure. The final part of the book reviews industry specific applications in areas such as building and construction, transport and electrical engineering.With its distinguished editor and international team of contributors, Adhesive bonding is a standard reference for all those concerned with the industrial application of adhesives. - Essential information for all those concerned with the industrial application of adhesives - This important collection examines adhesives and adhesive bonding for load-bearing applications - Arranged in a user-friendly format with three main sections: fundamentals, generic uses and industry specific applications
