2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm). PDF Download
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Author:
Publisher:
ISBN: 9781728185392
Category :
Languages : en
Pages :
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Book Description
Author:
Publisher:
ISBN: 9781728185392
Category :
Languages : en
Pages :
Get Book Here
Book Description
Author: IEEE Staff
Publisher:
ISBN: 9781728185408
Category :
Languages : en
Pages :
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Book Description
The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems
Author: Leon Liebenberg
Publisher: John Wiley & Sons
ISBN: 111986948X
Category : Technology & Engineering
Languages : en
Pages : 725
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Book Description
ENERGY SYSTEMS Reimagine the future of energy production and use with this innovative and state-of-the-art guide This multidisciplinary and comprehensive text features an up-to-date summary of salient energy technologies for quick reference by students and practitioners of energy engineering. Uniquely, the book employs a guided self-study approach with theory provided in “bite-sized” chunks, several worked examples, quantitative and qualitative practice problems, 10 real-world mini-projects, and interviews with young energy innovators and engineering students. The book poses many big and pressing questions, asking the reader to “reimagine our future,” particularly with a focus on sustainable energy. These questions are aligned with characteristics of an entrepreneurial mindset, which are emphasized throughout the book. The book reviews the fundamentals of thermodynamics, fluid mechanics, and quantum mechanics. Chapters explore the full range of energy conversion technologies, including energy supply and demand, the science of global warming, interpretations of sustainability, chemical fuels, carbon capture and storage, internal and external combustion engines, vapor power and refrigeration plants, nuclear power, solar-electricity, solar-heat, fuel cells, wind energy, water energy, and energy storage. The book ends with a brief investigation into what we can do to decarbonize the transportation, industry, buildings, and electric power sectors. Energy Systems: A Project-Based Approach to Sustainability Thinking for Energy Conversion Systems offers an accessible overview of this important subject with an innovative, easy-to-use organization. Built to facilitate active learning and representing the latest research and industrial practice, Energy Systems provides readers with tools and information to evaluate energy systems and to reimagine potential energy solutions. Readers of Energy Systems will also find: Organization designed to blend seamlessly with a 14-week course schedule A balance of robust theoretical and industry-related knowledge and real-world examples throughout Teaching resources including mini-projects, practice problems, remedial appendices, and online study notes Energy Systems is ideal for students and instructors in courses relating to Energy Conversion Systems, Energy Science, Sustainable/Renewable Energy, and the interrelated Social, Technological, Economic, Environmental, and Political aspects. The book will also appeal to practitioners of energy engineering via the numerous state-of-the-art summaries and real-world problems.
Author: C.P. Wong
Publisher: Springer Science & Business Media
ISBN: 1441900403
Category : Technology & Engineering
Languages : en
Pages : 761
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Book Description
Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.
Author: Kim S. Siow
Publisher: Springer
ISBN: 3319992562
Category : Technology & Engineering
Languages : en
Pages : 292
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Book Description
This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
Author: Mikael Collan
Publisher: Palgrave Macmillan
ISBN: 9783030461027
Category : Business & Economics
Languages : en
Pages : 266
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Book Description
This open access book is among the first cross-disciplinary works about Manufacturing 4.0. It includes chapters about the technical, the economic, and the social aspects of this important phenomenon. Together the material presented allows the reader to develop a holistic picture of where the manufacturing industry and the parts of the society that depend on it may be going in the future. Manufacturing 4.0 is not only a technical change, nor is it a purely technically driven change, but it is a societal change that has the potential to disrupt the way societies are constructed both in the positive and in the negative. This book will be of interest to scholars researching manufacturing, technological innovation, innovation management and industry 4.0.
Author: Tae-Kyu Lee
Publisher: Springer
ISBN: 1461492661
Category : Technology & Engineering
Languages : en
Pages : 266
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Book Description
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
Author: Katsuaki Suganuma
Publisher: Woodhead Publishing
ISBN: 0081020953
Category : Technology & Engineering
Languages : en
Pages : 242
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Book Description
Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. - Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance - Provides the latest research on potential solutions, with an eye towards the end goal of system integration - Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates
Author: Bernardo Cockburn
Publisher: Springer Science & Business Media
ISBN: 3642597211
Category : Mathematics
Languages : en
Pages : 468
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Book Description
A class of finite element methods, the Discontinuous Galerkin Methods (DGM), has been under rapid development recently and has found its use very quickly in such diverse applications as aeroacoustics, semi-conductor device simula tion, turbomachinery, turbulent flows, materials processing, MHD and plasma simulations, and image processing. While there has been a lot of interest from mathematicians, physicists and engineers in DGM, only scattered information is available and there has been no prior effort in organizing and publishing the existing volume of knowledge on this subject. In May 24-26, 1999 we organized in Newport (Rhode Island, USA), the first international symposium on DGM with equal emphasis on the theory, numerical implementation, and applications. Eighteen invited speakers, lead ers in the field, and thirty-two contributors presented various aspects and addressed open issues on DGM. In this volume we include forty-nine papers presented in the Symposium as well as a survey paper written by the organiz ers. All papers were peer-reviewed. A summary of these papers is included in the survey paper, which also provides a historical perspective of the evolution of DGM and its relation to other numerical methods. We hope this volume will become a major reference in this topic. It is intended for students and researchers who work in theory and application of numerical solution of convection dominated partial differential equations. The papers were written with the assumption that the reader has some knowledge of classical finite elements and finite volume methods.
Author: James L. Sweeney
Publisher: Hoover Press
ISBN: 0817919562
Category : Business & Economics
Languages : en
Pages : 180
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Book Description
The entire world, especially the United States, is in the midst of an energy revolution. Since the oil embargo of 1973, individuals, corporations, and other organizations have found ways to economically reduce energy use. In this book, Jim Sweeney examines the energy policies and practices of the past forty years and their impact on three crucial systems: the economy, the environment, and national security. He shows how energy-efficiency contributions to the country's overall energy situation have been more powerful than all the increases in the domestic production of oil, gas, coal, geothermal energy, nuclear power, solar power, wind power, and biofuels. The author details the impact of new and improved energy-efficient technologies, the environmental and national security benefits of energy efficiency, ways to amplify energy efficiency, and more. Energy Efficiency: Building a Clean, Secure Economy reveals how the careful nurturing of private- and public-sector energy efficiency--along with public awareness, appropriate pricing, appropriate policies--and increased research and development, the trends of decreasing energy intensity and increasing energy efficiency can be beneficially accelerated.
