A Chip Off the Silicon Block PDF Download
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Author: Carol Latham
Publisher: Page Publishing Inc
ISBN: 1645848388
Category : Business & Economics
Languages : en
Pages : 192
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Book Description
Ever wonder why the success rate of start-up companies is so low? In this inspirational and informative book, Latham demonstrates how the power of sound entrepreneurial thinking can lead to positive results in the most daunting of circumstances. Latham's company, Thermagon Inc., evolved as an offshoot of the explosive growth of silicon chips driving the computer industry and the information age. As computers transitioned from large mainframes, filling whole airconditioned rooms to personal computers, such as desktops, notebooks, tablets, and smartphones, their functionality and speed were dramatically increasing. This phenomenon of miniaturization, combined with increased function and speed, caused overheating of the silicon chips, leading to widespread system failure. Hence, the evolution of the industry designed to manage the heat in electronic systems, of which Thermagon, became a worldwide leader. As a female, Latham defied all odds by successfully creating the products, the facilities, and the funding for a thriving and much sought-after company in the world of technology overwhelmingly dominated by men. Latham, by sharing her experiences in developing Thermagon and in assisting other start-up endeavors, intends to inspire budding entrepreneurs, working against all odds, by providing guidelines and principles for attaining success. The multitude of personal stories embracing her journey are sure to keep you entertained.
Author: Carol Latham
Publisher: Page Publishing Inc
ISBN: 1645848388
Category : Business & Economics
Languages : en
Pages : 192
Get Book Here
Book Description
Ever wonder why the success rate of start-up companies is so low? In this inspirational and informative book, Latham demonstrates how the power of sound entrepreneurial thinking can lead to positive results in the most daunting of circumstances. Latham's company, Thermagon Inc., evolved as an offshoot of the explosive growth of silicon chips driving the computer industry and the information age. As computers transitioned from large mainframes, filling whole airconditioned rooms to personal computers, such as desktops, notebooks, tablets, and smartphones, their functionality and speed were dramatically increasing. This phenomenon of miniaturization, combined with increased function and speed, caused overheating of the silicon chips, leading to widespread system failure. Hence, the evolution of the industry designed to manage the heat in electronic systems, of which Thermagon, became a worldwide leader. As a female, Latham defied all odds by successfully creating the products, the facilities, and the funding for a thriving and much sought-after company in the world of technology overwhelmingly dominated by men. Latham, by sharing her experiences in developing Thermagon and in assisting other start-up endeavors, intends to inspire budding entrepreneurs, working against all odds, by providing guidelines and principles for attaining success. The multitude of personal stories embracing her journey are sure to keep you entertained.
Author: T.R. Reid
Publisher: Random House
ISBN: 0307432033
Category : Biography & Autobiography
Languages : en
Pages : 322
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Book Description
Barely fifty years ago a computer was a gargantuan, vastly expensive thing that only a handful of scientists had ever seen. The world’s brightest engineers were stymied in their quest to make these machines small and affordable until the solution finally came from two ingenious young Americans. Jack Kilby and Robert Noyce hit upon the stunning discovery that would make possible the silicon microchip, a work that would ultimately earn Kilby the Nobel Prize for physics in 2000. In this completely revised and updated edition of The Chip, T.R. Reid tells the gripping adventure story of their invention and of its growth into a global information industry. This is the story of how the digital age began.
Author: Hermann Kopetz
Publisher: Springer Nature
ISBN: 3031119924
Category : Technology & Engineering
Languages : en
Pages : 411
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Book Description
"This book is a comprehensive text for the design of safety critical, hard real-time embedded systems. It offers a splendid example for the balanced, integrated treatment of systems and software engineering, helping readers tackle the hardest problems of advanced real-time system design, such as determinism, compositionality, timing and fault management. This book is an essential reading for advanced undergraduates and graduate students in a wide range of disciplines impacted by embedded computing and software. Its conceptual clarity, the style of explanations and the examples make the abstract concepts accessible for a wide audience." Janos Sztipanovits, Director E. Bronson Ingram Distinguished Professor of Engineering Institute for Software Integrated Systems Vanderbilt University Real-Time Systems focuses on hard real-time systems, which are computing systems that must meet their temporal specification in all anticipated load and fault scenarios. The book stresses the system aspects of distributed real-time applications, treating the issues of real-time, distribution and fault-tolerance from an integral point of view. A unique cross-fertilization of ideas and concepts between the academic and industrial worlds has led to the inclusion of many insightful examples from industry to explain the fundamental scientific concepts in a real-world setting. Compared to the Second Edition, new developments in communication standards for time-sensitive networks, such as TSN and Time-Triggered Ethernet are addressed. Furthermore, this edition includes a new chapter on real-time aspects in cloud and fog computing. The book is written as a standard textbook for a high-level undergraduate or graduate course on real-time embedded systems or cyber-physical systems. Its practical approach to solving real-time problems, along with numerous summary exercises, makes it an excellent choice for researchers and practitioners alike.
Author: Dongkai Shangguan
Publisher: CRC Press
ISBN: 1040028640
Category : Technology & Engineering
Languages : en
Pages : 463
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Book Description
In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.
Author: Pierre Bricaud
Publisher: Springer Science & Business Media
ISBN: 1461550378
Category : Technology & Engineering
Languages : en
Pages : 302
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Book Description
Silicon technology now allows us to build chips consisting of tens of millions of transistors. This technology not only promises new levels of system integration onto a single chip, but also presents significant challenges to the chip designer. As a result, many ASIC developers and silicon vendors are re-examining their design methodologies, searching for ways to make effective use of the huge numbers of gates now available. These designers see current design tools and methodologies as inadequate for developing million-gate ASICs from scratch. There is considerable pressure to keep design team size and design schedules constant even as design complexities grow. Tools are not providing the productivity gains required to keep pace with the increasing gate counts available from deep submicron technology. Design reuse - the use of pre-designed and pre-verified cores - is the most promising opportunity to bridge the gap between available gate-count and designer productivity. Reuse Methodology Manual for System-On-A-Chip Designs, Second Edition outlines an effective methodology for creating reusable designs for use in a System-on-a-Chip (SoC) design methodology. Silicon and tool technologies move so quickly that no single methodology can provide a permanent solution to this highly dynamic problem. Instead, this manual is an attempt to capture and incrementally improve on current best practices in the industry, and to give a coherent, integrated view of the design process. Reuse Methodology Manual for System-On-A-Chip Designs, Second Edition will be updated on a regular basis as a result of changing technology and improved insight into the problems of design reuse and its role in producing high-quality SoC designs.
Author: United States. Congress. House. Committee on Ways and Means. Subcommittee on Trade
Publisher:
ISBN:
Category : Government publications
Languages : en
Pages : 384
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Book Description
Author: Konstantin Moiseev
Publisher: Springer
ISBN: 1461408210
Category : Technology & Engineering
Languages : en
Pages : 245
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Book Description
This book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered in depth, and several design optimization problems are addressed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits.
Author: George Gilder
Publisher: Simon and Schuster
ISBN: 067170592X
Category : Science
Languages : en
Pages : 436
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Book Description
From Simon & Schuster, Microcosm is the provocative national bestseller by the author of Wealth and Poverty. George Gilder's Microcosm is the crystal ball of the next technological era. Leading scientists, engineers, and entrepreneurs provide vivid accounts of the latest inventions, revealing how the new international balance of power really lies in information technology.
Author: Eldon C. Hall
Publisher: AIAA
ISBN: 9781563471858
Category : Computers
Languages : en
Pages : 260
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Book Description
evolution of the Apollo Guidance Computer, Mr. Hall contends that the development of the Apollo computer supported and motivated the semiconductor industry during a time when integrated circuits were just emerging. This was the period just before the electronics revolution that gave birth to modern computers. In addition, the book recalls the history of computer technology, both hardware and software, and the applications of digital computing to missile guidance systems and manned spacecraft. The book also offers graphics and photos drawn from the Draper Laboratories archives that illustrate the technology and related events during the Apollo project. Written for experts as well as lay persons, Journey to the Moon is the first book of its kind and a must for anyone interested in the history of science and the relevance of computer technology to space exploration.
Author: Sami Franssila
Publisher: John Wiley & Sons
ISBN: 0470020563
Category : Technology & Engineering
Languages : en
Pages : 424
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Book Description
Microfabrication is the key technology behind integrated circuits,microsensors, photonic crystals, ink jet printers, solar cells andflat panel displays. Microsystems can be complex, but the basicmicrostructures and processes of microfabrication are fairlysimple. Introduction to Microfabrication shows how the commonmicrofabrication concepts can be applied over and over again tocreate devices with a wide variety of structures andfunctions. Featuring: * A comprehensive presentation of basic fabrication processes * An emphasis on materials and microstructures, rather than devicephysics * In-depth discussion on process integration showing how processes,materials and devices interact * A wealth of examples of both conceptual and real devices Introduction to Microfabrication includes 250 homework problems forstudents to familiarise themselves with micro-scale materials,dimensions, measurements, costs and scaling trends. Both researchand manufacturing topics are covered, with an emphasis on silicon,which is the workhorse of microfabrication. This book will serve as an excellent first text for electricalengineers, chemists, physicists and materials scientists who wishto learn about microstructures and microfabrication techniques,whether in MEMS, microelectronics or emerging applications.
