European Conference on Mask Technology for Integrated Circuits and Microcomponents PDF Download
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Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 246
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Book Description
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 246
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Book Description
Author: Uwe Behringer (Engineer.)
Publisher:
ISBN: 9783800725038
Category : Integrated circuits
Languages : en
Pages : 227
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Book Description
Author:
Publisher: Margret Schneider
ISBN: 3800728117
Category : Integrated circuits
Languages : en
Pages : 258
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Book Description
Author: Uwe Behringer
Publisher: Margret Schneider
ISBN: 3800728753
Category :
Languages : en
Pages : 301
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Book Description
Author: Anatoly A. Snigirev
Publisher: SPIE-International Society for Optical Engineering
ISBN:
Category : Science
Languages : en
Pages : 278
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Book Description
Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Author: Uwe F. W. Behringer
Publisher: Society of Photo Optical
ISBN: 9780819436146
Category : Electronic book
Languages : en
Pages : 252
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Book Description
Author: Andrea Chen
Publisher: CRC Press
ISBN: 1439862079
Category : Technology & Engineering
Languages : en
Pages : 216
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Book Description
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Author: Terry C. Edwards
Publisher: John Wiley & Sons
ISBN: 1118936175
Category : Technology & Engineering
Languages : en
Pages : 688
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Book Description
Building on the success of the previous three editions, Foundations for Microstrip Circuit Design offers extensive new, updated and revised material based upon the latest research. Strongly design-oriented, this fourth edition provides the reader with a fundamental understanding of this fast expanding field making it a definitive source for professional engineers and researchers and an indispensable reference for senior students in electronic engineering. Topics new to this edition: microwave substrates, multilayer transmission line structures, modern EM tools and techniques, microstrip and planar transmision line design, transmission line theory, substrates for planar transmission lines, Vias, wirebonds, 3D integrated interposer structures, computer-aided design, microstrip and power-dependent effects, circuit models, microwave network analysis, microstrip passive elements, and slotline design fundamentals.
Author: Sonia Ben Dhia
Publisher: Springer Science & Business Media
ISBN: 0387266011
Category : Technology & Engineering
Languages : en
Pages : 478
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Book Description
Electromagnetic Compatibility of Integrated Circuits: Techniques for Low Emission and Susceptibility focuses on the electromagnetic compatibility of integrated circuits. The basic concepts, theory, and an extensive historical review of integrated circuit emission and susceptibility are provided. Standardized measurement methods are detailed through various case studies. EMC models for the core, I/Os, supply network, and packaging are described with applications to conducted switching noise, signal integrity, near-field and radiated noise. Case studies from different companies and research laboratories are presented with in-depth descriptions of the ICs, test set-ups, and comparisons between measurements and simulations. Specific guidelines for achieving low emission and susceptibility derived from the experience of EMC experts are presented.
Author:
Publisher:
ISBN:
Category : Government reports announcements & index
Languages : en
Pages : 1236
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Book Description
