2018 7th Electronic System Integration Technology Conference (ESTC) PDF Download
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Author: IEEE Staff
Publisher:
ISBN: 9781538668153
Category :
Languages : en
Pages :
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Book Description
This international event brings together both academic as well as the industry leaders to discuss and debate about the state of art and future trends in electronics packaging and integration technologies
Author: IEEE Staff
Publisher:
ISBN: 9781538668153
Category :
Languages : en
Pages :
Get Book Here
Book Description
This international event brings together both academic as well as the industry leaders to discuss and debate about the state of art and future trends in electronics packaging and integration technologies
Author:
Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages :
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Book Description
Author: Electronic System-Integration Technology Conference
Publisher:
ISBN: 9781538668146
Category :
Languages : en
Pages :
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Book Description
Author: Nikita Voinov
Publisher: Springer Nature
ISBN: 981336632X
Category : Technology & Engineering
Languages : en
Pages : 541
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Book Description
This book provides a platform for academics and practitioners for sharing innovative results, approaches, developments, and research projects in computer science and information technology, focusing on the latest challenges in advanced computing and solutions introducing mathematical and engineering approaches. The book presents discussions in the area of advances and challenges of modern computer science, including telecommunications and signal processing, machine learning and artificial intelligence, intelligent control systems, modeling and simulation, data science and big data, data visualization and graphics systems, distributed, cloud and high-performance computing, and software engineering. The papers included are presented at TELECCON 2019 organized by Peter the Great St. Petersburg University during November 18–19, 2019.
Author: Vladimir Jordan
Publisher: Springer Nature
ISBN: 3030668959
Category : Computers
Languages : en
Pages : 241
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Book Description
This book constitutes selected revised and extended papers from the 10th International Conference on High-Performance Computing Systems and Technologies in Scientific Research, Automation of Control and Production, HPCST 2020, Barnaul, Russia, in May 2020. Due to the COVID-19 pancemic the conference was partly held in virtual mode. The 14 full papers presented in this volume were thoroughly reviewed and selected form 51 submissions. The papers are organized in topical sections on hardware for high-performance computing and its applications; information technologies and computer simulation of physical phenomena.
Author: Elena Velichko
Publisher: Springer Nature
ISBN: 3030811190
Category : Science
Languages : en
Pages : 594
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Book Description
This book presents peer-reviewed and selected papers of the International Youth Conference on Electronics, Telecommunications, and Information Technologies (YETI-2021), held in Peter the Great St. Petersburg Polytechnic University, St. Petersburg, on April 22–23, 2021. For the third time around, the conference brings together students and early career scientists, serving to disseminate the current trends and advances in electronics, telecommunications, optical, and information technologies. A series of workshops and poster sessions focusing, in particular, on the theoretical and practical challenges in nanotechnologies, photonics, signal processing, and telecommunications allow to establish contacts between potential partners, share new ideas, and start new collaborations. The conference is held in an online format, thus considerably expanding its geographical reach and offering an even wider scope of discussion.
Author: An Chen
Publisher: John Wiley & Sons
ISBN: 1119869587
Category : Technology & Engineering
Languages : en
Pages : 372
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Book Description
Advances in Semiconductor Technologies Discover the broad sweep of semiconductor technologies in this uniquely curated resource Semiconductor technologies and innovations have been the backbone of numerous different fields: electronics, online commerce, the information and communication industry, and the defense industry. For over fifty years, silicon technology and CMOS scaling have been the central focus and primary driver of innovation in the semiconductor industry. Traditional CMOS scaling has approached some fundamental limits, and as a result, the pace of scientific research and discovery for novel semiconductor technologies is increasing with a focus on novel materials, devices, designs, architectures, and computer paradigms. In particular, new computing paradigms and systems—such as quantum computing, artificial intelligence, and Internet of Things—have the potential to unlock unprecedented power and application space. Advances in Semiconductor Technologies provides a comprehensive overview of selected semiconductor technologies and the most up-to-date research topics, looking in particular at mainstream developments in current industry research and development, from emerging materials and devices, to new computing paradigms and applications. This full-coverage volume gives the reader valuable insights into state-of-the-art advances currently being fabricated, a wide range of novel applications currently under investigation, and a glance into the future with emerging technologies in development. Advances in Semiconductor Technologies readers will also find: A comprehensive approach that ensures a thorough understanding of state-of-the-art technologies currently being fabricated Treatments on all aspects of semiconductor technologies, including materials, devices, manufacturing, modeling, design, architecture, and applications Articles written by an impressive team of international academics and industry insiders that provide unique insights into a wide range of topics Advances in Semiconductor Technologies is a useful, time-saving reference for electrical engineers working in industry and research, who are looking to stay abreast of rapidly advancing developments in semiconductor electronics, as well as academics in the field and government policy advisors.
Author: Rajesh Singh
Publisher: CRC Press
ISBN: 1000404897
Category : Technology & Engineering
Languages : en
Pages : 636
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Book Description
ICICS-2020 is the third conference initiated by the School of Electronics and Electrical Engineering at Lovely Professional University that explored recent innovations of researchers working for the development of smart and green technologies in the fields of Energy, Electronics, Communications, Computers, and Control. ICICS provides innovators to identify new opportunities for the social and economic benefits of society. This conference bridges the gap between academics and R&D institutions, social visionaries, and experts from all strata of society to present their ongoing research activities and foster research relations between them. It provides opportunities for the exchange of new ideas, applications, and experiences in the field of smart technologies and finding global partners for future collaboration. The ICICS-2020 was conducted in two broad categories, Intelligent Circuits & Intelligent Systems and Emerging Technologies in Electrical Engineering.
Author: Chong Leong, Gan
Publisher: Springer Nature
ISBN: 3031267087
Category : Computers
Languages : en
Pages : 223
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Book Description
This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.
Author: Willem Dirk van Driel
Publisher: Springer Nature
ISBN: 3031593618
Category :
Languages : en
Pages : 405
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Book Description
