Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) PDF Download
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Author: Thiam Beng Lim
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 492
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Book Description
Topics covered by this title include: packaging materials; packaging trends; thermal design and modelling; solder joint metallurgy; process and reliability modelling; thermal characterization; materials characterization techniques; and assembly/manufacturing technologies.
Author: Thiam Beng Lim
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 492
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Book Description
Topics covered by this title include: packaging materials; packaging trends; thermal design and modelling; solder joint metallurgy; process and reliability modelling; thermal characterization; materials characterization techniques; and assembly/manufacturing technologies.
Author: Mahadevan K. Iyer
Publisher: IEEE Computer Society Press
ISBN: 9780780382053
Category : Technology & Engineering
Languages : en
Pages : 854
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Book Description
Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 656
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Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 825
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Book Description
Author:
Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages :
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Author:
Publisher:
ISBN: 9781665416191
Category :
Languages : en
Pages :
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Author:
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN: 9780780381681
Category : Electronic packaging
Languages : en
Pages : 517
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Author:
Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages : 627
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Author: International Conference on Electronic Packaging Technology
Publisher:
ISBN: 9780780381681
Category : Electronic packaging
Languages : en
Pages : 517
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Author: Electronic Packaging Technology Conference (2nd : 1998 : Singapore)
Publisher:
ISBN: 9780780351417
Category : Technology & Engineering
Languages : en
Pages : 361
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Book Description
